Niobium Superconducting Diffusion-Cooled Hot-Electron Bolometer Mixers Above 1 THz
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We have measured the noise temperature of heterodyne receivers employing.
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A pulsed laser system includes a modulator module configured to provide pulsed electrical signals and a plurality of solid-state seed sources coupled to the modulator module and configured to operate, responsive to the pulsed electrical signals, in a pulse mode. Each of the plurality of solid-state seed sources is tuned to a different frequency channel separated from any adjacent frequency channel by a frequency offset. The pulsed laser system also includes a combiner that combines outputs from each of the solid state seed sources into a single optical path and an optical doubler and demultiplexer coupled to the single optical path and providing each doubled seed frequency on a separate output path.
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Developed by NASA Glenn Research Center, the LMM aboard the International Space Station (ISS) is enabling multiple biomedical science experiments. Techshot, Inc., has developed a series of colloid specialty cell systems (C-SPECS) for use in the colloid science experiment module on the LMM. These low-volume mixing devices will enable uniform particle density and remotely controlled repetition of LMM colloid experiments. By automating the experiment process, C-SPECS allow colloid samples to be processed more quickly. In addition, C-SPECS will minimize the time the crew will need to spend on colloid experiments as well as eliminate the need for multiple and costly colloid samples, which are expended after a single examination. This high-throughput capability will lead to more efficient and productive use of the LMM. As commercial launch vehicles begin routine visits to the ISS, C-SPECS could become a significant means to process larger quantities of high-value materials for commercial customers.
An experimental study is conducted assessing the performance of an ejector together with an 8:1 aspect ratio rectangular nozzle with the eventual goal of noise reduction for jet engines. Wall static pressure and Pitot probe surveys are conducted to evaluate the performance of the ejector, and sound pressure level measurements are made to assess the impact on noise radiation. It is found that addition of vortex generating tabs at the lip of the nozzle causes large increases in secondary flow entrainment. The baseline ejector (without tabs) often encounters flow resonance with accompanying tones. The tabs have the additional benefit of eliminating those tones. In most cases tried so far, pockets of high-speed fluid remain unmixed. Since jet noise scales as velocity to the eighth power, such ‘hot spots’ defeat the noise reduction goal. In some cases, there is a reduction in noise amplitudes in the mid-frequency range (5-30 kHz), however, an increase occurs on the low frequency end apparently due to flow unsteadiness. This together with a high frequency noise increase caused by the tabs results in minimal reductions in the overall sound pressure level. The focus of ongoing and future efforts is to achieve sufficient mixing and desirable noise reduction while keeping the hard-ware short and lightweight.
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Future space submillimeter telescopes will require large-format imaging detector arrays to perform state-of-the-art astronomical observations. A crucial issue related to a focal plane array is a readout scheme which is combatible with large numbers of cryogenic detectors elements.
The process for fabricating and utilizing the threedimensional Si stack receiver front-end is described in this paper. The capability to have exact dimensionality becomes essential as frequency scales due to the complexity arising in assembly and finer tolerances. Total process yields can be improved through Si fabrication by verifying achievement of specified tolerances lithographically and compatibility to rapid process changes and design fine-tuning. The integrated Si platform with the mounted device is shown in Figure 1. Signal I/O and alignment modalities enable lownoise measurements. Silicon micromachining provides the necessary accuracy for integration at the several THz regime. Particularly, processing and etch recipes have demonstrated smooth surfaces of < 1 μm surface roughness. In consideration is pre-compensating for minute offsets, matching mechanical strain on all interfaces, and including passive alignment verification in the design. As compared to metal blocks, computer numerical controlled (CNC) milling can produce slight burrs in the interfaces resulting in misalignment and resultant strain between two pieces of components. Furthermore, Si integration can make possible arrays of pixel transceivers through compact subsystems for the purpose of measuring multiple lines of spectral content simultaneously in space.
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