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At least 325 records · Page 18

Fiber-Reinforced Epoxy Composites and Methods of Making Same Without the Use of Oven or Autoclave

Method embodiments for producing a fiber-reinforced epoxy composite comprise providing a mold defining a shape for a composite, applying a fiber reinforcement over the mold, covering the mold and fiber reinforcement thereon in a vacuum enclosure, performing a vacuum on the vacuum enclosure to produce a pressure gradient, insulating at least a portion of the vacuum enclosure with thermal insulation, infusing the fiber reinforcement with a reactive mixture of uncured epoxy resin and curing agent under vacuum conditions, wherein the reactive mixture of uncured epoxy resin and curing agent generates exothermic heat, and producing the fiber-reinforced epoxy composite having a glass transition temperature of at least about 100.degree. C. by curing the fiber reinforcement infused with the reactive mixture of uncured epoxy resin and curing agent by utilizing the exothermically generated heat, wherein the curing is conducted inside the thermally insulated vacuum enclosure without utilization of an external heat source or an external radiation source.

Barnell, Thomas J.↗

Reliable Bonding of Composite Laminates Using Reflowable Epoxy Resins

Epoxy matrix composites assembled with adhesives maximize the performance of aerospace structures, but the possibility of forming weak bonds requires the installation of redundant fasteners, which add weight and manufacturing cost. Co-cured joints (e.g. unitized composite structures) are immune to weak bonds because the uncured resin undergoes diffusion and mixing through the joint. A means of co-curing complex structures may reduce the need for redundant fasteners in bondlines. To this end, NASA started the AERoBOND project to develop novel joining materials to enable a “secondary-co-cure” assembly process. Aerospace epoxy resin systems reformulated with offset stoichiometry prevented the resin from advancing beyond the gel point during a conventional autoclave cure cycle up to 180 °C. The offset resins were applied to the joining surfaces of laminate preforms as prepreg. Two surfaces with complimentary offset resins were joined using conventional secondary bonding techniques. Preliminary efforts have indicated that the resulting joint has no discernable interface and appears as a conventional co-cured laminate under optical magnification. This report will discuss the initial work performed regarding formulation of the epoxy resin system using calorimetry, rheology, and mechanical testing.

Palmieri, Frank L.↗

Hierarchical Multiscale Process Modeling of A Textile Composite Y-Joint for the Aurora D8 Aircraft

Woven polymer matrix composites (PMCs) are widely used in aerospace applications for their favorable specific properties. However, the behavior of the inter- and intra-tow matrix during manufacturing of woven PMCs is difficult to isolate experimentally due to geometric and processing complexities. Classical closed-form homogenization approaches allow for composite thermos-chemo-mechanical properties to be characterized at any fiber volume fraction. In this work, virtual curing is applied to the inter- and intra-tow matrix materials of a plain weave repeating unit cell (RUC). Thermo-chemo-mechanical property evolution within the tows is calculated using the Concentric Cylinder Model (CCM) and the Rule of Mixtures (ROM). Curing is implemented through user-written subroutines within the commercial finite element method software Abaqus. Virtual curing results are compared with those from a linear-elastic thermal cool down simulation in Abaqus. Results indicate that tow property evolution during curing has a non-negligible effect on the final stress state.

curing↗

Quantitation of buried contamination by use of solvents

An investigation was made to determine (1) sporicidal properties of amine solvents that solubilize silicon resins, (2) recovery properties of a silicon potting compound (RTV 41) used in spacecraft, and (3) viability of spores during chemical curing of the potting compound. Results show that: (1) spores do remain viable during RTV 41 silicon potting chemical curing, and (2) spore recovery from cured silicon potting compound RTV 41 is very high when silicon rubber is dissolved in butylamine and series dilution with benzene prior to plate curing.

Pappas, S. P.↗

Imide modified epoxy matrix resins

High char yield epoxy using novel bisimide amines (BIA's) as curing agents with a state of the art epoxy resin was developed. Stoichiometric quantities of the epoxy resin and the BIA's were studied to determine the cure cycle required for preparation of resin specimens. The bisimide cured epoxies were designated IME's (imide modified epoxy). The physical, thermal and mechanical properties of these novel resins were determined. The levels of moisture absorption exhibited by the bisimide amine cured expoxies (IME's) were considerably lower than the state of the art epoxies. The strain-to-failure of the control resin system was improved 25% by replacement of DDS with 6F-DDS. Each BIA containing resin exhibited twice the char yield of the control resin MY 720/DDS. Graphite fiber reinforced control (C) and IME resins were fabricated and characterized. Two of the composite systems showed superior properties compared to the other Celion 6000/IME composite systems and state of the art graphite epoxy systems. The two systems exhibited excellent wet shear and flexural strengths and moduli at 300 and 350 F.

Scola, D. A.↗

Ultrasonic and mechanical characterizations of fatigue states of graphite epoxy composite laminates

Eight-ply (0, + or - 45, 0)s laminates of Hercules AS/3501-6 graphite epoxy composite are fabricated using various cure pressures ranging from 0.52 to 0.86 MPa and cure temperatures ranging from 150 C to 200 C. In general, the minimum composite void volume fraction is obtained at a cure temperature of 175 C and a cure pressure of 0.86 MPa, or at 200 C and 0.86 MPa. The ultrasonic attenuation at 4 MHz was found to correlate with the composite void volume fraction. Composite specimens were tested in flexural fatigue. Beyond 10,000 fatigue cycles, the ultrasonic attenuation at 4 MHz was found to increase and the flexural stiffness was found to decrease. The ultrasonic attenuation at 4 MHz of the as-fabricated composite can be correlated with the number of fatigue cycles to failure.

Williams, J. H., Jr.↗

V-378A: A modified bismaleimide for advanced composites

Addition polyimides cure with no evolution of gaseous by-products at relatively low temperatures and may be cured at low pressures to yield composites with excellent hot-wet strength retention. These properaties have made them excellent candidates as matrix resins for advanced composites. However, commercially available bismaleimides are solids and difficult to handle in preimpregnated form. V-378A is an addition polyimide composed of a mixture of bismaleimides and other reactive ingredients formulated to provide good prepreg properties and handling, facile cure and excellent composite mechanical properties. Several curing mechanisms are utilized to provide the characteristics exhibited by V-378A. Part of the mechanism is free radial and takes place at ambient temperature and above. Other mechanisms are principally Diels-Alder in nature. V-378A prepregs are tacky at ambient temperature, but do not have long tacky outlife similar to some epoxies. V-378A yields composites which exhibit hot-wet strength retention which is superior to that provided by epoxy resin systems.

Street, S. W.↗

Adhesive joint evaluation by ultrasonic interface and lamb waves

Some results on the application of interface and Lamb waves for the study of curing of thin adhesive layers were summarized. In the case of thick substrates (thickness much more than the wave length) the interface waves can be used. In this case the experimental data can be inverted and the shear modulus of the adhesive film may be explicitly found based on the measured interface wave velocity. It is shown that interface waves can be used for the study of curing of structural adhesives as a function of different temperatures and other experimental conditions. The kinetics of curing was studied. In the case of thin substrates the wave phenomena are much more complicated. It is shown that for successful measurements proper selection of experimental conditions is very important. This can be done based on theoretical estimations. For correctly selected experimental conditions the Lamb waves may be a sensitive probe of adhesive bond quality and may be used or cure monitoring.

Rokhlin, S. I.↗

Differences in interfacial bond strengths of graphite fiber-epoxy resin composites

The effect of epoxy-size and degree of cure on the interfacial bonding of an epoxy-amine-graphite fiber composite system is examined. The role of the fiber-resin interface in determining the overall mechanical properties of composites is poorly understood. A good interfacial adhesive bond is required to achieve maximum stress transfer to the fibers in composites, but at the same time some form of energy absorbing interfacial interaction is needed to achieve high fracture toughening. The incompatibility of these two processes makes it important to understand the nature and basic factors involved at the fiber-resin interface as stress is applied. The mechanical properties including interlaminar shear values for graphite fiber-resin composites are low compared to glass and boron-resin composites. These differences have been attributed to poor fiber-matrix adhesion. Graphite fibers are commonly subjected to post-treatments including application of organic sizing in order to improve their compatibility with the resin matrix and to protect the fiber tow from damage during processing and lay-up. In such processes, sized graphite fiber tow is impregnated with epoxy resin and then layed-up i nto the appropriate configuration. Following an extended ambient temperature cure, the graphite-resin composite structure is cured at elevated temperature using a programmed temperature sequence to cure and then cool the product.

Needles, H. L.↗

Dynamic dielectric analysis - A means for process control

The development of dynamic dielectric analysis techniques (as a 'smart' sensor for quantitative NDE) and of intelligent closed-loop cure systems is reported. The cure process of both BF3:R-catalyzed and uncatalyzed tetraglycidyl-4,4'-diaminodiphenyl methane (TGDDM)/diamine epoxy resins was studied. Measurements were made over a frequency range of six decades. The resin was monitored continuously throughout the cure process as it changed from a viscous liquid to a highly crosslinked solid. From the frequency dependence of the dielectric loss, the specific conductivity has been determined and shown to directly monitor the viscosity before the gel point is reached. Dielectric master plots of the cure process, analogous to time-temperature superposition plots for rheological data, have been developed.

Kranbuehl, D.↗

A study of thermal transitions in a new semicrystalline thermoplastic polyimide

A polyimide derive from 4,4'-isophthaloyl diphthalic anhydride (IDPA) and 1,3-bis (4-aminophenoxy 4'-benzoyl) benzene (1,3-BABB) having semicrystalline behavior was prepared and characterized by differential scanning calorimetry (DSC) and wide angle X-ray scattering (WAXS). Thus a poly(amic acid) film cured in air for one hour each at 100 and 200 C displayed an endotherm at 286 C, followed by a crystallization exotherm at 317 C, and a second melting transition at 350 C. The 286 C melting point appeared to result from earlier solvent-induced crystallization. Films cast from DMAc, air dried, and soaked in methylene chloride could not be induced into semicrystallinity. The fully cured polyimide has a Tg of 216 C. Films heated to temperatures as high as 100 C for one hour in air were transparent and light yellow in color. Those films heated to or above 125 C were translucent. Polarized light microscopy revealed the presence of spherulites 608 micrometers in diameter in a sample cured to 275 C in air. Two film samples, one cured to 275 and the other to 325 C, were evaluated for tensile and ultimate strength, modulus, and percent elongation at 25 and 200 C. These values remained essentially constant at each test temperature.

Pratt, J. Richard↗

Interpenetrating polymer networks from acetylene terminated materials

As part of a program to develop high temperature/high performance structural resins for aerospace applications, the chemistry and properties of a novel class of interpenetrating polymer networks (IPNs) were investigated. These IPNs consist of a simple diacetylenic compound (aspartimide) blended with an acetylene terminated arylene ether oligomer. Various compositional blends were prepared and thermally cured to evaluate the effect of crosslink density on resin properties. The cured IPNs exhibited glass transition temperatures ranging from 197 to 254 C depending upon the composition and cure temperature. The solvent resistance, fracture toughness and coefficient of thermal expansion of the cured blends were related to the crosslink density. Isothermal aging of neat resin moldings, adhesive and composite specimens showed a postcure effect which resulted in improved elevated temperature properties. The chemistry, physical and mechanical properties of these materials will be discussed.

Connell, J. W.↗

Quantitative NDE applied to composites and metals

Research at the NASA/Langley Research Center concerning quantitative NDE of composites and metals is reviewed. The relationship between ultrasonics and polymer cure is outlined. NDE models are presented, which can be used to develop measurement technologies for characterizing the curing of a polymer system for composite materials. The models can be used to determine the glass transition temperature, the degree of cure, and the cure rate. The application of the model to control autoclave processing of composite materials is noted. Consideration is given to the use of thermal diffusion models combined with controlled thermal input measurements to determine the thermal diffusivity of materials. Also, a two-dimensional physical model is described that permits delaminations in samples of Space Shuttle Solid Rocket Motors to be detected in thermograms in the presence of cooling effects and uneven heating.

Heyman, Joseph S.↗

On-line in-situ control of the resin transfer molding process

Resin transfer molding of three-dimensionally stitched fabrics promises to be a cost effective process for obtaining composite parts of exceptional strength. The technique eliminates many problems involving prepreg preparation, storage and layup. It replaces, on the other hand, the single step cure process with a two-stage impregnation and cure process. Of particular importance therefore is selecting and controlling the viscosity during impregnation and cure. The use of in-situ frequency-dependent electromagnetic sensors and the Loos-Springer model for selecting and controllng the processing properties of the resin transfer molding resin during impregnation and cure are discussed.

Kranbuehl, D.↗

Characterization of and sensor-model verification and control of the properties of PMR-13 during processing

This study presents an in situ sensor and a process-simulation model developed for monitoring and controlling the cure process of PMR-15. The time-temperature dependence of the buildup in the molecular network structure, extent of reaction, viscosity, flow, and consolidation during the cure of PMR-15 are discussed. The relationship of the time-temperature cycle used during imidization to the length of the endcapped chains formed is examined. The relationship of the time-temperature cure-processing cycle to the reaction kinetics, viscosity, flow, and consolidation during crosslinking is analyzed using frequency-dependent electromagnetic sensors and the Loos processing model. Application of the FDEMS sensing technique and the process-simulation model for quality assurance processing and automated on-line control of cure is discussed.

Kranbuehl, D.↗

Conductivity As A Measure Of Degree Of Polymerization

In improved method of dielectric monitoring of process of polymerization of mixed ingredients of polymeric material, emphasis placed on measurement of conductivity rather than permittivity. Conductivity tends to change more during curing process than permittivity does, is less dependent on frequency, and more-sensitive and more-reliable indicator of progress of cure. Conductivity used to compute quantity called "ion viscosity," which relates to classical viscosity of fluid. During cure of typical polymer, ion viscosity varies over wide range, eventually rising to plateau toward end of cure.

Dean, David L.↗

Infiltration/cure modeling of resin transfer molded composite materials using advanced fiber architectures

A model was developed which can be used to simulate infiltration and cure of textile composites by resin transfer molding. Fabric preforms were resin infiltrated and cured using model generated optimized one-step infiltration/cure protocols. Frequency dependent electromagnetic sensing (FDEMS) was used to monitor in situ resin infiltration and cure during processing. FDEMS measurements of infiltration time, resin viscosity, and resin degree of cure agreed well with values predicted by the simulation model. Textile composites fabricated using a one-step infiltration/cure procedure were uniformly resin impregnated and void free. Fiber volume fraction measurements by the resin digestion method compared well with values predicted using the model.

Loos, Alfred C.↗

Intelligent sensor-model automated control of PMR-15 autoclave processing

An intelligent sensor model system has been built and used for automated control of the PMR-15 cure process in the autoclave. The system uses frequency-dependent FM sensing (FDEMS), the Loos processing model, and the Air Force QPAL intelligent software shell. The Loos model is used to predict and optimize the cure process including the time-temperature dependence of the extent of reaction, flow, and part consolidation. The FDEMS sensing system in turn monitors, in situ, the removal of solvent, changes in the viscosity, reaction advancement and cure completion in the mold continuously throughout the processing cycle. The sensor information is compared with the optimum processing conditions from the model. The QPAL composite cure control system allows comparison of the sensor monitoring with the model predictions to be broken down into a series of discrete steps and provides a language for making decisions on what to do next regarding time-temperature and pressure.

Hart, S.↗