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NASA NTRS2010

NASA Electronic Parts and Packaging (NEPP) Program - Update

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

LaBel, Kenneth A.↗

NASA NTRS2008

HEMT Amplifiers and Equipment for their On-Wafer Testing

Power amplifiers comprising InP-based high-electron-mobility transistors (HEMTs) in coplanar-waveguide (CPW) circuits designed for operation at frequencies of hundreds of gigahertz, and a test set for onwafer measurement of their power levels have been developed. These amplifiers utilize an advanced 35-nm HEMT monolithic microwave integrated-circuit (MMIC) technology and have potential utility as local-oscillator drivers and power sources in future submillimeter-wavelength heterodyne receivers and imaging systems. The test set can reduce development time by enabling rapid output power characterization, not only of these and similar amplifiers, but also of other coplanar-waveguide power circuits, without the necessity of packaging the circuits.

Fung, King man↗

NASA NTRS2006

Three-Function Logic Gate Controlled by Analog Voltage

The figure is a schematic diagram of a complementary metal oxide/semiconductor (CMOS) electronic circuit that performs one of three different logic functions, depending on the level of an externally applied control voltage, V(sub sel). Specifically, the circuit acts as A NAND gate at V(sub sel) = 0.0 V, A wire (the output equals one of the inputs) at V(sub sel) = 1.0 V, or An AND gate at V(sub sel) = -1.8 V. [The nominal power-supply potential (VDD) and logic "1" potential of this circuit is 1.8 V.] Like other multifunctional circuits described in several prior NASA Tech Briefs articles, this circuit was synthesized following an automated evolutionary approach that is so named because it is modeled partly after the repetitive trial-and-error process of biological evolution. An evolved circuit can be tested by computational simulation and/or tested in real hardware, and the results of the test can provide guidance for refining the design through further iteration. The evolutionary synthesis of electronic circuits can now be implemented by means of a software package Genetic Algorithms for Circuit Synthesis (GACS) that was developed specifically for this purpose. GACS was used to synthesize the present trifunctional circuit. As in the cases of other multifunctional circuits described in several prior NASA Tech Briefs articles, the multiple functionality of this circuit, the use of a single control voltage to select the function, and the automated evolutionary approach to synthesis all contribute synergistically to a combination of features that are potentially advantageous for the further development of robust, multiple-function logic circuits, including, especially, field-programmable gate arrays (FPGAs). These advantages include the following: This circuit contains only 9 transistors about half the number of transistors that would be needed to obtain equivalent NAND/wire/AND functionality by use of components from a standard digital design library. If multifunctional gates like this circuit were used in the place of the configurable logic blocks of present commercial FPGAs, it would be possible to change the functions of the resulting digital systems within shorter times. For example, by changing a single control voltage, one could change the function of thousands of FPGA cells within nanoseconds. In contrast, typically, the reconfiguration in a conventional FPGA by use of bits downloaded from look-up tables via a digital bus takes microseconds.

Zebulum, Ricardo↗

NASA NTRS2017

Fusion-Enabled Pluto Orbiter and Lander

The Pluto orbiter mission proposed here is credible and exciting. The benefits to this and all outer-planet and interstellar-probe missions are difficult to overstate. The enabling technology, Direct Fusion Drive, is a unique fusion engine concept based on the Princeton Field-Reversed Configuration (PFRC) fusion reactor under development at the Princeton Plasma Physics Laboratory. The truly game-changing levels of thrust and power in a modestly sized package could integrate with our current launch infrastructure while radically expanding the science capability of these missions. During this Phase I effort, we made great strides in modeling the engine efficiency, thrust, and specific impulse and analyzing feasible trajectories. Based on 2D fluid modeling of the fusion reactors outer stratum, its scrape-off-layer (SOL), we estimate achieving 2.5 to 5 N of thrust for each megawatt of fusion power, reaching a specific impulse, Isp, of about 10,000 s. Supporting this model are particle-in-cell calculations of energy transfer from the fusion products to the SOL electrons. Subsequently, this energy is transferred to the ions as they expand through the magnetic nozzle and beyond. Our point solution for the Pluto mission now delivers 1000 kg of payload to Pluto orbit in 3.75 years using 7.5 N constant thrust. This could potentially be achieved with a single 1 MW engine. The departure spiral from Earth orbit and insertion spiral to Pluto orbit require only a small portion of the total delta-V. Departing from low Earth orbit reduces mission cost while increasing available mission mass. The payload includes a lander, which utilizes a standard green propellant engine for the landing sequence. The lander has about 4 square meters of solar panels mounted on a gimbal that allows it to track the orbiter, which beams 30 to 50 kW of power using a 1080 nm laser. Optical communication provides dramatically high data rates back to Earth. Our mass modeling investigations revealed that if current high-temperature superconductors are utilized at liquid nitrogen temperatures, they drive the mass of the engine, partly because of the shielding required to maintain their critical temperature. Second generation materials are thinner but the superconductor is a very thin layer deposited on a substrate with additional layers of metallic classing. Tremendous research is being performed on a variety of these superconducting materials, and new irradiation data is now available. This raises the possibility of operating nearfuture high-temperature superconductors at a moderately low temperature to dramatically reduce the amount of shielding required. At the same time, a first generation space engine may require low-temperature superconductors, which are higher TRL and have been designed for space coils before (AMS-02 experiment for the ISS). We performed detailed analysis of the startup system and thermal conversion system components. The ideal working fluid was determined to be a blend of Helium and Xenon. No significant problems were identified with these subsystems. For the RF system, we conceived of a new, more efficient design using state-of-the-art switch amplifiers, which have the potential for 100% efficiency. This report presents details of our engine and trajectory analyses, mass modeling efforts, and updated vehicle designs.

temperature↗

DOE OSTI2025

Design workflow of a symmetric traveling wave antenna for fast ion production on DD tokamaks

Initial computational plasma physics scoping and a finite element method antenna modeling design workflow for a symmetric center-fed high-field side high harmonic fast wave traveling wave array (TWA) antenna are reported here. The TWA is designed to generate a test population of fast deuterium ions in an existing D–D tokamak by heating neutral beam deuterium ions, accelerating them from 80 keV to several hundred keV. The resulting fast particles are tailored to mimic key reactor energetic particle parameters with regards to exciting Alfven eigenmode instabilities, allowing for a D–D tokamak like DIII-D or ASDEX-U to replicate reactor-relevant conditions experimentally. Initial scenario scoping for high single-pass absorption as well as good preferential fast ion damping relative to electron damping was completed using the ray-tracing/Fokker–Planck codes GENRAY and CQL3D. Python RF network analysis packages were used to create a custom TWA optimization tool to inform a COMSOL flat antenna design, and Petra-M was used to study cold plasma effects. The TWA produced by this workflow has several novel features when compared to previous TWA studies, including symmetric center feeding, and passive end straps for image current cancellation for reduced impurity production. We show here that the antenna design workflow can readily produce TWA antennas optimized for reflection coefficient, image current cancellation, and launched power spectrum shape; and that a population of fast ions can be generated in the correct region of parameter space, warranting future more detailed studies.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

NASA NTRS1998

A Spaceflight Magnetic Bearing Equipped Optical Chopper with Six-Axis Active Control

This paper describes the development of an ETU (Engineering Test Unit) rotary optical chopper with magnetic bearings. An ETU is required to be both flight-like, nearly identical to a flight unit without the need for material certifications, and demonstrate structural and performance integrity. A prototype breadboard design previously demonstrated the feasibility of meeting flight performance requirements using magnetic bearings. The chopper mechanism is a critical component of the High Resolution Dynamics Limb Sounder (HIRDLS) which will be flown on EOS-CHEM (Earth Observing System-Chemistry). Particularly noteworthy are the science requirements which demand high precision positioning and minimal power consumption along with full redundancy of coils and sensors in a miniature, lightweight package. The magnetic bearings are unique in their pole design to minimize parasitic losses and utilize collocated optical sensing. The motor is of an unusual disk-type ironless stator design. The ETU design has evolved from the breadboard design. A number of improvements have been incorporated into the ETU design. Active thrust control has been added along with changes to improve sensor stability, motor efficiency, and touchdown and launch survivability. It was necessary to do all this while simultaneously reducing the mechanism volume. Flight-like electronics utilize a DSP (Digital Signal Processor) and contain all sensor electronics and drivers on a single five inch by nine inch circuit board. Performance test results are reported including magnetic bearing and motor rotational losses.

Blumenstock, Kenneth A.↗

NASA NTRS1998

A Spaceflight Magnetic Bearing Equipped Optical Chopper with Six-Axis Active Control

Blumenstock, K. A.↗

NASA NTRS1998

A Spaceflight Magnetic Bearing Equipped Optical Chopper with Six-Axis Active Control

Blumenstock, Kenneth A.↗

NASA NTRS2001

Performance of High-Speed PWM Control Chips at Cryogenic Temperatures

The operation of power electronic systems at cryogenic temperatures is anticipated in many NASA space missions such as planetary exploration and deep space probes. In addition to surviving the space hostile environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing development and launch costs. As part of the NASA Glenn Low Temperature Electronics Program, several commercial high-speed Pulse Width Modulation (PWM) chips have been characterized in terms of their performance as a function of temperature in the range of 25 to -196 C (liquid nitrogen). These chips ranged in their electrical characteristics, modes of control, packaging options, and applications. The experimental procedures along with the experimental data obtained on the investigated chips are presented and discussed.

Elbuluk, Malik E.↗

NASA NTRS2009

Evaluation methodology guidance for stack packages

This report provides evaluation methodology guidance based on previous National Aeronautics and Space Administration (NASA) reports and literature surveys for 3D stack packages and assemblies. Two aspects of technology are covered: the package itself (guidance for functional packages) and package assembly manufacturing and reliability. This work was funded by the NASA Electronic Parts and Packaging (NEPP) Program. The objectives of this NEPP project are to: Perform a literature survey of 3D stack technology; perform a literature survey on the evaluation methodology for 3D package and assembly; combine the two aspects to provide evaluation methodology for both aspects with consideration of interactions between package and assembly; generate guidance on the evaluation methodology for 3D stack package integrity prior to and after assembly; provide recommendations on future experimental activities. The qualification and evaluation methodology guidelines will facilitate NASA projects in effectively evaluating the reliability of very dense and newly available high-density 3D stack packages, allowing more processing power in a smaller board footprint and lower system weight.

Gerke, David↗

NASA NTRS2008

Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures

Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗

NASA NTRS2004

Advanced Power Electronics Components

This paper will give a description and status of the Advanced Power Electronics Materials and Components Technology program being conducted by the NASA Glenn Research Center for future aerospace power applications. The focus of this research program is on the following: 1) New and/or significantly improved dielectric materials for the development of power capacitors with increased volumetric efficiency, energy density, and operating temperature. Materials being investigated include nanocrystalline and composite ceramic dielectrics and diamond-like carbon films; 2) New and/or significantly improved high frequency, high temperature, low loss soft magnetic materials for the development of transformers/inductors with increased power/energy density, electrical efficiency, and operating temperature. Materials being investigated include nanocrystalline and nanocomposite soft magnetic materials; 3) Packaged high temperature, high power density, high voltage, and low loss SiC diodes and switches. Development of high quality 4H- and 6H- SiC atomically smooth substrates to significantly improve device performance is a major emphasis of the SiC materials program; 4) Demonstration of high temperature (> 200 C) circuits using the components developed above.

Schwarze, Gene E.↗

NASA NTRS2019

A Comparison of ARTEMIS Data with the Lunar Plasma Design Environment for NASA Crewed Missions

NASA’s Gateway will provide the capability for sustaining a human presence in cis-lunar space. Operations of the Gateway will include spacecraft dockings, extra vehicular activities (EVA), and high-power solar arrays. NASA’s experience with the International Space Station highlighted the importance of evaluating spacecraft charging effects for such operations. For crewed spacecraft, which tend to employ the use of dielectric surfaces in this dynamic plasma environment, reliance on spacecraft charging simulation packages, such as the NASA/Air Force Spacecraft Charging Analyzer Program (Nascap-2k) [Mandell et al., 2006] and Spacecraft Plasma Interaction System (SPIS) [Roussel et al., 2008], is required to understand the risks to hardware and humans. The variability in the lunar plasma environment as the Moon revolves around the Earth, lunar wake effects, and a strong dependency on photoemission and secondary electron emission creates challenges for spacecraft charging analysis. The Design Specification for Natural Environments (DSNE) [NASA, MSFC] is the primary resource for space environments affecting NASA’s crewed missions, and the DSNE provides plasma environments in a standard form for input into simulation packages. NASA developed the existing lunar plasma environment using data from Geotail [Nishida, 1994] along with published lunar plasma wake models [Halekas et al., 2005] based on Lunar Prospector. Since 2011, NASA’s twin Acceleration Reconnection Turbulence & Electrodynamics of Moon’s Interaction with the Sun (ARTEMIS) satellites [Angelopoulos, 2010] have been collecting high resolution plasma and fields observations within the lunar plasma environment providing a much larger dataset of the plasma properties in cislunar space. This research compares the existing lunar plasma environment definition with ARTEMIS data and makes recommendations on the refinement of the environment definition for future lunar missions.

ARTEMIS mission↗

DOE OSTI2024

Improving Cost and Efficiency of the Scalable Solid Oxide Fuel Cells Power System

The objective of this project was to design and develop a 20kW range small-scale solid oxide fuel cells (SOFC) power system for applications such as data centers and commercial buildings. The original plan included a 5,000 hours demonstration and a Techno-Economic Analysis (TEA) which were dropped as part of project termination. The original project plan was to use a stack with a cross-flow cell design which had previously been tested for 500 hours at a community college in Malta, NY. However, it was decided to move to the advanced R-SOFC co-flow cell developed under Department of Energy Award DE-FE0031971. The advanced cell design has the advantage of a larger active area for the same manufacturing footprint which results in fewer required cells for the same stack power, hence a higher volumetric power density (kW/L) and lower cost per kW than the original cross-flow cell design. A full SOFC system Simulink model was developed and calibrated with testing data from a fuel cell stack and BOP (balance of plant) components. The simulation results from the calibrated model showed an acceptable match with the experimental data. A structural analysis conducted for various load scenarios indicated no high stress areas for all spatial directions. Major electrical system components were acquired, built and successfully tested. System sensors were verified and validated against controls. Safety checks, a diagnostic check, PID tuning, and control software commissioning tasks were also conducted. The power electronics prototype was delivered and trial testing completed. Balance of Plant component testing and simulation work was conducted to characterize Reformer-Heat Exchanger heat transfer and backpressure and reformer catalyst methane conversion and product selectivity. Simulations were conducted to design the Anode and Cathode fluid passages and size the air-air and fuel-fuel heat exchangers. A Burner operation map was created from test data and the Anode Gas Recirculation blower was tested to evaluate its durability. The SOFC system used a horizontal style design where components sit directly on a casting with a direct connection to the skid. This design has efficient packaging and a small footprint with approximate dimensions of 750 mm x 700 mm x 1700 mm. An SOFC system was built and successfully tested at the Malta, NY facility The system for over 500 hours under load of which over 300 hours was at full load of 20 kW.

30 DIRECT ENERGY CONVERSION↗

DOE OSTI2020

Discrimination of electronic recoils from nuclear recoils in two-phase xenon time projection chambers

We present a comprehensive analysis of electronic recoil vs. nuclear recoil discrimination in liquid/gas xenon time projection chambers, using calibration data from the 2013 and 2014-16 runs of the Large Underground Xenon (LUX) experiment. We observe strong charge-to-light discrimination enhancement with increased event energy. For events with S1 = 120 detected photons, i.e. equivalent to a nuclear recoil energy of ~100 keV, we observe an electronic recoil background acceptance of <10 –5 at a nuclear recoil signal acceptance of 50%. We also observe modest electric field dependence of the discrimination power, which peaks at a field of around 300 V/cm over the range of fields explored in this study (50-500 V/cm). In the WIMP search region of S1 = 1-80 phd, the minimum electronic recoil leakage we observe is (7.3 ± 0.6) 10 –4 , which is obtained for a drift field of 240-290 V/cm. Pulse shape discrimination is utilized to improve our results, and we find that, at low energies and low fields, there is an additional reduction in background leakage by a factor of up to 3. We develop an empirical model for recombination fluctuations which, when used alongside the Noble Element Scintillation Technique (NEST) simulation package, correctly reproduces the skewness of the electronic recoil data. We use this updated simulation to study the width of the electronic recoil band, finding that its dominant contribution comes from electron-ion recombination fluctuations, followed in magnitude of contribution by fluctuations in the S1 signal, fluctuations in the S2 signal, and fluctuations in the total number of quanta produced for a given energy deposition.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

NASA NTRS2003

Microelectromechanical Systems (MEMS) Broadband Light Source Developed

A miniature, low-power broadband light source has been developed for aerospace applications, including calibrating spectrometers and powering miniature optical sensors. The initial motivation for this research was based on flight tests of a Fabry-Perot fiberoptic temperature sensor system used to detect aircraft engine exhaust gas temperature. Although the feasibility of the sensor system was proven, the commercial light source optically powering the device was identified as a critical component requiring improvement. Problems with the light source included a long stabilization time (approximately 1 hr), a large amount of heat generation, and a large input electrical power (6.5 W). Thus, we developed a new light source to enable the use of broadband optical sensors in aerospace applications. Semiconductor chip-based light sources, such as lasers and light-emitting diodes, have a relatively narrow range of emission wavelengths in comparison to incandescent sources. Incandescent light sources emit broadband radiation from visible to infrared wavelengths; the intensity at each wavelength is determined by the filament temperature and the materials chosen for the filament and the lamp window. However, present commercial incandescent light sources are large in size and inefficient, requiring several watts of electrical power to obtain the desired optical power, and they emit a large percentage of the input power as heat that must be dissipated. The miniature light source, developed jointly by the NASA Glenn Research Center, the Jet Propulsion Laboratory, and the Lighting Innovations Institute, requires one-fifth the electrical input power of some commercial light sources, while providing similar output light power that is easily coupled to an optical fiber. Furthermore, it is small, rugged, and lightweight. Microfabrication technology was used to reduce the size, weight, power consumption, and potential cost-parameters critical to future aerospace applications. This chip-based light source has the potential for monolithic fabrication with on-chip drive electronics. Other uses for these light sources are in systems for vehicle navigation, remote sensing applications such as monitoring bridges for stress, calibration sources for spectrometers, light sources for space sensors, display lighting, addressable arrays, and industrial plant monitoring. Two methods for filament fabrication are being developed: wet-chemical etching and laser ablation. Both yield a 25-mm-thick tungsten spiral filament. The proof-of-concept filament shown was fabricated with the wet etch method. Then it was tested by heating it in a vacuum chamber using about 1.25 W of electrical power; it generated bright, blackbody radiation at approximately 2650 K. The filament was packaged in Glenn's clean-room facilities. This design uses three chips vacuum-sealed with glass tape. The bottom chip consists of a reflective film deposited on silicon, the middle chip contains a tungsten filament bonded to silicon, and the top layer is a transparent window. Lifetime testing on the package will begin shortly. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 mm.

Tuma, Margaret L.↗

NASA NTRSDate not supplied

Heliophysics Environmental & Radiation Measurement Experiment Suite (HERMES): A Small External Payload for the Lunar Gateway with Big Challenges

Currently scheduled for liftoff in 2024, Gateway will be an outpost orbiting the moon for astronauts headed to and from the lunar surface and serve as a staging point for deep space exploration. In January of 2020 NASA headquarters contacted Goddard Space Flight Center to request that they develop a Heliophysics instrumentation package for Gateway. This package would later become known as HERMES-Heliophysics Environmental & Radiation Measurement Experiment Suite. HERMES consists of a Miniaturized Electron pRoton Telescope (MERIT), an Electron Electrostatic Analyzer (EEA), Solar Probe Analyzers (SPAN)-A-ions, and Noise Eliminating Magnetometer Instrument in a Small Integrated System (NEMISIS), which consists of one fluxgate and two Magneto-Inductive Magnetometers. From the beginning the HERMES mission faced a number of Challenges. It was constrained to fit in a small, half meter, cube and it was required to weigh no more than 25kg. A new boom design for the magnetometer would be required and for safety reasons it must be able to retract autonomously with power removed. To complicate matters the location of the SORI-Small ORU- (Orbital Replacement Unit) Robotics Interface, the primary interface for the HERMES platform to the Gateway elements, was undetermined. Also, the mechanical, thermal and electrical interfaces are not fully defined. The Canadian Space Agency is still in process of designing the version of the SORI that will be flown on the Power and Propulsion Element (PPE) and Habitation and Logistics Outpost (HALO) elements, each of which are being developed by different contractors. At the time of initiating the HERMES project, neither of the Gateway module providers were under contract. Additionally, we would later learn the ISS heritage SORI modules were not originally designed for launching on the Gateway elements with a payload directly attached but rather were intended to be brought up on a separate carrier outfitted with launch locks and specialized launch structures from which the robotic arm on Gateway would then be used to detach the payload and install it on the SORI adapters while on orbit. Launching the integrated Payload/SORI on the PPE and HALO elements complicates the stiffness requirements and coupled loads analysis. Adding to this are serious constraints on Field-Of-View (FOV) for solar viewing and severe radiation exposure considerations brought on by slowly raising the orbit through the Van Allen Belts. Just to make things a little more challenging the budget for the entire project was intended to be a low-cost tailored Class-D mission approach. Plus, the effects of Corona VIrus Disease 2019 (COVID-19) were not factored in from the beginning. This paper will discuss what’s being done to overcome these challenges and put HERMES on track for a 2024 Launch Readiness Date (LRD).

Irving Joseph Burt↗

NASA NTRSDate not supplied

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗