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Reliable unlatching mechanism utilizes preloading, a favorable geometric arrangement of mating surfaces, and redundancy to assure release. Even if only one rocking arm initially releases, the entire assembly will rotate or rock sideways to complete unlatching. Device could be useful in other applications requiring reliable remote disconnection of cables or pipes.
Hydrogen-assisted irradiation growth is an important issue for reliability and performance of nuclear materials in nuclear fuel cladding and fuel assembly components. The mechanisms of irradiation growth are not entirely clear and the role of hydrogen and hydrides are less so. There is evidence that breakaway irradiation growth is strongly influenced by the formation and dynamics of dislocation loops that vary with alloy composition, heat treatment and hydrogen content. Thermal annealing of eight Zircaloy-4 specimens irradiated in the Advanced Test Reactor (ATR) at the Idaho National Laboratory as part of the joint EPRI Nuclear Fuels Industry Research (NFIR) and Fuel Reliability Program (FRP) AsTeR irradiation growth study were performed by hot-stage transmission electron microscopy (TEM), differential scanning calorimetry (DSC), and dilatometry via NSUF RTE 17-1093. Two fluence levels (6.7 and 12.3 dpa) and three hydrogen contents (~10, 40, 120 ppm) were investigated. TEM with a hot stage was used for the quantification of "a" and "c" dislocation loop population densities and size distributions at a range of temperatures from 25 to 800oC. DSC and dilatometry were performed by dynamically heating and cooling from 30 to 750ºC at rates of 5, 10, and 20 oC/min to determine the behavior of dislocation loop annealing. Dynamic temperature DSC tests were able to detect the temperature ranges and enthalpies of "a" and "c" loop annihilation, hydride dissolution and precipitation, secondary particle precipitation, and a?a + ß phase transformations upon heating and cooling. Dilatometry tests showed that all of the test showed initial linear expansion followed by a decrease in expansion rate from about 400 to 600 ºC associated with annihilation of "a" and "c" loops and showed evidence for the thermal stabilizing effect of hydrogen on dislocation loops. The results are discussed in the context of the larger AsTeR program that will include higher exposure (~20 dpa) and different alloys when they become available in 2021.
We describe a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs. In cases where the entire volume for fabrication is less than five products, traditional Statistical Process Control (SPC) is inadequate due to reliance on statistics of much larger volumes and the Central Limit Theorem. Data acquisition for process parameter estimation from such a small sample size is difficult; however, it is critical to producing high reliability product.
A hollow cathode-based plasma contactor has been selected for use on the Space Station. During the operation of the plasma contactor, the hollow cathode heater will endure approximately 12000 thermal cycles. Since a hollow cathode heater failure would result in a plasma contactor failure, a hollow cathode heater development program was established to produce a reliable heater design. The development program includes the heater design, process documents for both heater fabrication and assembly, and heater testing. The heater design was a modification of a sheathed ion thruster cathode heater. Three heaters have been tested to date using direct current power supplies. Performance testing was conducted to determine input current and power requirements for achieving activation and ignition temperatures, single unit operational repeatability, and unit-to-unit operational repeatability. Comparisons of performance testing data at the ignition input current level for the three heaters show the unit-to-unit repeatability of input power and tube temperature near the cathode tip to be within 3.5 W and 44 degrees C, respectively. Cyclic testing was then conducted to evaluate reliability under thermal cycling. The first heater, although damaged during assembly, completed 5985 ignition cycles before failing. Two additional heaters were subsequently fabricated and have completed 3178 cycles to date in an on-going test.
Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)
Soldering technology has made tremendous strides in the past half-century. Whether structural or electronic, all solder joints must provide a level of reliability that is required by the application. This Part 1 report examines the effects of filler metal properties and soldering process on joint reliability. Solder alloy composition must have the appropriate melting and mechanical properties that suit the product's assembly process(es) and use environment. The filler metal must also optimize solderability (wetting-and-spreading) to realize the proper joint geometry. Here, the soldering process also affects joint reliability. The choice of flux and thermal profile support the solderability performance of the molten filler metal to successfully fill the gap and complete the fillet.
As the amount of used nuclear fuel continues to grow, more and more used nuclear fuel will be transferred to storage casks. A consolidated storage facility is currently in the planning stages for storing these casks, where at least 10,000 MTHM of fuel will be stored. This site will have potentially thousands of casks once it is operational. A facility this large presents new safeguards and nuclear material accounting concerns. A new signature based on the distribution of neutron sources and multiplication within casks was part of the Department of Energy Office of Nuclear Energy’s Material Protection, Account and Control Technologies (MPACT) campaign. Under this project we looked at fingerprinting each cask's neutron signature. Each cask has a unique set of fuel, with a unique spread of initial enrichment, burnup, cooling time, and power history. The unique set of fuel creates a unique signature of neutron intensity based on the arrangement of the assemblies. The unique arrangement of neutron sources and multiplication produces a reliable and unique identification of the cask that has been shown to be relatively constant over long time periods. The work presented here could be used to restore from a loss of continuity of knowledge at the storage site. This presentation will show the steps used to simulate and form this signature from the start of the effort through its conclusion in September 2016.
The efficient generation and delivery of ‘clean energy” through photovoltaic (PV) technology relies heavily on the cost, performance and reliability of solar panels, along with the individual components used in assembly of those panels. In order to continue towards the Department of Energy’s (DOE) goals of driving costs down, the lifetime of high-output power generation equipment (i.e. solar modules) must be extended to reduce costs associated with power output degradation and replacement of failed or degraded panels. One of the major sources of module failures in the past 30 years has been the failure of the solar panel backsheet. Failure of this component causes severe output losses due to oxidation and yellowing of the module while creating safety concerns as the major electrical insulation of the module is compromised. Tomark-Worthen LLC was formed in 2012 with the goal of designing and manufacturing novel PV backsheets and encapsulants that would be produced in the United States of America and exceed expectations of domestic and international module producers. These backsheets would improve upon known backsheet design failures (i.e. Isovoltaic’s AAA backsheet) and create domestic manufacturing jobs in the PV sector. This goal became a reality with a first-generation product in 2018 and now, with the support of the DOE, Tomark-Worthen has launched a second-generation product known as PhotoMark® Reflections™ 205-3 and 360-3. This 2+ year effort began in late 2017 with a screening of potential polymeric materials and backsheet structural designs. Performance evaluations of each material provided the necessary data needed to select the proper material combinations and move forward into the design of the manufacturing process. These decisions were made by teaming with a local university, well-respected government laboratories, and private research organizations who provided the tools necessary to predict long-term performance of these materials in much shorter periods of time. Once the go/no-go criteria were met at the mid-point of the project, the effort transitioned to predicting 30+ year performance, achieving certifications, and improving manufacturing efficiencies designed to lower costs in order to be competitive in a cost-driven market. Major project accomplishments include recognition of the new backsheet by Underwriters Laboratories (UL) and international certification for 1000V and 1500V modules by TUV Sud. Both 1000V and 1500V products have been proven on several module manufacturing lines and initial customer orders have been received by both domestic and international module producers. Accelerated exposure testing has shown that the performance of this backsheet exceeds the prior polyamide-based backsheet known to fail in the field. Cost-models and initial customer orders have shown the ability to produce this backsheet at a cost acceptable to many domestic manufacturers, while International costs for standard backsheet remains extremely low. Tomark-Worthen remains one of the only U.S. companies manufacturing backsheet domestically and this has drawn interest from many domestic module manufacturers looking to improve their material supply logistics by avoiding long lead times and custom’s headaches while avoiding current tariffs on Chinese-made components. Along with the launch of a new PV backsheet, this project has provided a critical deliverable to the PV R&D community. This deliverable is the knowledge that not all polyamide-containing backsheets are doomed to failure as the earlier versions did. There has been a fear amongst the PV community to consider these materials due to the failure of one design. This effort has brought a new level of interest to the scientific community as it has been shown that polyamides can be used successfully in a well-designed backsheet. As we move forward from this project, we are excited to see how backsheet technology and manufacturing in the U.S. will continue to progress and grow.
Plastic /polycarbonate/ insulator improves thermocouple reliability in test operations. The insulator is molded in half sections, assembled mechanically and eliminates electrical shorting.
Performance, reliability, and mission duration of Apollo RCS positive expulsion propellant tank assemblies
Reliability and availability characteristics of the DSN traveling wave maser (TWM) Assemblies are reported for the years 1981 through 1983, the charcteristics determined are: mean time between failures (MTBF) - 1200 hours; mean time to restore service (MTTRS) - 2.5 hours; and availability - 99.83%. The TWM MTBF is very good as compared to other DSN subsystems and assemblies. The TWM MTTRS is currently about three times as long as the average of other DSN subsystems. The dominant cause of TWM failures is contamination of the helium gas in the closed cycle refrigerators. Station configurations that do not provide TWM redundancy are subject to reception outages for long periods of time. Recommendations are made to improve the TWM Assembly availability characteristics for future mission support operations.
Many moving mechanical assemblies (MMA) for space mechanisms rely on liquid lubricants to provide reliable, long-term performance. The proper performance of the MMA is critical in assuring a successful mission. Historically, mission lifetimes were short and MMA duty cycles were minimal. As mission lifetimes were extended, other components, such as batteries and computers, failed before lubricated systems. However, improvements in these ancillary systems over the last decade have left the tribological systems of the MMAs as the limiting factor in determining spacecraft reliability. Typically, MMAs are initially lubricated with a very small charge that is supposed to last the entire mission lifetime, often well in excess of 5 years. In many cases, the premature failure of a lubricated component can result in mission failure.
A sequencer for a radar altimeter provides accurate attitude information for a reliable soft landing of the Mars Science Laboratory (MSL). This is a field-programmable- gate-array (FPGA)-only implementation. A table loaded externally into the FPGA controls timing, processing, and decision structures. Radar is memory-less and does not use previous acquisitions to assist in the current acquisition. All cycles complete in exactly 50 milliseconds, regardless of range or whether a target was found. A RAM (random access memory) within the FPGA holds instructions for up to 15 sets. For each set, timing is run, echoes are processed, and a comparison is made. If a target is seen, more detailed processing is run on that set. If no target is seen, the next set is tried. When all sets have been run, the FPGA terminates and waits for the next 50-millisecond event. This setup simplifies testing and improves reliability. A single vertex chip does the work of an entire assembly. Output products require minor processing to become range and velocity. This technology is the heart of the Terminal Descent Sensor, which is an integral part of the Entry Decent and Landing system for MSL. In addition, it is a strong candidate for manned landings on Mars or the Moon.
Next-generation high-temperature thermoelectric-power-generating devices will employ segmented architectures and will have to reliably withstand thermally induced mechanical stresses produced during component fabrication, device assembly, and operation. Thermoelectric materials have typically poor mechanical strength, exhibit brittle behavior, and possess a wide range of coefficient of thermal expansion (CTE) values. As a result, the direct bonding at elevated temperatures of these materials to each other to produce segmented leg components is difficult, and often results in localized microcracking at interfaces and mec hanical failure due to the stresses that arise from the CTE mismatch between the various materials. Even in the absence of full mechanical failure, degraded interfaces can lead to increased electrical and thermal resistances, which adversely impact conversion efficiency and power output. The proposed solution is the insertion of a mechanically compliant layer, with high electrical and thermal conductivity, between the low- and high-temperature segments to relieve thermomechanical stresses during device fabrication and operation. This composite material can be used as a stress-relieving layer between the thermoelectric segments and/or between a thermoelectric segment and a hot- or cold-side interconnect material. The material also can be used as a compliant hot shoe. Nickel-coated graphite powders were hot-pressed to form a nickel-graphite composite material. A freestanding thermoelectric segmented leg was fabricated by brazing the compliant pad layer between the high-temperature p- Zintl and low-temperature p-SKD TE segments using Cu-Ag braze foils. The segmented leg stack was heated in vacuum under a compressive load to achieve bonding. The novelty of the innovation is the use of composite material that re duces the thermomechanical stresses en - countered in the construction of high-efficiency, high-temperature therm - o-electric devices. The compliant pad enables the bonding of dissimilar thermoelectric materials while maintaining the desired electrical and thermal properties essential for efficient device operation. The modulus, CTE, electrical, and thermal conductances of the composite can be controlled by varying the ratio of nickel to graphite.
For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.
The gas metallicity of galaxies is often estimated using strong emission lines such as the optical lines of [O iii] and [O ii]. The most common measure is "R23," defined as ([O ii]λλ3726, 3729 + [O iii]λλ4959,5007)/Hβ. Most calibrations for these strong-line metallicity indicators are for continuum selected galaxies. We report a new empirical calibration of R23 for extreme emission-line galaxies using a large sample of about 800 star-forming green pea galaxies with reliable Te -based gas-phase metallicity measurements. This sample is assembled from Sloan Digital Sky Survey (SDSS) Data Release 13 with the equivalent width of the line [O iii]λ5007 > 300 Å or the equivalent width of the line Hβ > 100 Å in the redshift range 0.011 < z < 0.411. For galaxies with strong emission lines and large ionization parameter (which manifests as log [O iii]λλ4959,5007/[O ii]λλ3726,3729 ≥0.6), R23 monotonically increases with log(O/H) and the double-value degeneracy is broken. Our calibration provides metallicity estimates that are accurate to within ~0.14 dex in this regime. Many previous R23 calibrations are found to have bias and large scatter for extreme emission-line galaxies. We give formulae and plots to directly convert R23 and [O iii]λλ4959,5007/[O ii]λλ3726,3729 to log(O/H). Since green peas are best nearby analogs of high-redshift Lyα emitting galaxies, the new calibration offers a good way to estimate the metallicities of both extreme emission-line galaxies and high-redshift Lyα emitting galaxies. We also report on 15 galaxies with metallicities less than 1/12 solar, with the lowest metallicities being 12+log(O/H) = 7.25 and 7.26.
High energy density electron beam welding enabled the first and, to date, only American weld performed in space during the M551 experiment on Skylab in 1973. Though welding is critical to 90% of durable goods manufacturing in America, there is not yet regular and reliable application of welding processes to the In-space Servicing, Assembly, and Manufacturing (ISAM) sector. Fundamental studies are needed to develop basic capabilities and to enhance fundamental process knowledge, which will support follow-on efforts to mature in-space welding for use in commercial, defense, and other aerospace applications. The current work seeks to build on past flights and improve understanding and quantification of materials joining in space conditions using laser beam welding (LBW). LBW offers several advantages over the electron beam welding of Skylab, amongst others: reduced electromagnetic interference, less exposure of operators to ionizing radiation, and flexible delivery through optical fibers supporting unique workpieces and joints. Since there is no orbital laboratory to mature laser beam welding for space, the current effort addresses maturation of laser beam welding through parabolic flights augmented with data collection to enable numerical modeling efforts that capture the physical effects of the space environment. This team has retrofitted an LBW experimental apparatus that can simulate the vacuum and, during a parabolic flight, the reduced gravity & microgravity conditions of in-space welding. A team of Capstone students modified the setup, originally developed by NASA Langley Research Center for electron beam free-form fabrication, to replace its electron gun with a 1 kW, 1070 nm Yb fiber laser. The apparatus was further instrumented with temperature sensing and high-speed welding cameras to monitor and record changes in the thermal state of the workpiece, the melt pool, the laser penetration level, and the development and orientation of spatter & plumes. The system will operate autonomously, demonstrating its utility to uncrewed missions. During upcoming parabolic flight campaigns expected summer 2024, this LBW equipment will weld common aerospace alloys of aluminum, stainless steel, and titanium under conditions representative of the space environment. This data will guide future computational modeling efforts of laser welding in space and help to qualify in-space welding as a viable ISAM technique.
An investigation of the utilization of TRistructural- ISOtropic (TRISO)-coated fuel particles for the burning of plutonium/neptunium (Pu/Np) isotopes in typical Westinghouse four-loop pressurized water reactors is presented. Though numerous studies have evaluated the burning of transuranic isotopes in light water reactors (LWRs), this work differentiates itself by employing Pu/Np-loaded TRISO particles embedded within a silicon carbide (SiC) matrix and formed into pellets, constituting the fully ceramic microencapsulated (FCM) fuel concept that can be loaded into standard LWR fuel element cladding. This approach provides the capability of Pu/Np burning and, by virtue of the multibarrier TRISO particle design and SiC matrix properties, will allow for greater burnup of Pu/Np material, plus improved fuel reliability and thermal performance. In this study, a variety of heterogeneous assembly layouts, which utilize a mix of FCM rods and typical UO2 rods, and core loading patterns were analyzed to demonstrate the neutronic feasibility of Pu/Np-loaded TRISO fuel. The assembly and core designs herein reported are not fully optimized and require fine-tuning to flatten power peaks; however, the progress achieved thus far strongly supports the conclusion that with further rod/assembly/core loading and placement optimization, Pu/Np-loaded TRISO fuel and core designs that are capable of balancing Pu/Np production and destruction can be designed within the standard constraints for thermal and reactivity performance in pressurized water reactors.