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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18

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NASA NTRS1990

An Ada Linear-Algebra Software Package Modeled After HAL/S

New avionics software written more easily. Software package extends Ada programming language to include linear-algebra capabilities similar to those of HAL/S programming language. Designed for such avionics applications as Space Station flight software. In addition to built-in functions of HAL/S, package incorporates quaternion functions used in Space Shuttle and Galileo projects and routines from LINPAK solving systems of equations involving general square matrices. Contains two generic programs: one for floating-point computations and one for integer computations. Written on IBM/AT personal computer running under PC DOS, v.3.1.

Klumpp, Allan R.↗

NASA NTRS1989

Launch packaging options for the PV power module cargo element

NASA recently embarked on the Space Station Freedom program, which will utilize the Shuttle Orbiter for transportation to orbit. Each flight is unique in terms of the hardware that is manifested and the method by which it is integrated to form viable cargo elements. Various constraints determine the packaging options for the three PV power module combined assemblies. Several packaging options for the PV power module cargo element are presented. These options are discussed in terms of their impact on the overall flight hardware manifest as determined by the various constraints.

Hoberecht, Mark A.↗

NASA NTRS1991

General-Purpose Ada Software Packages

Collection of subprograms brings to Ada many features from other programming languages. All generic packages designed to be easily instantiated for types declared in user's facility. Most packages have widespread applicability, although some oriented for avionics applications. All designed to facilitate writing new software in Ada. Written on IBM/AT personal computer running under PC DOS, v.3.1.

Klumpp, Allan R.↗

NASA NTRS1991

Ada Namelist Package

Ada Namelist Package, developed for Ada programming language, enables calling program to read and write FORTRAN-style namelist files. Features are: handling of any combination of types defined by user; ability to read vectors, matrices, and slices of vectors and matrices; handling of mismatches between variables in namelist file and those in programmed list of namelist variables; and ability to avoid searching entire input file for each variable. Principle benefits derived by user: ability to read and write namelist-readable files, ability to detect most file errors in initialization phase, and organization keeping number of instantiated units to few packages rather than to many subprograms.

Klumpp, Allan R.↗

NASA NTRS1991

Adjustable Support For Instrument Package

Strong, lightweight structure designed to support instrument package. Provides choice of attachment locations to accommodate variety of sizes and shapes. Composed of seven webbed metal parts. Honeycomb panels cover vertical sides of structure. Instrumentation package, such as telescope or infrared sensor, bolted to top of structure. Accompanying electronics boxes mounted on inside surfaces of panels. Weight of instrumentation carried in direct paths through webbed members to base plate. Structure used for submillimeter-wave astronomy satellite.

Sneiderman, Gary↗

NASA NTRS1990

Long duration exposure facility solar illumination data package

A post flight solar illumination data package was created by the LDEF thermal analysis data group in support of the LDEF science office data group. The data presented was prepared with the Thermal Radiation Analysis System (TRASYS) program. Ground tracking data was used to calculate daily orbital beta angles for the calculation of resultant fluxes. This data package will be useful in calculation of solar illumination fluent for a variety of beta angle orbital conditions encountered during the LDEF mission.

Berrios, William M.↗

NASA NTRS1992

Overview of environmental test plans for Space Station Freedom work package 4

The generation and distribution of electric power for Space Station Freedom (SSF) is critical to the station's success. Work Package 4 (WP-04) has the responsibility for the design, development, test, and delivery of the Electric Power System (EPS) for the SSF. During launch, assembly, and operation, the EPS will be subjected to various environments. A test and verification approach has been developed to assure that the EPS will function in these environments. An overview of that test program is presented with emphasis on environmental testing of hardware. Two key areas of the test program are highlighted in the overview. One area is the verification of the Solar Power Module (SPM) and associated cargo element hardware. This area includes detailing the plans for development and qualification testing of the SPM hardware. One series of tests, including modal and acoustic, has been completed on a development cargo element. Another area highlighted is the acceptance testing of high-power Orbital Replacement Units (ORU). The environmental test equipment plans are presented and reviewed in light of an aggressive production rate, which delivers ORU's to the WP-04 and other Space Station Work Packages. Through implementing the test program as outlined, the EPS hardware will be certified for flight and operation on the Space Station Freedom.

Peterson, Tom J.↗

NASA NTRS1993

Packaging, deployment, and panel design concepts for a truss-stiffened 7-panel precision deployable reflector with feed boom

A concept is presented for achieving a remotely deployable truss-stiffened reflector consisting of seven integrated sandwich panels that form the reflective surface, and an integrated feed boom. The concept has potential for meeting aperture size and surface precision requirements for some high-frequency microwave remote sensing applications. The packaged reflector/feed boom configuration is a self-contained unit that can be conveniently attached to a spacecraft bus. The package has a cylindrical envelope compatible with typical launch vehicle shrouds. Dynamic behavior of a deployed configuration having a 216-inch focal length and consisting of 80-inch-diameter, two-inch-thick panels is examined through finite-element analysis. Results show that the feed boom and spacecraft bus can have a large impact on the fundamental frequency of the deployed configuration. Two candidate rib-stiffened sandwich panel configurations for this application are described, and analytical results for panel mass and stiffness are presented. Results show that the addition of only a few rib stiffeners, if sufficiently deep, can efficiently improve sandwich panel stiffness.

Heard, Walter L., Jr.↗

NASA NTRS1992

A neural network prototyping package within IRAF

We outline our plans for incorporating a Neural Network Prototyping Package into the IRAF environment. The package we are developing will allow the user to choose between different types of networks and to specify the details of the particular architecture chosen. Neural networks consist of a highly interconnected set of simple processing units. The strengths of the connections between units are determined by weights which are adaptively set as the network 'learns'. In some cases, learning can be a separate phase of the user cycle of the network while in other cases the network learns continuously. Neural networks have been found to be very useful in pattern recognition and image processing applications. They can form very general 'decision boundaries' to differentiate between objects in pattern space and they can be used for associative recall of patterns based on partial cures and for adaptive filtering. We discuss the different architectures we plan to use and give examples of what they can do.

Bazell, D.↗

NASA NTRS1992

The IRAF radial velocity analysis package

The IRAF Radial Velocity Analysis package is described and future plans are presented. A discussion of the current strengths and weaknesses of the package is given along with an analysis of the accuracies that can be expected for a given data set. An overview of the cross-correlation task is presented along with atypical examples of it's use. Future plans for new tasks and algorithms are also described.

Fitzpatrick, M.↗

NASA NTRS1992

Development of the FITS tools package for multiple software environments

The HEASARC is developing a package of general purpose software for analyzing data files in FITS format. This paper describes the design philosophy which makes the software both machine-independent (it runs on VAXs, Suns, and DEC-stations) and software environment-independent. Currently the software can be compiled and linked to produce IRAF tasks, or alternatively, the same source code can be used to generate stand-alone tasks using one of two implementations of a user-parameter interface library. The machine independence of the software is achieved by writing the source code in ANSI standard Fortran or C, using the machine-independent FITSIO subroutine interface for all data file I/O, and using a standard user-parameter subroutine interface for all user I/O. The latter interface is based on the Fortran IRAF Parameter File interface developed at STScI. The IRAF tasks are built by linking to the IRAF implementation of this parameter interface library. Two other implementations of this parameter interface library, which have no IRAF dependencies, are now available which can be used to generate stand-alone executable tasks. These stand-alone tasks can simply be executed from the machine operating system prompt either by supplying all the task parameters on the command line or by entering the task name after which the user will be prompted for any required parameters. A first release of this FTOOLS package is now publicly available. The currently available tasks are described, along with instructions on how to obtain a copy of the software.

Pence, W. D.↗

NASA NTRS1992

The IRAF Fabry-Perot analysis package: Ring fitting

As introduced at ADASSI, a Fabry-Perot analysis package for IRAF is currently under development as a joint effort of ourselves and Frank Valdes of the IRAF group. Although additional portions of the package were also implemented, we report primarily on the development of a robust ring fitting task, useful for fitting the calibration rings obtained in Fabry-Perot observations. The general equation of an ellipse is fit to the shape of the rings, providing information on ring center, ellipticity, and position angle. Such parameters provide valuable information on the wavelength response of the etalon and the geometric stability of the system. Appropriate statistical weighting is applied to the pixels to account for increasing numbers with radius, the Lorentzian cross-section, and uneven illumination. The major problems of incomplete, non-uniform, and multiple rings are addressed with the final task capable of fitting rings regardless of center, cross-section, or completion. The task requires only minimal user intervention, allowing large numbers of rings to be fit in an extremely automated manner.

Shopbell, P. L.↗

NASA NTRS1991

A portable X-band front-end test package for beam-waveguide antenna performance evaluation. Part 2: Tests on the antenna

Results are given for an X-band (8.45 GHz) test package for testing the new 34-m beam-waveguide antenna at Goldstone in an 'on-the-antenna' configuration. Included are X-band zenith noise temperature values and tipping-curve data obtained at the Cassegrain focal point F1 as well as at the pedestal room focal point F3. Subreflector Z-defocus test results for both F1 and F3 are also presented. The X-band test package operated well in all of the different test configurations and exceeded expected performance.

Otoshi, T. Y.↗

NASA NTRS1995

JTEC Panel report on electronic manufacturing and packaging in Japan

Kelly, Michael J.↗

NASA NTRS1995

Japan's electronic packaging technologies

The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

Tummala, Rao R.↗

NASA NTRS1994

Closing the loop on improvement: Packaging experience in the Software Engineering Laboratory

As part of its award-winning software process improvement program, the Software Engineering Laboratory (SEL) has developed an effective method for packaging organizational best practices based on real project experience into useful handbooks and training courses. This paper shares the SEL's experience over the past 12 years creating and updating software process handbooks and training courses. It provides cost models and guidelines for successful experience packaging derived from SEL experience.

Waligora, Sharon R.↗

NASA NTRS1990

Integrating Commercial Off-The-Shelf (COTS) graphics and extended memory packages with CLIPS

This paper addresses the question of how to mix CLIPS with graphics and how to overcome PC's memory limitations by using the extended memory available in the computer. By adding graphics and extended memory capabilities, CLIPS can be converted into a complete and powerful system development tool, on the other most economical and popular computer platform. New models of PCs have amazing processing capabilities and graphic resolutions that cannot be ignored and should be used to the fullest of their resources. CLIPS is a powerful expert system development tool, but it cannot be complete without the support of a graphics package needed to create user interfaces and general purpose graphics, or without enough memory to handle large knowledge bases. Now, a well known limitation on the PC's is the usage of real memory which limits CLIPS to use only 640 Kb of real memory, but now that problem can be solved by developing a version of CLIPS that uses extended memory. The user has access of up to 16 MB of memory on 80286 based computers and, practically, all the available memory (4 GB) on computers that use the 80386 processor. So if we give CLIPS a self-configuring graphics package that will automatically detect the graphics hardware and pointing device present in the computer, and we add the availability of the extended memory that exists in the computer (with no special hardware needed), the user will be able to create more powerful systems at a fraction of the cost and on the most popular, portable, and economic platform available such as the PC platform.

Callegari, Andres C.↗

NASA NTRS1995

Electronic manufacturing and packaging in Japan

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

Kelly, Michael J.↗