Role of Probabilistic Micromechanics Modeling in Establishing Design Allowables in Composites
One of the major challenges in designing with any new material, and particularly with advanced composite materials, is the fidelity of material design allowables. In the case of composite materials, the concern arises from the inherent nature of these materials, i.e., their heterogeneous make-up and the various factors that affect their properties in a specific design environment. Composites have various scales - micro, macro, laminate and structural, as well as numerous other fabrication related parameters. Many advanced composites in aerospace applications involve complex two- and three-dimensional fiber architectures and requires high-temperature processing. Since there are uncertainties associated with each of these, the observed behavior of composite materials shows scatter. Evaluating the effect of each of these variables on the observed scatter in composite properties solely by teSting is cost and time prohibitive. One alternative is to evaluate these effects by computational simulation. The authors have developed probabilistic composite micromechanics techniques by combining woven composite micromechanics and Fast Probability Integration (FPI) techniques to address these issues. In this paper these techniques will be described and demonstrated through selected examples. Results in the form of cumulative distribution functions (CDF) of the composite properties of a MI (melt-infiltrated) SiC/SiC (silicon carbide fiber in a silicon carbide matrix) Composite will be presented. A CDF is a relationship defined by the value of the property (the response variable) with respect to the cumulative probability of occurrence. Furthermore, input variables causing scatter are identified and ranked based upon their sensitivity magnitude. Sensitivity information is very valuable in quality control. How these results can be utilized to develop design allowables so that these materials may be used by structural analysts/designers will also be discussed.