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NASA NTRS2010

Preliminary Testing of a Pressurized Space Suit and Candidate Fabrics Under Simulated Mars Dust Storm and Dust Devil Conditions

In August 2009 YAP Films (Toronto) received permission from all entities involved to create a documentary film illustrating what it might be like to be on the surface of Mars in a space suit during a dust storm or in a dust devil. The science consultants on this project utilized this opportunity to collect data which could be helpful to assess the durability of current space suit construction to the Martian environment. The NDX-1 prototype planetary space suit developed at the University of North Dakota was used in this study. The suit features a hard upper torso garment, and a soft lower torso and boots assembly. On top of that, a nylon-cotton outer layer is used to protect the suit from dust. Unmanned tests were carried out in the Martian Surface Wind Tunnel (MARSWIT) at the NASA Ames Research Center, with the suit pressurized to 10 kPa gauge. These tests blasted the space suit upper torso and helmet, and a collection of nine candidate outer layer fabrics, with wind-borne simulant for five different 10 min tests under both terrestrial and Martian surface pressures. The infiltration of the dust through the outer fabric of the space suit was photographically documented. The nine fabric samples were analyzed under light and electron microscopes for abrasion damage. Manned tests were carried out at Showbiz Studios (Van Nuys, California) with the pressure maintained at 20 2 kPa gauge. A large fan-created vortex lifted Martian dust simulant (Fullers Earth or JSC Mars-1) off of the floor, and one of the authors (Lee) wearing the NDX-1 space suit walked through it to judge both subjectively and objectively how the suit performed under these conditions. Both the procedures to scale the tests to Martian conditions and the results of the infiltration and abrasion studies will be discussed.

Gaier, James R.↗
NASA NTRS2010

Fabrication of Lanthanum Telluride 14-1-11 Zintl High-Temperature Thermoelectric Couple

The development of more efficient thermoelectric couple technology capable of operating with high-grade heat sources up to 1,275 K is key to improving the performance of radioisotope thermoelectric generators. Lanthanum telluride La3-xTe4 and 14-1-11 Zintls (Yb14MnSb11) have been identified as very promising materials. The fabrication of advanced high-temperature thermoelectric couples requires the joining of several dissimilar materials, typically including a number of diffusion bonding and brazing steps, to achieve a device capable of operating at elevated temperatures across a large temperature differential (up to 900 K). A thermoelectric couple typically comprises a heat collector/ exchanger, metallic interconnects on both hot and cold sides, n-type and ptype conductivity thermoelectric elements, and cold-side hardware to connect to the cold-side heat rejection and provide electrical connections. Differences in the physical, mechanical, and chemical properties of the materials that make up the thermoelectric couple, especially differences in the coefficients of thermal expansion (CTE), result in undesirable interfacial stresses that can lead to mechanical failure of the device. The problem is further complicated by the fact that the thermoelectric materials under consideration have large CTE values, are brittle, and cracks can propagate through them with minimal resistance. The inherent challenge of bonding brittle, high-thermal-expansion thermoelectric materials to a hot shoe material that is thick enough to carry the requisite electrical current was overcome. A critical advantage over prior art is that this device was constructed using all diffusion bonds and a minimum number of assembly steps. The fabrication process and the materials used are described in the following steps: (1) Applying a thin refractory metal foil to both sides of lanthanum telluride. To fabricate the n-type leg of the advanced thermoelectric couple, the pre-synthesized lanthanum telluride coupon was diffusion bonded to the metal foil using a thin adhesion layer. (2) Repeating a similar process for the 14-1-11 Zintl p-type leg of the advanced thermoelectric couple. (3) Bonding thick CTE-matched metal plates on the metallized lanthanum telluride and Yb14MnSb11 to form the hot and cold sides of the thermoelectric couple. The calculated conversion efficiency of such an advanced couple would be about 10.5 percent, about 35 percent better than heritage radioisotope thermoelectric technology that relies on Si-Ge alloys. In addition, unlike Si-Ge alloys, these materials can be combined with many other thermoelectric materials optimized for operation at lower temperatures to achieve conversion efficiency in excess of 15 percent (a factor of 2 increase over heritage technology).

Ravi, Vilupanur A.↗
NASA NTRS2010

Economical Fabrication of Thick-Section Ceramic Matrix Composites

A method was developed for producing thick-section [>2 in. (approx.5 cm)], continuous fiber-reinforced ceramic matrix composites (CMCs). Ultramet-modified fiber interface coating and melt infiltration processing, developed previously for thin-section components, were used for the fabrication of CMCs that were an order of magnitude greater in thickness [up to 2.5 in. (approx.6.4 cm)]. Melt processing first involves infiltration of a fiber preform with the desired interface coating, and then with carbon to partially densify the preform. A molten refractory metal is then infiltrated and reacts with the excess carbon to form the carbide matrix without damaging the fiber reinforcement. Infiltration occurs from the inside out as the molten metal fills virtually all the available void space. Densification to <5 vol% porosity is a one-step process requiring no intermediate machining steps. The melt infiltration method requires no external pressure. This prevents over-infiltration of the outer surface plies, which can lead to excessive residual porosity in the center of the part. However, processing of thick-section components required modification of the conventional process conditions, and the means by which the large amount of molten metal is introduced into the fiber preform. Modification of the low-temperature, ultraviolet-enhanced chemical vapor deposition process used to apply interface coatings to the fiber preform was also required to accommodate the high preform thickness. The thick-section CMC processing developed in this work proved to be invaluable for component development, fabrication, and testing in two complementary efforts. In a project for the Army, involving SiC/SiC blisk development, nominally 0.8 in. thick x 8 in. diameter (approx. 2 cm thick x 20 cm diameter) components were successfully infiltrated. Blisk hubs were machined using diamond-embedded cutting tools and successfully spin-tested. Good ply uniformity and extremely low residual porosity (<2 percent) were achieved, the latter being far lower than that achieved with SiC matrix composites fabricated via CVI or PIP. The pyrolytic carbon/zirconium nitride interface coating optimized in this work for use on carbon fibers was incorporated in the SiC/SiC composites and yielded a >41 ksi (approx. 283 MPa) flexural strength.

Babcock, Jason↗
NASA NTRS2010

First Demonstration on Direct Laser Fabrication of Lunar Regolith Parts

Establishment of a lunar or Martian outpost necessitates the development of methods to utilize in situ mineral resources for various construction and resource extraction applications. Fabrication technologies are critical for habitat structure development, as well as repair and replacement of tools and parts at the outpost. Herein we report the direct fabrication of lunar regolith simulant parts, in freeform environment, using lasers. We show that raw lunar regolith can be processed at laser energy levels as a low as 2.12 J mm-2 resulting in nanocrystalline and/or amorphous microstructures. Potential applications of laser based fabrication technologies to make useful regolith parts for various applications including load bearing composite structures, radiation shielding, and solar cell substrates is described.

Balla, Vamsi Krishna↗
NASA NTRS2011

Characterization of Electron Beam Free-Form Fabricated 2219 Aluminum and 316 Stainless Steel

Researchers at NASA Langley Research Center have developed an additive manufacturing technology for ground and future space based applications. The electron beam free form fabrication (EBF3) is a rapid metal fabrication process that utilizes an electron beam gun in a vacuum environment to replicate a CAD drawing of a part. The electron beam gun creates a molten pool on a metal substrate, and translates with respect to the substrate to deposit metal in designated regions through a layer additive process. Prior to demonstration and certification of a final EBF3 part for space flight, it is imperative to conduct a series of materials validation and verification tests on the ground in order to evaluate mechanical and microstructural properties of the EBF3 manufactured parts. Part geometries of EBF3 2219 aluminum and 316 stainless steel specimens were metallographically inspected, and tested for strength, fatigue crack growth, and fracture toughness. Upon comparing the results to conventionally welded material, 2219 aluminum in the as fabricated condition demonstrated a 30% and 16% decrease in fracture toughness and ductility, respectively. The strength properties of the 316 stainless steel material in the as deposited condition were comparable to annealed stainless steel alloys. Future fatigue crack growth tests will integrate various stress ranges and maximum to minimum stress ratios needed to fully characterize EBF3 manufactured specimens.

Ekrami, Yasamin↗
NASA NTRS2005

Fabrication of Spherical Reflectors in Outer Space

A process is proposed for fabrication of lightweight spherical reflectors in outer space for telescopes, radio antennas, and light collectors that would be operated there. The process would obviate the relatively massive substrates and frames needed to support such reflectors in normal Earth gravitation. According to the proposal, fabrication of a reflector would begin with blowing of a bubble to the specified reflector radius. Taking advantage of the outer-space vacuum as a suitable environment for evaporative deposition of metal, a metal-evaporation source would be turned on and moved around the bubble to deposit a reflective metal film over the specified reflector area to a thickness of several microns. Then the source would be moved and aimed to deposit more metal around the edge of the reflector area, increasing the thickness there to approximately equal to 100 micron to form a frame. Then the bubble would be deflated and peeled off the metal, leaving a thin-film spherical mirror having an integral frame. The mirror would then be mounted for use. The feasibility of this technology has been proved by fabricating a prototype at JPL. As shown in the figure, a 2-in. (.5-cm) diameter hemispherical prototype reflector was made from a polymer bubble coated with silver, forming a very smooth surface.

Wang, Yu↗
NASA NTRS2005

Solid Freeform Fabrication of Composite-Material Objects

Composite solid freeform fabrication (C-SFF) or composite layer manufacturing (CLM) is an automated process in which an advanced composite material (a matrix reinforced with continuous fibers) is formed into a freestanding, possibly complex, three-dimensional object. In CLM, there is no need for molds, dies, or other expensive tooling, and there is usually no need for machining to ensure that the object is formed to the desired net size and shape. CLM is a variant of extrusion-type rapid prototyping, in which a model or prototype of a solid object is built up by controlled extrusion of a polymeric or other material through an orifice that is translated to form patterned layers. The second layer is deposited on top of the first layer, the third layer is deposited on top of the second layer, and so forth, until the stack of layers reaches the desired final thickness and shape. The elements of CLM include (1) preparing a matrix resin in a form in which it will solidify subsequently, (2) mixing the fibers and matrix material to form a continuous pre-impregnated tow (also called "towpreg"), and (3) dispensing the pre-impregnated tow from a nozzle onto a base while moving the nozzle to form the dispensed material into a patterned layer of controlled thickness. When the material deposited into a given layer has solidified, the material for the next layer is deposited and patterned similarly, and so forth, until the desired overall object has been built up as a stack of patterned layers. Preferably, the deposition apparatus is controlled by a computer-aided design (CAD) system. The basic CLM concept can be adapted to the fabrication of parts from a variety of matrix materials. It is conceivable that a CLM apparatus could be placed at a remote location on Earth or in outer space where (1) spare parts are expected to be needed but (2) it would be uneconomical or impractical to store a full inventory of spare parts. A wide variety of towpregs could be prepared and stored on spools until needed. Long-shelf-life towpreg materials suitable for such use could include thermoplastic-coated carbon fibers and metal-coated SiC fibers. When a spare part was needed, the part could be fabricated by CLM under control by a CAD data file; thus, the part could be built automatically, at the scene, within hours or minutes.

Wang, C. Jeff↗
NASA NTRS2005

Portable Electron-Beam Free-Form Fabrication System

A portable electron-beam free-form fabrication (EB F3) system, now undergoing development, is intended to afford a capability for manufacturing metal parts in nearly net sizes and shapes. Although the development effort is oriented toward the eventual use of systems like this one to supply spare metal parts aboard spacecraft in flight, the basic system design could also be adapted to terrestrial applications in which there are requirements to supply spare parts on demand at locations remote from warehouses and conventional manufacturing facilities. Prior systems that have been considered for satisfying the same requirements (including prior free-form fabrication systems) are not easily portable because of their bulk and massive size. The mechanical properties of the components that such systems produce are often inferior to the mechanical properties of the corresponding original, conventionally fabricated components. In addition, the prior systems are not efficient in the utilization of energy and of feedstock. In contrast, the present developmental system is designed to be sufficiently compact and lightweight to be easily portable, to utilize both energy and material more efficiently, and to produce components that have mechanical properties approximating those of the corresponding original components. The developmental EB F3 system will include a vacuum chamber and associated vacuum pumps, an electron-beam gun and an associated power supply, a multiaxis positioning subsystem, a precise wire feeder, and an instrumentation system for monitoring and control. The electron-beam gun, positioning subsystem, and wire feeder will be located inside the vacuum chamber (see figure). The electron beam gun and the wire feeder will be mounted in fixed positions inside the domed upper portion of the vacuum chamber. The positioning subsystem and ports for the vacuum pumps will be located on a base that could be dropped down to provide full access to the interior of the chamber when not under vacuum. During operation, wire will be fed to a fixed location, entering the melted pool created by the electron beam. Heated by the electron beam, the wire will melt and fuse to either the substrate or with the previously deposited metal wire fused on top of the positioning table. Based on a computer aided design (CAD) model and controlled by a computer, the positioning subsystem

Watson, J. Kevin↗
NASA NTRS2005

Flexible Metal-Fabric Radiators

Flexible metal-fabric radiators have been considered as alternative means of dissipating excess heat from spacecraft and space suits. The radiators also may be useful in such special terrestrial applications as rejecting heat from space-suit-like protective suits worn in hot work environments. In addition to flexibility and consequent ease of deployment and installation on objects of varying sizes and shapes, the main advantages of these radiators over conventional rigid radiators are that they weigh less and occupy less volume for a given amount of cooling capacity. A radiator of this type includes conventional stainless-steel tubes carrying a coolant fluid. The main radiating component consists of a fabric of interwoven aluminum-foil strips bonded to the tubes by use of a proprietary process. The strip/tube bonds are strong and highly thermally conductive. Coolant is fed to and from the tubes via flexible stainless-steel manifolds designed to accommodate flexing of, and minimize bending forces on, the fabric. The manifolds are sized to minimize pressure drops and distribute the flow of coolant evenly to all the tubes. The tubes and manifolds are configured in two independent flow loops for operational flexibility and protective redundancy.

Cross, Cynthia↗
NASA NTRS2004

Fabricating Blazed Diffraction Gratings by X-Ray Lithography

Gray-scale x-ray lithography is undergoing development as a technique for fabricating blazed diffraction gratings. As such, gray-scale x-ray lithography now complements such other grating-fabrication techniques as mechanical ruling, holography, ion etching, laser ablation, laser writing, and electron-beam lithography. Each of these techniques offers advantages and disadvantages for implementing specific grating designs; no single one of these techniques can satisfy the design requirements for all applications. Gray-scale x-ray lithography is expected to be advantageous for making gratings on steeper substrates than those that can be made by electron-beam lithography. This technique is not limited to sawtooth groove profiles and flat substrates: various groove profiles can be generated on arbitrarily shaped (including highly curved) substrates with the same ease as sawtooth profiles can be generated on flat substrates. Moreover, the gratings fabricated by this technique can be made free of ghosts (spurious diffraction components attributable to small spurious periodicities in the locations of grooves). The first step in gray-scale x-ray lithography is to conformally coat a substrate with a suitable photoresist. An x-ray mask (see Figure 1) is generated, placed between the substrate and a source of collimated x-rays, and scanned over the substrate so as to create a spatial modulation in the exposure of the photoresist. Development of the exposed photoresist results in a surface corrugation that corresponds to the spatial modulation and that defines the grating surface. The grating pattern is generated by scanning an appropriately shaped x-ray area mask along the substrate. The mask example of Figure 1 would generate a blazed grating profile when scanned in the perpendicular direction at constant speed, assuming the photoresist responds linearly to incident radiation. If the resist response is nonlinear, then the mask shape can be modified to account for the nonlinearity and produce a desired groove profile. An example of grating grooves generated by this technique is shown in Figure 2. A maximum relative efficiency of 88 percent has been demonstrated.

Mouroulis, Pantazis↗
NASA NTRS2004

Fabrication of Channels for Nanobiotechnological Devices

A method, now undergoing development, of forming nanochannels in planar substrates is intended to enable the fabrication of advanced fluidic devices that could be integrated with complementary metal oxide semiconductor (CMOS) electronic circuits. Such integral combinations of fluidic and electronic components ("laboratory-on-a-chip" devices) could be used, for example, to detect individual molecules of deoxyribonucleic acid (DNA) and proteins. The width of a channel in such a device would be chosen so that molecules of the species of interest would move along the channel in single file. In this method, the fabrication of channels includes the use of such CMOS-compatible processes as chemical-mechanical polishing and oxide deposition. The layout of the channels in the substrate plane is determined by a single photolithographic process, but it is not a nanoscale lithographic process, and this process is not relied upon to define the thickness and width of the channels. Stating it from a slightly different perspective, unlike in the prior fabrication of electronic and fluidic devices involving the use of lithography to define microscale features, this process does not include the use of lithography to define nanoscale features. It is this aspect of the method that enables simplification of the process and, hence, a decrease in cost.

Lee, Choonsup↗
NASA NTRS2004

Chemical Thinning Process for Fabricating UV-Imaging CCDs

The thinning stage of the postfabrication process reported in the immediately preceding article is notable in its own right. Although the thinning process was described in the preceding article as part of an overall process of fabrication of a supported charge-coupled device (CCD), it is more generally applicable to both free-standing and supported devices that have been fabricated in die and wafer formats. Like the thermocompression bonding process described in the preceding article, the thinning process is compatible with CCD-fabrication processes, as well as postfabrication processes that enhance the response of CCDs to ultraviolet (UV) light, including the delta-doping process. CCDs that are thinned by this process and then delta-doped exhibit high quantum efficiencies that are stable with time and with exposure to the environment.

Jones, TOdd↗
NASA NTRS2004

RFID and Memory Devices Fabricated Integrally on Substrates

Electronic identification devices containing radio-frequency identification (RFID) circuits and antennas would be fabricated integrally with the objects to be identified, according to a proposal. That is to say, the objects to be identified would serve as substrates for the deposition and patterning of the materials of the devices used to identify them, and each identification device would be bonded to the identified object at the molecular level. Vacuum arc vapor deposition (VAVD) is the NASA derived process for depositing layers of material on the substrate. This proposal stands in contrast to the current practice of fabricating RFID and/or memory devices as wafer-based, self-contained integrated-circuit chips that are subsequently embedded in or attached to plastic cards to make smart account-information cards and identification badges. If one relies on such a chip to store data on the history of an object to be tracked and the chip falls off or out of the object, then one loses both the historical data and the means to track the object and verify its identity electronically. Also, in contrast is the manufacturing philosophy in use today to make many memory devices. Today s methods involve many subtractive processes such as etching. This proposal only uses additive methods, building RFID and memory devices from the substrate up in thin layers. VAVD is capable of spraying silicon, copper, and other materials commonly used in electronic devices. The VAVD process sprays most metals and some ceramics. The material being sprayed has a very strong bond with the substrate, whether that substrate is metal, ceramic, or even wood, rock, glass, PVC, or paper. An object to be tagged with an identification device according to the proposal must be compatible with a vacuum deposition process. Temperature is seldom an issue as the substrate rarely reaches 150 F (66 C) during the deposition process. A portion of the surface of the object would be designated as a substrate for the deposition of the device. By use of a vacuum arc vapor deposition apparatus, a thin electrically insulating film would first be deposited on the substrate. Subsequent layers of materials would then be deposited and patterned by use of known integrated-circuit fabrication techniques. The total thickness of the deposited layers could be much less than the 100- m thickness of the thinnest state-of-the-art self-contained microchips. Such a thin deposit could be readily concealed by simply painting over it. Both large vacuum chambers for production runs and portable hand-held devices for in situ applications are available.

Schramm, Harry F.↗
NASA NTRS2004

Progress in Fabrication of Rocket Combustion Chambers by VPS

Several documents in a collection describe aspects of the development of advanced materials and fabrication processes intended to enable the manufacture of advanced rocket combustion chambers and nozzles at relatively low cost. One concept discussed in most of the documents is the fabrication of combustion-chamber liners by vacuum plasma spraying (VPS) of an alloy of 88Cu/8Cr/4Nb (numbers indicate atomic percentages) -- a concept that was reported in "Improved Alloy for Fabrication of Combustion Chambers by VPS" (MFS-26546). Another concept is the deposition of graded-composition wall and liner structures by VPS in order to make liners integral parts of wall structures and to make oxidation- and thermal-protection layers integral parts of liners: The VPS process is started at 100 percent of a first alloy, then the proportion of a second alloy is increased gradually from zero as deposition continues, ending at 100 percent of the second alloy. Yet another concept discussed in one of the documents is the VPS of oxidation-protection coats in the forms of nickel-and-chromium-containing refractory alloys on VPS-deposited 88Cu/8Cr/4Nb liners.

Holmes, Richard R.↗
NASA NTRS2004

A New Process for Fabricating Random Silicon Nanotips

An improved process for the fabrication of random arrays of silicon nanotips has been demonstrated to be feasible. Relative to other such processes, this process offers advantages of low cost and simplicity. Moreover, this process can readily be combined with other processes used to fabricate integrated circuits and other monolithic silicon structures. Arrays of silicon nanotips are subjects of research and development efforts directed toward utilizing them as field emitters in flat-panel displays, vacuum microelectronics, and microwave devices. Other silicon-nanotip-fabrication processes developed thus far predominantly include lithography, etching, and/or elaborate deposition steps followed by oxide sharpening steps and are both process intensive as well as expensive. In addition to being cheaper and simpler, the present process can efficiently produce silicon nanotips that range in height from a few microns to several tens of microns and are distributed over large areas. The process mentioned here can be summarized as consisting of (1) the growth of micro-etch masks on a silicon substrate, followed by (2) etching away of the masks, along with some of the substrate, to make an array of sharp tips. In the first step of the process, a cleaned silicon substrate is subjected to reactive ion etching (RIE) in a certain mixture of oxygen and carbon tetrafluoride under radio-frequency excitation. This process step results in the growth of fluorine based compounds in the form of stumps randomly distributed on the substrate. These stumps are known in the art as polymer RIE grass. The dimensions of these stumps are of the order of hundreds of nanometers, the exact values depending on process time and gas composition. The areal density of the stumps decreases with increasing process time as they grow and merge with neighboring stumps. These stumps constitute the micro-etch masks for the next step of the process. In the second step of the process, the substrate covered with the microetch masks is subjected to deep reactive ion etching (DRIE) process, which consists of cycles of reactive ion etching alternating with passivation (the Bosch process). The gas used in the etching substeps is sulfur hexafluoride (SF6); the gas used in the passivation substeps is octafluorocyclobutane (C4F8). The portions of the substrate directly under the RIE grass stubs are etched more slowly than are the portions between the stubs. Hence, what remains at the end of the process, after the stubs and parts of the substrate have been etched away, are silicon spikes where the stubs were (see figure). In a variation of the process, one starts with a silicon or silicon-on-insulator substrate with the intent to etch through the full thickness of the substrate. That is to say, one chooses the thickness so that the DRIE step releases individual nanotips. Such individual silicon nanotips may have utility as microscopic probes in biomedical applications.

Manohara, Harish↗
NASA NTRS2003

Fabricating Composite-Material Structures Containing SMA Ribbons

An improved method of designing and fabricating laminated composite-material (matrix/fiber) structures containing embedded shape-memory-alloy (SMA) actuators has been devised. Structures made by this method have repeatable, predictable properties, and fabrication processes can readily be automated. Such structures, denoted as shape-memory-alloy hybrid composite (SMAHC) structures, have been investigated for their potential to satisfy requirements to control the shapes or thermoelastic responses of themselves or of other structures into which they might be incorporated, or to control noise and vibrations. Much of the prior work on SMAHC structures has involved the use SMA wires embedded within matrices or within sleeves through parent structures. The disadvantages of using SMA wires as the embedded actuators include (1) complexity of fabrication procedures because of the relatively large numbers of actuators usually needed; (2) sensitivity to actuator/ matrix interface flaws because voids can be of significant size, relative to wires; (3) relatively high rates of breakage of actuators during curing of matrix materials because of sensitivity to stress concentrations at mechanical restraints; and (4) difficulty of achieving desirable overall volume fractions of SMA wires when trying to optimize the integration of the wires by placing them in selected layers only.

Turner, Travis L.↗
NASA NTRS2003

Electrophoretic Deposition for Fabricating Microbatteries

An improved method of fabrication of cathodes of microbatteries is based on electrophoretic deposition. Heretofore, sputtering (for deposition) and the use of photoresist and liftoff (for patterning) have been the primary methods of fabricating components of microbatteries. The volume of active electrode material that can be deposited by sputtering is limited, and the discharge capacities of prior microbatteries have been limited accordingly. In addition, sputter deposition is slow. In contrast, electrophoretic deposition is much faster and has shown promise for increasing discharge capacities by a factor of 10, relative to those of microbatteries fabricated by prior methods.

West, William↗
NASA NTRS2012

Regolith-Derived Heat Shield for Planetary Body Entry and Descent System with In-Situ Fabrication

High-mass planetary surface access is one of NASA's Grand Challenges involving entry, descent, and landing (EDL). Heat shields fabricated in-situ can provide a thermal protection system for spacecraft that routinely enter a planetary atmosphere. Fabricating the heat shield from extraterrestrial regolith will avoid the costs of launching the heat shield mass from Earth. This project will investigate three methods to fabricate heat shield using extraterrestrial regolith.

Hogue, Michael D.↗