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All sourcesNASA NTRSDOE OSTI
NASA NTRS2011

Dust-tolerant electrical connector

A connector assembly includes releasably mateable plug and receptacle units. At least one socket is enclosed within the receptacle unit and is aligned with at least one permeable membrane disposed in the front end of the receptacle unit. The plug unit includes a body slidably mounted within a longitudinal bore therein. At least one pin extends from the front end of the body and is aligned with at least one permeable membrane disposed in the front end of the plug unit. The plug unit is biased toward a first, de-mate position in which the body is extended rearwardly such that the pin is enclosed with the plug unit and is slidable to a second, mate position in which the body is compressed forwardly such that the pin projects through the permeable membranes of the plug and receptacle units to electrically connect with the socket.

Sadick, Shazad↗
NASA NTRS2004

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗
NASA NTRS2004

Fabrication of Robust, Flat, Thinned, UV-Imaging CCDs

An improved process that includes a high-temperature bonding subprocess has been developed to enable the fabrication of robust, flat, silicon-based charge-coupled devices (CCDs) for imaging in ultraviolet (UV) light and/or for detecting low-energy charged particles. The CCDs in question are devices on which CCD circuitry has already been formed and have been thinned for backsurface illumination. These CCDs may be delta doped, and aspects of this type of CCD have been described in several prior articles in NASA Tech Briefs. Unlike prior low-temperature bonding subprocesses based on the use of epoxies or waxes, the high-temperature bonding subprocess is compatible with the deltadoping process as well as with other CCD-fabrication processes. The present improved process and its bonding, thinning, and delta-doping subprocesses, are characterized as postfabrication processes because they are undertaken after the fabrication of CCD circuitry on the front side of a full-thickness silicon substrate. In a typical case, it is necessary to reduce the thickness of the CCD to between 10 and 20 m in order to take advantage of back-side illumination and in order to perform delta doping and/or other back-side treatment to enhance the quantum efficiency. In the prior approach to the fabrication of back-side-illuminated CCDs, the thinning subprocess turned each CCD into a free-standing membrane that was fragile and tended to become wrinkled. In the present improved process, prior to thinning and delta doping, a CCD is bonded on its front side to a silicon substrate that has been prefabricated to include cutouts to accommodate subsequent electrical connections to bonding pads on the CCD circuitry. The substrate provides structural support to increase ruggedness and maintain flatness. At the beginning of this process, the back side of a CCD as fabricated on a full-thickness substrate is polished. Silicon nitride is deposited on the back side, opposite the bonding pads on the front side, in order to define a relatively thick frame. The portion of the CCD not covered by the frame is the portion to be thinned by etching.

Grunthaner, Paula↗
NASA NTRS2004

Electrically Small Microstrip Quarter-Wave Monopole Antennas

Microstrip-patch-style antennas that generate monopole radiation patterns similar to those of quarter-wave whip antennas can be designed to have dimensions smaller than those needed heretofore for this purpose, by taking advantage of a feed configuration different from the conventional one. The large sizes necessitated by the conventional feed configuration have, until now, made such antennas impractical for frequencies below about 800 MHz: for example, at 200 MHz, the conventional feed configuration necessitates a patch diameter of about 8 ft (.2.4 m) . too large, for example, for mounting on the roof of an automobile or on a small or medium-size aircraft. By making it possible to reduce diameters to between a tenth and a third of that necessitated by the conventional feed configuration, the modified configuration makes it possible to install such antennas in places where they could not previously be installed and thereby helps to realize the potential advantages (concealment and/or reduction of aerodynamic drag) of microstrip versus whip antennas. In both the conventional approach and the innovative approach, a microstrip-patch (or microstrip-patch-style) antenna for generating a monopole radiation pattern includes an electrically conductive patch or plate separated from an electrically conductive ground plane by a layer of electrically insulating material. In the conventional approach, the electrically insulating layer is typically a printed-circuit board about 1/16 in. (.1.6 mm) thick. Ordinarily, a coaxial cable from a transmitter, receiver, or transceiver is attached at the center on the ground-plane side, the shield of the cable being electrically connected to the ground plane. In the conventional approach, the coaxial cable is mated with a connector mounted on the ground plane. The center pin of this connector connects to the center of the coaxial cable and passes through a hole in the ground plane and a small hole in the insulating layer and then connects with the patch above one-third of the radial distance from the center. The modified feed configuration of the innovative approach is an inductive-short-circuit configuration that provides impedance matching and that has been used for many years on other antennas but not on microstrip-style monopole antennas. In this configuration, the pin is connected to both the conductive patch and the ground plane. As before, the shield of the coaxial cable is connected to the ground plane, but now the central conductor is connected to a point on the pin between the ground plane and the conductive plate (see figure). The location of the connection point on the pin is chosen so that together, the inductive short circuit and the conductive plate or patch act as components of a lumped-element resonant circuit that radiates efficiently at the resonance frequency and, at the resonance frequency, has an impedance that matches that of the coaxial cable. It should be noted that the innovative design entails two significant disadvantages. One disadvantage is that the frequency bandwidth for efficient operation is only about 1/20 to 1/15 that of a whip antenna designed for the same nominal frequency. The other disadvantage is that the estimated gain is between 3-1/2 and 4-1/2 dB below that of the whip antenna. However, if an affected radio-communication system used only a few adjacent frequency channels and the design of the components of the system other than the antenna provided adequate power or gain margin, then these disadvantages could be overcome.

Young, W. Robert↗
NASA NTRS2004

Photodiode-Based, Passive Ultraviolet Dosimeters

Simple, passive instruments have been developed for measuring the exposure of material specimens to vacuum ultraviolet (VUV) radiation from the Sun. Each instrument contains a silicon photodiode and a coulometer. The photocharge generated in the photodiode is stored in the coulometer. The accumulated electric charge measured by use of the coulometer is assumed to be proportional to the cumulative dose of VUV radiation expressed in such convenient units as equivalent Sun hours (ESH) [defined as the number of hours of exposure to sunlight at normal incidence]. Intended originally for use aboard spacecraft, these instruments could also be adapted to such terrestrial uses as monitoring the curing of ultraviolet-curable epoxies. Each instrument includes a photodiode and a coulometer assembly mounted on an interface plate (see figure). The photodiode assembly includes an aluminum housing that holds the photodiode, a poly(tetrafluoroehylene) cosine receptor, and a narrow-band optical filter. The cosine receptor ensures that the angular response of the instrument approximates the ideal angular response (proportional to the cosine of the angle of incidence). The filter is chosen to pass the ultraviolet wavelength of interest in a specific experiment. The photodiode is electrically connected to the coulometer. The factor of proportionality between the charge stored in the coulometer and ultraviolet dosage (in units of ESH) is established, prior to use, in calibration experiments that involve the use of lamps and current sources traceable to the National Institute of Standards and Technology.

Vaughn, Jason A.↗
NASA NTRS2003

120-GHz HEMT Oscillator With Surface-Wave-Assisted Antenna

Two monolithic microwave integrated circuits (MMICs) have been designed and built to function together as a source of electromagnetic radiation at a frequency of 120 GHz. One of the MMICs is an oscillator and is the highest-power 120-GHz oscillator reported thus far in the literature. The other MMIC is an end-fire antenna that radiates the oscillator signal. Although these MMICs were constructed as separate units and electrically connected with wire bonds, future oscillator/ antenna combinations could readily be fabricated as monolithic integrated units. Such units could be used as relatively high-power solid-state microwave sources in diverse applications that include automotive radar, imaging, scientific instrumentation, communications, and radio astronomy. As such, these units would be attractive alternatives to vacuum-tube oscillators, which are still used to obtain acceptably high power in the frequency range of interest. The oscillator (see figure) includes a high-electron-mobility transistor (HEMT), with gate-periphery dimensions of 4 by 37 m, in a common-source configuration. The series feedback element of the oscillator is a grounded coplanar waveguide (CPW) at the source. The HEMT is biased for class-A operation (meaning that current is conducted throughout the oscillation cycle) to maximize the output power of the oscillator. Input and output impedance-matching circuit elements are designed to maximize output power and to establish the conditions needed for oscillation. The design of the antenna takes advantage of surface waves, which, heretofore, have been regarded as highly disadvantageous because they can leak power and degrade the performances of antennas that have not been designed to exploit them. Measures taken to suppress surface waves have included complex machining of circuit substrates and addition of separate substrates. These measures are difficult to implement in standard MMIC fabrication processes. In contrast, because the design of the present antenna eliminates the need to suppress surface waves, the fabrication of the antenna is fully compatible with standard MMIC fabrication processes.

Samoska, Lorene↗
NASA NTRS2003

Nanoscale Hot-Wire Probes for Boundary-Layer Flows

Hot-wire probes having dimensions of the order of nanometers have been proposed for measuring temperatures (and possibly velocities) in boundary-layer flows at spatial resolutions much finer and distances from walls much smaller than have been possible heretofore. The achievable resolutions and minimum distances are expected to be of the order of tens of nanometers much less than a typical mean free path of a molecule and much less than the thickness of a typical flow boundary layer in air at standard temperature and pressure. An additional benefit of the small scale of these probes is that they would perturb the measured flows less than do larger probes. The hot-wire components of the probes would likely be made from semiconducting carbon nanotubes or ropes of such nanotubes. According to one design concept, a probe would comprise a single nanotube or rope of nanotubes laid out on the surface of an insulating substrate between two metallic wires. According to another design concept, a nanotube or rope of nanotubes would be electrically connected and held a short distance away from the substrate surface by stringing it between two metal electrodes. According to a third concept, a semiconducting nanotube or rope of nanotubes would be strung between the tips of two protruding electrodes made of fully conducting nanotubes or ropes of nanotubes. The figure depicts an array of such probes that could be used to gather data at several distances from a wall. It will be necessary to develop techniques for fabricating the probes. It will also be necessary to determine whether the probes will be strong enough to withstand the aerodynamic forces and impacts of micron-sized particles entrained in typical flows of interest.

Tedjojuwono, Ken T.↗
NASA NTRS2011

High-Speed Isolation Board for Flight Hardware Testing

There is a need to provide a portable and cost-effective galvanic isolation between ground support equipment and flight hardware such that any unforeseen voltage differential between ground and power supplies is eliminated. An interface board was designed for use between the ground support equipment and the flight hardware that electrically isolates all input and output signals and faithfully reproduces them on each side of the interface. It utilizes highly integrated multi-channel isolating devices to minimize size and reduce assembly time. This single-board solution provides appropriate connector hardware and breakout of required flight signals to individual connectors as needed for various ground support equipment. The board utilizes multi-channel integrated circuits that contain transformer coupling, thereby allowing input and output signals to be isolated from one another while still providing high-fidelity reproduction of the signal up to 90 MHz. The board also takes in a single-voltage power supply input from the ground support equipment and in turn provides a transformer-derived isolated voltage supply to power the portion of the circuitry that is electrically connected to the flight hardware. Prior designs used expensive opto-isolated couplers that were required for each signal to isolate and were time-consuming to assemble. In addition, these earlier designs were bulky and required a 2U rack-mount enclosure. The new design is smaller than a piece of 8.5 ~11-in. (.22 ~28-mm) paper and can be easily hand-carried where needed. The flight hardware in question is based on a lineage of existing software-defined radios (SDRs) that utilize a common interface connector with many similar input-output signals present. There are currently four to five variations of this SDR, and more upcoming versions are planned based on the more recent design.

Yamamoto, Clifford K.↗
NASA NTRS2012

Iridium Interfacial Stack - IrIS

Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.

Spry, David↗
NASA NTRS2012

Method and apparatus for calibrating multi-axis load cells in a dexterous robot

A robotic system includes a dexterous robot having robotic joints, angle sensors adapted for measuring joint angles at a corresponding one of the joints, load cells for measuring a set of strain values imparted to a corresponding one of the load cells during a predetermined pose of the robot, and a host machine. The host machine is electrically connected to the load cells and angle sensors, and receives the joint angle values and strain values during the predetermined pose. The robot presses together mating pairs of load cells to form the poses. The host machine executes an algorithm to process the joint angles and strain values, and from the set of all calibration matrices that minimize error in force balance equations, selects the set of calibration matrices that is closest in a value to a pre-specified value. A method for calibrating the load cells via the algorithm is also provided.

Wampler, II, Charles W.↗
NASA NTRS2012

Fabrication of Compact Superconducting Lowpass Filters for Ultrasensitive Detectors

It is extremely important for current and future far-infrared and sub-millimeter ultrasensitive detectors, which include transition edge sensors (TES) and microwave kinetic inductance detectors, to be adequately filtered from stray electromagnetic radiation in order to achieve their optimal performance. One means of filtering stray radiation is to block leakage associated with electrical connections in the detector environment. Here we discuss a fabrication methodology for realizing non-dissipative planar filters imbedded in the wall of the detector enclosure to limit wave propagation modes up to far-infrared frequencies. Our methodology consists of fabricating a boxed stripline transmission line, in which a superconducting (Nb, Mo, or Al) transmission line is encased in a silicon dioxide dielectric insulator coated with a metallic shell. We report on achieved attenuation and return loss and find that it replicates the simulated data to a high degree.

Brown, Ari↗
NASA NTRS2012

RESOLVE Project

The RESOLVE project is a lunar prospecting mission whose primary goal is to characterize water and other volatiles in lunar regolith. The Lunar Advanced Volatiles Analysis (LAVA) subsystem is comprised of a fluid subsystem that transports flow to the gas chromatograph- mass spectrometer (GC-MS) instruments that characterize volatiles and the Water Droplet Demonstration (WDD) that will capture and display water condensation in the gas stream. The LAVA Engineering Test Unit (ETU) is undergoing risk reduction testing this summer and fall within a vacuum chamber to understand and characterize C!Jmponent and integrated system performance. Ray will be assisting with component testing of line heaters, printed circuit heaters, pressure transducers, temperature sensors, regulators, and valves in atmospheric and vacuum environments. He will be developing procedures to guide these tests and test reports to analyze and draw conclusions from the data. In addition, he will gain experience with preparing a vacuum chamber with fluid and electrical connections. Further testing will include integrated testing of the fluid subsystem with the gas supply system, near-infrared spectrometer, WDD, Sample Delivery System, and GC-MS in the vacuum chamber. This testing will provide hands-on exposure to a flight forward spaceflight subsystem, the processes associated with testing equipment in a vacuum chamber, and experience working in a laboratory setting. Examples of specific analysis Ray will conduct include: pneumatic analysis to calculate the WOO's efficiency at extracting water vapor from the gas stream to form condensation; thermal analysis of the conduction and radiation along a line connecting two thermal masses; and proportional-integral-derivative (PID) heater control analysis. In this Research and Technology environment, Ray will be asked to problem solve real-time as issues arise. Since LAVA is a scientific subsystem, Ray will be utilizing his chemical engineering background to operate the near-infrared spectrometer and GC-MS instruments during ETU testing. Ray will be working with Modified Commercial off the Shelf (MCOTS) instruments and characterizing their analytical behavior for optimization. Ray will be offered the opportunity to suggest testing modifications or configuration changes at any time to improve the experimental effectiveness. He will gain many skills needed for working in a technical team setting requiring flexibility and critical thinking.

Parker, Ray O.↗
NASA NTRS2013

RESOLVE Project

The RESOLVE project is a lunar prospecting mission whose primary goal is to characterize water and other volatiles in lunar regolith. The Lunar Advanced Volatiles Analysis (LAVA) subsystem is comprised of a fluid subsystem that transports flow to the gas chromatograph - mass spectrometer (GC-MS) instruments that characterize volatiles and the Water Droplet Demonstration (WDD) that will capture and display water condensation in the gas stream. The LAVA Engineering Test Unit (ETU) is undergoing risk reduction testing this summer and fall within a vacuum chamber to understand and characterize component and integrated system performance. Testing of line heaters, printed circuit heaters, pressure transducers, temperature sensors, regulators, and valves in atmospheric and vacuum environments was done. Test procedures were developed to guide experimental tests and test reports to analyze and draw conclusions from the data. In addition, knowledge and experience was gained with preparing a vacuum chamber with fluid and electrical connections. Further testing will include integrated testing of the fluid subsystem with the gas supply system, near-infrared spectrometer, WDD, Sample Delivery System, and GC-MS in the vacuum chamber. This testing will provide hands-on exposure to a flight forward spaceflight subsystem, the processes associated with testing equipment in a vacuum chamber, and experience working in a laboratory setting. Examples of specific analysis conducted include: pneumatic analysis to calculate the WDD's efficiency at extracting water vapor from the gas stream to form condensation; thermal analysis of the conduction and radiation along a line connecting two thermal masses; and proportional-integral-derivative (PID) heater control analysis. Since LAVA is a scientific subsystem, the near-infrared spectrometer and GC-MS instruments will be tested during the ETU testing phase.

Parker, Ray↗
NASA NTRS2014

SPHERES Facility

Synchronized Position Hold, Engage, Reorient, Experimental Satellites (SPHERES) are bowling-ball sized satellites that provide a test bed for development and research into multi-body formation flying, multi-spacecraft control algorithms, and free-flying physical and material science investigations. Up to three self-contained free-flying satellites can fly within the cabin of the International Space Station (ISS), performing flight formations, testing of control algorithms or as a platform for investigations requiring this unique free-flying test environment. Each satellite is a self-contained unit with power, propulsion, computers, navigation equipment, and provides physical and electrical connections (via standardized expansion ports) for Principal Investigator (PI) provided hardware and sensors.

Material science investigations↗
NASA NTRS2013

Workspace Safe Operation of a Force- or Impedance-Controlled Robot

A method of controlling a robotic manipulator of a force- or impedance-controlled robot within an unstructured workspace includes imposing a saturation limit on a static force applied by the manipulator to its surrounding environment, and may include determining a contact force between the manipulator and an object in the unstructured workspace, and executing a dynamic reflex when the contact force exceeds a threshold to thereby alleviate an inertial impulse not addressed by the saturation limited static force. The method may include calculating a required reflex torque to be imparted by a joint actuator to a robotic joint. A robotic system includes a robotic manipulator having an unstructured workspace and a controller that is electrically connected to the manipulator, and which controls the manipulator using force- or impedance-based commands. The controller, which is also disclosed herein, automatically imposes the saturation limit and may execute the dynamic reflex noted above.

Abdallah, Muhammad E.↗
NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗
NASA NTRS2015

RESOLVE (Regolith & Environmental Science Oxygen & Lunar Volatile Extraction) Project

The RESOLVE Project is a lunar prospecting mission whose primary goal is to characterize water and other volatiles in lunar regolith. The Lunar Advanced Volatiles Analysis (LAVA) subsystem is comprised of a fluid subsystem that transports flow to the gas chromatograph - mass spectrometer (GC-MS) instruments that characterize volatiles and the Water Droplet Demonstration (WDD) that will capture and display water condensation in the gas stream. The LAVA Engineering Test Unit (ETU) is undergoing risk reduction testing this summer and fall within a vacuum chamber to understand and characterize component and integrated system performance. Testing of line heaters, printed circuit heaters, pressure transducers, temperature sensors, regulators, and valves in atmospheric and vacuum environments was done. Test procedures were developed to guide experimental tests and test reports to analyze and draw conclusions from the data. In addition, knowledge and experience was gained with preparing a vacuum chamber with fluid and electrical connections. Further testing will include integrated testing of the fluid subsystem with the gas supply system, near-infrared spectrometer for the Surge Tank (NIRST), WDD, Sample Delivery System, and GC-MS in the vacuum chamber. Since LAVA is a scientific subsystem, the near infrared spectrometer and GC-MS instruments will be tested during the ETU testing phase.

LAVA↗
NASA NTRS2013

Superconducting Metallic Glass Transition-Edge-Sensors

A superconducting metallic glass transition-edge sensor (MGTES) and a method for fabricating the MGTES are provided. A single-layer superconducting amorphous metal alloy is deposited on a substrate. The single-layer superconducting amorphous metal alloy is an absorber for the MGTES and is electrically connected to a circuit configured for readout and biasing to sense electromagnetic radiation.

Hays, Charles C.↗