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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 343 records · Page 19

Evaluation of electrically insulative adhesives for use in hybrid microcircuit fabrication

The initial results of a study directed to the task of selecting suitable evaluation tests which can form the basis for guidelines for electrically insulated adhesives are given. The properties of adhesives considered to be of major importance for the proposed application are enumerated, with brief comments. Specific tests to determine the chemical and electrolytic corrosivity of adhesives to commonly used metallization systems, their long-term outgassing after cure, and their bond strengths under a variety of conditions are defined and discussed in detail.

Licari, J. J.↗

Preparation and metallurgical properties of low gravity processed immiscible materials

Initial experiments conducted during the Apollo 14 mission demonstrated that unique dispersions of immiscible materials could be obtained by processing in a low gravity environment. Subsequently, seven metallic systems have been processed in three NASA facilities: the drop tower at MSFC, the M-512 facility on board a KC-135 aircraft and the M-518 furnace on board Skylab. All couples were solidified from the liquid while in a low gravity environment, with one gravity processed specimens as controls. Metallographic examination demonstrated that the specimens processed in a low gravity environment exhibited a more uniform dispersion and microstructure than the one gravity processed controls.

Reger, J. L.↗

Convection sensitivity and thermal analyses for indium and indium-lead mixing experiment (74-18)

Sounding rocket Experiment 74-18 was designed to demonstrate the effects of the Black Brandt rocket acceleration levels (during the low-g coast phase of its flight) on the motion of a liquid metal system to assist in preflight design. Some post flight analyses were also conducted. Preflight studies consisted of heat transfer analysis and convection sensitivity and convection modeling analyses which aided in the: (1) final selection of fluid materials (indium-lead melts rather than paraffins); (2) design and timing of heater and quench system; and (3) preflight predictions of the degree of lead penetration into the pure indium segment of the fluid. Postflight studies involved: (1) updating the convection sensitivity calculations by utilizing actual flight gravity levels; and (2) modeling the mixing in the flight samples.

Bourgeois, S. V.↗

Gas-path seal technology

Improved gas-path seals are needed for better fuel economy, longer performance retention, and lower maintenance, particularly in advanced, high-performance gas turbine engines. Problems encountered in gas-path sealing are described, as well as new blade-tip sealing approaches for high-pressure compressors and turbines. These include a lubricant coating for conventional, porous-metal, rub-strip materials used in compressors. An improved hot-press metal alloy shows promise to increase the operating surface temperatures of high-pressure-turbine, blade-tip seals to 1450 K (2150 F). Three ceramic seal materials are also described that have the potential to allow much higher gas-path surface operating temperatures than are possible with metal systems.

Zuk, J.↗

Migratory gold resistive shorts - Chemical aspects of a failure mechanism

Integrated-circuit devices using the Ti/W/Au metal system are subject to failure mechanisms based on electrolytic corrosion. The migratory gold resistive short (MGRS) failure mode is one example of this mechanism and results in the formation of filamentary or dendritic deposits of gold between adjacent stripes on the IC chip. This reaction requires the presence of a sufficient amount of water, a bias voltage between adjacent stripes, and the activation of the cathodic (-) stripe. Gold ions are transported from anode to cathode through a film of moisture adsorbed on the surface of the chip; halide ions are probably involved in the transfer. Their presence is verified experimentally by X-ray photoelectron spectroscopy. Some of the chemical and electrostatic factors involved in the MGRS mechanism are discussed in this paper, including the questions of a threshold level of moisture and contamination.

Grunthaner, F. J.↗

Stress rupture resistance

Principles underlying the design of metallic systems for stress rupture resistance are outlined by considering the specific case studies of cobalt- and nickel-base superalloys. Ways in which superalloys can be designed for high stress rupture resistance are discussed. In describing the alloying procedures, the strengthening mechanisms involved and methods of avoiding phases detrimental to stress rupture resistance are identified. New processing techniques such as controlled solidification, prealloyed powder processing, and autoclave heat treatments are described as further means of achieving increased stress rupture resistance in superalloy and other systems.

Freche, J. C.↗

Mixing of two liquid metals on spar payload due to spin-up and spin-down

Unexpected results from SPAR experiments, directed at obtaining fine dispersions of metal systems that in a 1-g environment tend to segregate very rapidly, were considered. The physical processes occurring in fluid samples, such as the SPAR samples before solidification, were shown to be insufficient to produce a well mixed liquid by the time solidification was initiated. This would result in solidified samples with the type of segregation noted in the SPAR samples. Experimental evidence and analytical arguments are presented.

Schafer, C. F.↗

Design and fabrication of a radiative actively cooled honeycomb sandwich structural panel for a hypersonic aircraft

The panel assembly consisted of an external thermal protection system (metallic heat shields and insulation blankets) and an aluminum honeycomb structure. The structure was cooled to temperature 442K (300 F) by circulating a 60/40 mass solution of ethylene glycol and water through dee shaped coolant tubes nested in the honeycomb and adhesively bonded to the outer skin. Rene'41 heat shields were designed to sustain 5000 cycles of a uniform pressure of + or - 6.89kPa (+ or - 1.0 psi) and aerodynamic heating conditions equivalent to 136 kW sq m (12 Btu sq ft sec) to a 422K (300 F) surface temperature. High temperature flexible insulation blankets were encased in stainless steel foil to protect them from moisture and other potential contaminates. The aluminum actively cooled honeycomb sandwich structural panel was designed to sustain 5000 cycles of cyclic in-plane loading of + or - 210 kN/m (+ or - 1200 lbf/in.) combined with a uniform panel pressure of + or - 6.89 kPa (?1.0 psi).

Ellis, D. A.↗

Rate equation for desorbing particles

A rate equation describing the desorption of particles from substrates has been formulated using a simple classical model in terms of the particulate escape probabilities and escape velocities. Numerical results for desorption rates as a function of temperature using simple two-body potentials are calculated for various metallic systems. These results were obtained for the low coverage limits and are found to be in good agreement with experimental findings. The present formulation also provides an improved picture of the physical nature of the commonly discussed parameters, such as the frequency factor, desorption energy, and desorption temperature in relation to observed desorption phenomena.

Halicioglu, T.↗

High resolution, low cost solar cell contact development

The experimental work demonstrating the feasibility of the MIDFILM process as a low cost means of applying solar cell collector metallization as reported. Cell efficiencies of above 14% (AMl, 28 C) were achieved with fritted silver metallization. Environmental tests suggest that the metallization is slightly humidity sensitive and degradation is observed on cells with high series resistance. The major yield loss in the fabrication of cells was due to discontinuous grid lines, resulting in high series resitance. Standard lead-tin solder plated interconnections do not appear compatible with the MIDFILM contact. Copper, nickel and molybdemun base powder were investigated as low cost metallization systems. The copper based powder degraded the cell response. The nickel and molybdenum base powders oxidized when sintered in the oxidizing atmosphere necessary to ash the photoresin.

Mardesich, N.↗

Multiwall TPS - An emerging concept

Research on titanium multiwall used for thermal protection is reviewed. Continuing analytical and experimental studies yielding a fundamental understanding of the thermal and structural performance of the basic multiwall concept are presented noting that central to this understanding is a knowledge of the extensional behavior of the dimpled sheets since the thinner flat sheets will buckle and be relatively ineffective in supporting compressive loads. Results from radiant heating, aerothermal, vibration, acoustic and lightning strike tests are described as part of an effort to verify the performance of multiwall tiles under representative operating conditions. Flight tests of a large array of tiles are also planned as part of an orbiter experiments program. The research effort is being extended from flat all-titanium multiwall configurations limited to temperatures below 810 K to curved surfaces and higher temperature versions. Multi-wall concepts are found to offer the durability of metallic systems and to be mass competitive with the insulation system currently used on the Space Shuttle Orbiter.

Shideler, J. L.↗

Behavior of sulfur at high pressures and low temperatures

A new type of high-pressure apparatus for low-temperature experiments was built, which allows loading and measuring the load in situ at low temperature (1.5 K). It uses the diamond anvil in the flat-indentor configuration. It was used to investigate the high-conductivity state of sulfur at low temperatures. For pressures in the 50-GPa range, sulfur is still a semiconductor or at best a two phase semiconductor-metal system. As the temperature is lowered at 50 GPa, the resistance drops slightly, reaches a minimum around 230 deg K, and then increases dramatically.

Golopentia, D. A.↗

Assessment of high temperature metallizations for I(2)L and CMOS technologies

High temperature barrier metallizations were assessed and tested for I(2)L and CMOS applications. Life tests were accelerated to 375 C in view of the -55 C to +300 C temperature range established for engine-located electronics without fuel cooling. The gold-refractory metallizations evaluated were Au-TiW-PtSi, Au-TiW/TiO2/TiW-PtSi and Au-TiW(N)-PtSi. These metallization systems were thermally annealed to at least 375 C for up to 250 hours. The critical requirement for stable diffusion barrier is the TiW grain size. Small grain (250A-500A) films were observed to be stable up to 375 C. Deposition to TiW diffusion barrier in the presence of oxygen and nitrogen also results in an effective diffusion barrier. Auger electron spectroscopy profiles of the PtSi indicates some penetration by the TiW. In the case of PtSi/TiW interface, the redistribution of oxygen further passivates the system by forming a TiO2 layer at the interface.

Christou, A.↗

Hybrid A/D converter for 200 deg C operation

A 12 bit A/D converter was designed and developed which will operate at 200 C with .05 linearity, 1/accuracy, 350 WSec conversion time, and only 455 mW power consumption. This product also necessitated the development of a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This system totally eliminates the formation of a intermetallics at the bonding interface which can lead to bond failure. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical reliability of hybrid circuits at 200 C.

Sullivan, M. R.↗

Accelerated stress testing of terrestrial solar cells

The development of an accelerated test schedule for terrestrial solar cells is described. This schedule, based on anticipated failure modes deduced from a consideration of IC failure mechanisms, involves bias-temperature testing, humidity testing (including both 85-85 and pressure cooker stress), and thermal-cycle thermal-shock testing. Results are described for 12 different unencapsulated cell types. Both gradual electrical degradation and sudden catastrophic mechanical change were observed. These effects can be used to discriminate between cell types and technologies relative to their reliability attributes. Consideration is given to identifying laboratory failure modes which might lead to severe degradation in the field through second quadrant operation. Test results indicate that the ability of most cell types to withstand accelerated stress testing depends more on the manufacturer's design, processing, and worksmanship than on the particular metallization system. Preliminary tests comparing accelerated test results on encapsulated and unencapsulated cells are described.

Lathrop, J. W.↗

Post heat treatment effects on double layer metal structures for VLSI applications

The realization of high yield double layer metal systems using wet chemistry processes and the ability to extend yields beyond that attainable with wet chemistry by means of post sintering processes at temperatures below 500 C for potential applications in very large scale integration structures were studied. Yields in excess of 98% and average total contact resistance of less than 150 ohms and 200 ohms were realized for a series of 560 vias of 0.5 X 0.5 mils and 0.2 X 0.2 mils in size, respectively.

Wade, T. E.↗

Structural difference rule for amorphous alloy formation by ion mixing

A rule is formulated which establishes a sufficient condition that an amorphous binary alloy will be formed by ion mixing of multilayered samples when the two constituent metals are of different crystalline structure, regardless of their atomic sizes and electronegativities. The rule is supported by the experimental results obtained on six selected binary metal systems, as well as by the previous data reported in the literature. The amorphization mechanism is discussed in terms of the competition between two different structures resulting in frustration of the crystallization process.

Liu, B.-X.↗

Getting the current out

Progress of a photovoltaic (PV) device from a research concept to a competitive power-generation source requires an increasing concern with current collection. The initial metallization focus is usually on contact resistance, since a good ohmic contact is desirable for accurate device characterization measurements. As the device grows in size, sheet resistance losses become important and a metal grid is usually added to reduce the effective sheet resistance. Later, as size and conversion efficiency continue to increase, grid-line resistance and cell shadowing must be considered simultaneously, because grid-line resistance is inversely related to total grid-line area and cell shadowing is directly related. A PV cell grid design must consider the five power-loss phenomena mentioned above: sheet resistance, contact resistance, grid resistance, bus-bar resistance and cell shadowing. Although cost, reliability and usage are important factors in deciding upon the best metallization system, this paper will focus only upon grid-line design and substrate material problems for flat-plate solar arrays.

Burger, D. R.↗