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At least 325 records · Page 18

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DOE OSTI2024

Self-Healing Films for Vacuum Insulation Panels (Final Report)

Vacuum insulation panels (VIPs) have an extremely high thermal resistance of around R35/inch, which makes them ideal for building envelope retrofits and prefabricated construction with space constraints. However, the barrier film that maintains the vacuum and thermal performance of the panel can be easily damaged during transportation, installation, and service life. Oak Ridge National Laboratory (ORNL) has developed a self-healable barrier film for VIPs that instantly self-heals damages caused by punctures. The multi-layer barrier film is manufactured using roll-to-roll (R2R) methods. The self-healing barrier film prevents loss of vacuum in VIPs and maintains the exceptional thermal insulation performance. Enhanced durability of VIP by self-healable barrier film and establishing the commercialization path will increase the use of VIPs, thus reducing overall energy usage of buildings. This project has fine-tuned the slurry chemistry of the self-healing components and transitioned the R2R manufacturing trials from mid-scale lab equipment to large-scale industrial equipment for de-risking the technology for commercialization with our TCF CRADA partner, FLEXcon.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2023

Techno-Economic Analysis of Dynamic Building Envelopes Comprising Phase Change Materials and Switchable Insulations: Preprint

Integrating phase change materials (PCMs) in building envelopes is a recognized technique to reduce the space heating/cooling loads and provide load shedding and shifting capacity. However, PCM benefits have been found to reduce dramatically with increase in the insulation requirements. Dynamic building envelopes that can alter their thermal resistance based on the indoor and outdoor conditions can effectively harness free ambient heating/cooling, thereby greatly enhancing the benefits of the PCM-integrated envelope in managing thermal loads. In this study, we examine various combinations of PCMs and switchable insulations and compare their combined impact on heat flow through the building envelope. Using numerical analysis, we investigate the PCM- and switchable insulation-integrated building walls, calculate the potential energy saving benefits compared to the conventional static walls, and finally perform technoeconomic analysis to estimate the acceptable cost of the technology under various payback period scenarios.

dynamic building envelopes↗

DOE OSTI2022

Techno-Economic Analysis of Dynamic Building Envelopes Comprising Phase Change Materials and Switchable Insulations

Integrating phase change materials (PCMs) in building envelopes is a recognized technique to reduce the space heating/cooling loads and provide load shedding and shifting capacity. However, PCM benefits have been found to reduce dramatically with increase in the insulation requirements. Dynamic building envelopes that can alter their thermal resistance based on the indoor and outdoor conditions can effectively harness free ambient heating/cooling, thereby greatly enhancing the benefits of the PCM-integrated envelope in managing thermal loads. In this study, we examine various combinations of PCMs and switchable insulations and compare their combined impact on heat flow through the building envelope. Using numerical analysis, we investigate the PCM- and switchable insulation-integrated building walls, calculate the potential energy saving benefits compared to the conventional static walls, and finally perform techno-economic analysis to estimate the acceptable cost of the technology under various payback period scenarios.

dynamic building envelopes↗

NASA NTRS1992

Characterizing and testing a thermally isolating superconducting link for SAFIRE-like missions

The recent discovery of high temperature ceramic superconductors with transition temperatures above 90 K has opened the possibilities for new space applications. One application is the fabrication of an electrically conducting and thermally isolating electronic link to connect IR detectors to data acquisition electronics on remote sensing platforms. The Spectroscopy of the Atmosphere using Far Infra-Red Emission (SAFIRE) mission is an example of a platform which employs hybrid dewars and combines both mechanical and cryogenic liquid cooling. This new technology is limited by the heat conducted through sensor array leads that connect the electronics (at approximately 80 K) to the sensors (at approximately 4 K). This link must be made of material that has high electrical conductivity and high thermal resistance. The YBa2Cu3O(x) superconductor with a transition temperature, T(sub c), of 93 K can achieve these conflicting requirements. A link with these characteristics will improve the thermal isolation of IR detectors and will increase the lifetime of the cryogen. A reduction of the thermal load due to the link by a factor of four will increase the lifetime of a seven year mission by about one year.

Selim, Raouf L.↗

NASA NTRS1983

Photovoltaic module bypass diode encapsulation

The design and processing techniques necessary to incorporate bypass diodes within the module encapsulant are presented. The Semicon PN junction diode cells were selected. Diode junction to heat spreader thermal resistance measurements, performed on a variety of mounted diode chip types and sizes, have yielded values which are consistently below 1 deg C per watt, but show some instability when thermally cycled over the temperature range from -40 to 150 deg C. Three representative experimental modules, each incorporating integral bypass diode/heat spreader assemblies of various sizes, were designed. Thermal testing of these modules enabled the formulation of a recommended heat spreader plate sizing relationship. The production cost of three encapsulated bypass diode/heat spreader assemblies were compared with similarly rated externally mounted packaged diodes. It is concluded that, when proper designed and installed, these bypass diode devices will improve the overall reliability of a terrestrial array over a 20 year design lifetime.

Shepard, N. J., Jr.↗

NASA NTRS2020

Efficient Thermal Management for Sampling Arm Actuators

An electric actuator incorporating novel features for thermal management is designed and analyzed. Reducing intra-actuator thermal resistance is not only beneficial for cold missions (helping to pre-heat the gearbox) but can also enable high power applications in benign environments. The proposed design increases the thermal conductance between the motor windings and the motor casing by at least two orders of magnitude over the state of practice actuator designs. The design leverages Additive Manufacturing (AM) to integrate a complex 3 dimensional Oscillating Heat Pipe (OHP) directly within the actuator structure. A baseline actuator without this thermal management feature was fabricated. Testing was conducted to evaluate the temperature difference between actuator components at a range of motor winding heat dissipations. An analysis of a proposed revised design incorporating OHPs into the input structure indicated an increase in the effective thermal conductivity of 8 and 22 times for the nominal and start-up modes respectively. In addition, the thermal conductance between the windings and the input structure is increased by a factor of 90, and the thermal conductance between the windings and the gear assembly is increased by a factor of 200 with the proposed design.

Odagiri, Kimihide↗

NASA NTRSDate not supplied

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

The National Aeronautics and Space Administration (NASA) Artemis program plans to send astronauts to the lunar south pole, a region of the moon that is colder than previous lunar missions and low earth orbit operations. The spacesuit boots that will be used on these missions will be directly impacted by these extremely cold temperatures (down to ~50 K). To assess the performance of the Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these extreme temperatures, the boot was tested at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This data was used to correlate thermal models to predict operational performance of the boots on the lunar south pole. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU TVAC test. Data from the test series was used to determine expected thermal conductances within the boot and between the boot and environment. These conductances were used to correlate a Thermal Desktop model of the xEMU boot across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. The correlated model was then used to predict operational performance in the lunar south pole. While the predictions indicate promising evidence for performance of the boots at the 100K test point, there is still substantial uncertainty in performance, particularly at the 48K test point. The results of this test series and model correlation stress the importance of improved testing for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

thermal analysis↗

NASA NTRS2026

Model Correlation and Thermal Analysis of xEMU Boot at Lunar South Pole Temperatures

xEMU↗

NASA NTRS2026

Predicting Operational Performance of xEMU Boot at Lunar South Pole Temperatures using Thermal Desktop ®

The spacesuit boots that will be used on Artemis lunar south pole surface missions will be exposed to extremely cold temperatures (down to ~50 K). To assess the performance of the government’s Exploration Extravehicular Mobility Unit (xEMU) lunar boot in these permanently shadowed regions, testing was performed at the Jet Propulsion Lab (JPL) in the Cryogenic Ice Transfer, Acquisition Development, and Excavation Laboratory (CITADEL) thermal vacuum (TVAC) chamber. This paper documents the data analysis, thermal boot model correlation, and operational predictions conducted using data from the xEMU CITADEL TVAC test. Expected thermal conductances within the boot and between the boot and environment were calculated from test data, which was then used as an initial guess for conductances within a Thermal Desktop (TD) model. Correlation of the TD model using the internal SOLVER feature was performed across 10 different test points which varied external temperature, internal boot ventilation flowrate, and contact pressure. Operational performance at the lunar south pole was then predicted using results from the correlated model. While the predictions provide evidence for acceptable performance of the boots at the 100K environment test point, there is still substantial uncertainty in performance, especially at the 48K test point. This uncertainty is due in part to testing limitations such as contacting the foot to a hard metal plate rather than granular regolith, and model limitations such as the lack of a realistic foot model. These limitations and their impacts are addressed in detail in this paper. The results of this test series and model correlation underscore the importance of additional improved testing and modeling for characterizing the expected thermal resistance between the outside of the boot and the lunar surface.

Spacesuit↗

NASA NTRS2010

Diamond Heat-Spreader for Submillimeter-Wave Frequency Multipliers

The planar GaAs Shottky diode frequency multiplier is a critical technology for the local oscillator (LO) for submillimeter- wave heterodyne receivers due to low mass, tenability, long lifetime, and room-temperature operation. The use of a W-band (75-100 GHz) power amplifier followed by a frequency multiplier is the most common for submillimeter-wave sources. Its greatest challenge is to provide enough input power to the LO for instruments onboard future planetary missions. Recently, JPL produced 800 mW at 92.5 GHz by combining four MMICs in parallel in a balanced configuration. As more power at W-band is available to the multipliers, their power-handling capability be comes more important. High operating temperatures can lead to degradation of conversion efficiency or catastrophic failure. The goal of this innovation is to reduce the thermal resistance by attaching diamond film as a heat-spreader on the backside of multipliers to improve their power-handling capability. Polycrystalline diamond is deposited by hot-filament chemical vapor deposition (CVD). This diamond film acts as a heat-spreader to both the existing 250- and 300-GHz triplers, and has a high thermal conductivity (1,000-1,200 W/mK). It is approximately 2.5 times greater than copper (401 W/mK) and 20 times greater than GaAs (46 W/mK). It is an electrical insulator (resistivity approx. equals 10(exp 15) Ohms-cm), and has a low relative dielectric constant of 5.7. Diamond heat-spreaders reduce by at least 200 C at 250 mW of input power, compared to the tripler without diamond, according to thermal simulation. This superior thermal management provides a 100-percent increase in power-handling capability. For example, with this innovation, 40-mW output power has been achieved from a 250-GHz tripler at 350-mW input power, while the previous triplers, without diamond, suffered catastrophic failures. This breakthrough provides a stepping-stone for frequency multipliers-based LO up to 3 THz. The future work for this design is to apply the high output power from both the 250 and 300 GHz to multiple chains in order to generate milliwatts at 2.3 THz. Using the first generation of results for this innovation, 40 mW of output power were produced from a 240-GHz tripler at 350-mW input power, and 27- mW output power was produced from a 300-GHz tripler at 408-mW input power. This is two times higher than the current state-of-the-art output power capability. A finite-element thermal simulation also shows that 30-microns thick diamond dropped the temperature of the anodes by at least 200 C.

Lin, Robert H.↗

DOE OSTI2022

Experimental measurements and mathematical modeling of cold plate for aviation thermal management

Herein, this study, which has been motivated by the recent applications of the cold plate device in aviation thermal management, reports on physics-based mathematical models derived from the conservation laws of mass, momentum, and energy, and empiricism-based models. One of the objectives of the present work is to report on an elaborate and successful experimental work carried out on an additively manufactured device for the purpose of rigorously validating the numerical predictions. The excellent agreement between the numerical predictions and measured performance provides much needed confidence in the implementation, in the software package, of the offset-strip fin passage correlations, as well as in the software implementation of user-defined wavy fin correlations for aerospace heat exchangers and cold plates operating with ram air at Reynolds numbers below 8000. The contributions of this work can also be found in the development of a new and accurate thermal-hydraulic analysis procedure, referred to in this paper as plate-fin analogy. Results from this procedure are compared with those from thermal resistance network. The comparative study in this paper of the bulk and discrete enthalpy flux method is also new, as is the relative assessment of four off-set strip fin thermal-hydraulic models.

42 ENGINEERING↗

DOE OSTI2022

Measuring sub-surface spatially varying thermal conductivity of silicon implanted with krypton

The thermal properties of semiconductors following exposure to ion irradiation are of great interest for the cooling of electronic devices; however, gradients in composition and structure due to irradiation often make the measurement difficult. Furthermore, the nature of spatial variations in thermal resistances due to spatially varying ion irradiation damage is not well understood. In this work, we develop an advancement in the analysis of time-domain thermoreflectance to account for spatially varying thermal conductivity in a material resulting from a spatial distribution of defects. We then use this method to measure the near-surface (≲1 μm) thermal conductivity of silicon wafers irradiated with Kr + ions, which has an approximate Gaussian distribution centered 260 nm into the sample. Our numerical analysis presented here allows for the spatial gradient of thermal conductivity to be extracted via what is fundamentally a volumetric measurement technique. We validate our findings via transmission electron microscopy, which is able to confirm the spatial variation of the sub-surface silicon structure, and provide additional insight into the local structure resulting from the effects of ion bombardment. Thermal measurements found the ion stopping region to have a nearly 50x reduction in thermal conductivity as compared to pristine silicon, while TEM showed the region was not fully amorphized. Our results suggest this drastic reduction in silicon thermal conductivity is primarily driven by structural defects in crystalline regions along with boundary scattering between amorphous and crystalline regions, with a negligible contribution being due to implanted krypton ions themselves.

36 MATERIALS SCIENCE↗

DOE OSTI2021

Performance Assessment of the Overall Building Envelope Thermal Performance—Building Envelope Performance (BEP) Metric

Today, to describe the thermal performance of the building envelope and its components we use a variation of metrics; such as, R-value, ACH (air exchange rate per hour), SHGC (solar heat gain coefficient) of windows, U-factor etc. None of these performance indicators is meant to represent the overall thermal performance. In this paper, such a metric is introduced, the BEP (building envelope performance) value. Unlike the thermal resistance, typically expressed as an R-value, the BEP-value considers additional elements of heat transfer that affect the energy demand of the building because of exterior and interior (solar) thermal loads: conductive and radiant heat transfer, and air infiltration. To demonstrate BEP’s utility, validation studies were carried out by comparing the BEP-value to theoretical results using whole building energy simulation tools such as EnergyPlus and WUFI Plus. Results show that BEP calculations are comparable to calculations made using these simulation tools and that unlike other similar metrics, the BEP-value accounts for all heat transfer mechanisms that are relevant for the overall energy performance of the building envelope. The BEP-value thus allows comparing envelopes of buildings with different use types in a fair and realistic manner.

42 ENGINEERING↗

DOE OSTI2024

CAD-based Energy & Cost Models Prove Affordable Net Zero Energy Performance for WonderWindows + 24" On-center Framing

Windows are thermally the “weakest link” in the building envelope. Increasing the thermal resistance of windows can make buildings more energy efficient and reduce the cost of electricity needed for conditioning the building. The proper design and placement of framing can also help to reduce the thermal bridging that occurs near the window frame area. This study investigates the energy performance of multi-pane acrylic windows fitting 24" on-center framing. Initial parametric analysis is done for a single zone accessory dwelling unit (ADU). Then, an energy model was developed for three types of wood-framed buildings: townhomes, stacked flats and hotels. A whole building energy simulation is performed for each of these building types in hot-humid Houston, mixed-humid New York, and cold-humid Minneapolis climates. The results show up to a 39% reduction in heating, ventilation, and air-conditioning (HVAC) related electricity consumption for the cold climate compared to the Base case which has window and wall properties based on ASHRAE standard 90.1 2019. In the hot climate, a modest increase in electricity consumption was seen due to an increase in cooling electricity demand. The ADU achieved Net Zero Energy performance in all 3 Climate Zones despite having the highest exterior surface area-to-floor area ratio: the ADU also had the highest PV kW to floor area ratio compared to the other multi-story building types. The townhomes, hotel and stacked flats respectively met 73, 52 and 57 % of electrical use in Houston, 71, 48 and 56 % in New York, and 63, 40 and 53 % in Minneapolis from energy produced by rooftop solar. If 400 W solar panels are used instead of 320 W panel used for energy simulation, it is estimated that in the townhomes, hotel and stacked flats rooftop solar can meet 91, 65 and 71 % of electrical use in Houston; 89, 60 and 70% in New York, and 79, 50 and 66 % in Minneapolis. A preliminary evaluation of cost shows that such superior performance can potentially be achieved at less first cost with this 24"on-center solution than conventional construction. All the building types at the three locations used for simulation had net energy use intensity under 20 kBtu/sf/year with 320 W solar panel and under 17 kBtu/sf/year with 400 W solar panel. Further tailoring of building envelope R-values and window solar heat gain to particular Climate Zone locations for each building type shows promise in reducing the HVAC electricity use that comprises almost half of building energy use.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

NASA NTRS1975

Approaches to flame resistant polymeric materials

Four research and development areas are considered for further exploration in the quest of more flame-resistant polymeric materials. It is suggested that improvements in phenolphthalein polycarbonate processability may be gained through linear free energy relationship correlations. Looped functionality in the backbone of a polymer leads to both improved thermal resistance and increased solubility. The guidelines used in the pyrolytic carbon production constitute a good starting point for the development of improved flame-resistant materials. Numerous organic reactions requiring high temperatures and the techniques of protected functionality and latent functionality constitute the third area for exploration. Finally, some well-known organic reactions are suggested for the formation of polymers that were not made before.

Liepins, R.↗

NASA NTRS2011

Thermally Conductive Tape Based on Carbon Nanotube Arrays

To increase contact conductance between two mating surfaces, a conductive tape has been developed by growing dense arrays of carbon nanotubes (CNTs, graphite layers folded into cylinders) on both sides of a thermally conductive metallic foil. When the two mating surfaces are brought into contact with the conductive tape in between, the CNT arrays will adhere to the mating surface. The van der Waals force between the contacting tubes and the mating surface provides adhesion between the two mating surfaces. Even though the thermal contact conductance of a single tube-to-tube contact is small, the tremendous amount of CNTs on the surface leads to a very large overall contact conductance. Interface contact thermal resistance rises from the microroughness and the macroscopic non-planar quality of mating surfaces. When two surfaces come into contact with each other, the actual contact area may be much less than the total area of the surfaces. The real area of contact depends on the load, the surface roughness, and the elastic and inelastic properties of the surface. This issue is even more important at cryogenic temperatures, where materials become hard and brittle and vacuum is used, which prevents any gas conduction through the interstitial region. A typical approach to increase thermal contact conductance is to use thermally conducting epoxies or greases, which are not always compatible with vacuum conditions. In addition, the thermal conductivities of these compounds are often relatively low. The CNTs used in this approach can be metallic or semiconducting, depending on the folding angle and diameter. The electrical resistivity of multiwalled carbon nanotubes (MWCNTs) has been reported. MWCNTs can pass a current density and remain stable at high temperatures in air. The thermal conductivity of a MWCNT at room temperature is measured to be approximately 3,000 W/m-K, which is much larger than that of diamond. At room temperature, the thermal conductance of a 0.3 sq cm array of CNTs was measured to be as high as 10 W/K. The high thermal conductivity and the nanoscale size make CNTs ideal as thermal interface materials. The CNT-based thermal tape can be used for the thermal management of microelectronic packages and electronic systems. It also can be integrated with current device technology and packaging. The material would allow for an efficient method to manage excess heat generation without requiring any additional power. Lastly, the CNT tape can be used to enhance thermal contact conductance across two mating surfaces on some NASA missions.

Kashani, Ali↗

DOE OSTI2022

Tailorable thermoplastic insulation foam composites enabled by porous-shell hollow glass spheres and expandable thermoplastic microspheres

Here we report a simple and commercially viable strategy to produce thermoplastic composite foams using synergistic foaming approaches – incorporating porous-shell hollow-interior glass spheres (PHGS) as a filler and utilizing expandable thermoplastic microspheres (EMS) as a physical blowing agent – for thermal insulation applications. The EMS in these composites ensure formation of highly porous, low-density foam while the PHGSs provide low thermal conductivity and lightweight mechanical reinforcement. Through systematic optimization of the PHGS and EMS loadings, a lightweight, and robust insulation with thermal resistivity greater than 27.7 m·K/W (R/in. > 4) is achieved. Notably, the fabricated foams also demonstrated comparable compressive strength than some commercial thermoplastic insulating materials. Through optimization of PHGS and EMS concentrations, results indicated similar thermal performance characteristics at varying foam densities, while higher loadings of both components lead to reduced insulation performance and weak mechanical stability of the foams. The results obtained, when coupled with the potential scalability and tailor ability of the overall process towards targeted insulation performance, not only endows competitiveness with current commercial thermoplastic insulating materials but also offers great promise for the development of unique thermoplastic composite foams for a variety of insulation systems.

36 MATERIALS SCIENCE↗

DOE OSTI2023

Modelling and Simulation of a Thermoelectric Heat Pump with Micro-Channel Heat Transfer

Thermoelectric heat pumps (TEHPs) have advantages of modularity and simple design for heating and cooling in some applications. Models of thermoelectric (TE) heat pumps are widely studied. Nevertheless, most existing modeling work focuses on the TE material or air-sourced TE modules. TEHP modeling, especially the relationship between modules and heat exchangers, has not been comprehensively conducted. This work presents a water-to-water TEHP modeling framework that combines Goldsmid’s approach for TE material performance, Gnielinski’s correlation for convective heat transfer, and thermal balance theory for heat exchange networks. This combined framework provides an accurate theoretical analysis of the water-to-water TEHP system. Subsequently, the framework was used to empirically determine TE material properties (electric resistivity, thermal conductivity, and Seebeck coefficient) that minimize modeling errors versus experimentally observed values from the literature. Finally, an additional set of experimental TEHP data was used to validate the model, all with relative absolute deviations of approximately 10% when predicting heating capacity and 10%–20% when forecasting cooling capacity at a 30 K temperature lift. For future work, people can further develop models of TEHPs with an air-based heat sink on one side and water channels on the other side.

Wan, Hanlong↗