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Results for “bonding processes”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 343 records · Page 19
All sourcesNASA NTRSDOE OSTI
NASA NTRS1989

The effect of processing on autohesive strength development in thermoplastic resins and composites

In the present investigation of processing effects on the autohesive bond strength of neat polysulfone resin and graphite-reinforced polysulfone-matrix composites measured resin bond strength development in precracked compact tension specimens 'healed' by heating over a contact period at a given temperature. The critical strain energy release rate of refractured composite specimens did not exhibit the strong time or temperature dependence of the neat resin tests; only 80-90 percent of the undamaged fracture energy is recoverable.

Howes, Jeremy C.↗
NASA NTRS1991

Apparatus For Chemically Treating Graphite Fibers

New apparatus for chemical treatment of graphite-fiber tow developed. Applies chemical solutions to commercially purchased unsized fibers or in-house-made fibers, to improve following: handling of fibers, interface bonding of fiber to resin matrix during prepreg fabrication, and interface bonding in laminates during molding process. Designed for research and development, with predrying and post-drying in inert environments. Easily adaptable to different chemical solutions and well suited for small-scale, prototype, tailor-made fiber systems. Used to develop fiber/resin composites for aerospace, automotive, marine, and other applications.

Stanfield, Clarence E.↗
NASA NTRS1992

NLS propulsion - Government view

The paper discusses the technology development for the Space Transportation Main Engine (STME). The STME is a liquid oxygen/liquid hydrogen engine with 650,000 pounds of thrust, which may be flown in single-engine or multiple-engine configurations, depending upon the payload and mission requirements. The technological developments completed so far include a vacuum plasma spray process, the liquid interface diffusion bonding, and a thin membrane platelet technology for the combustion chamber fabrication; baseline designs for the hydrogen turbopump and the oxygen pump; and the engine control system. The family of spacecraft for which this engine is being developed includes a 20,000 pound payload to LEO and a 150,000 pound to LEO vehicle.

Smelser, Jerry W.↗
NASA NTRS1994

Phenylethynyl-Terminated Polyimides

Phenylethynyl-terminated polyimides exhibit properties suitable for films, moldings, adhesives, and composite-material matrices. Polyimides synthesized at various molecular weights, selected to obtain desirable properties for specific applications. Thermally cured to form cross-linked molecular structures typically increasing resistance to solvents, glass-transition temperatures, and moduli of elasticity. Also have low molecular weights and low melt viscosities for easier processing into composites and adhesive bonds.

Jensen, Brian J.↗
NASA NTRS1997

Tailoring Silicon Oxycarbide Glasses for Oxidative Stability

Blackglas(Trademark) polysiloxane systems produce silicon oxycarbide glasses by pyrolysis in inert atmosphere. The silicon oxycarbides evidence oxidative degradation that limits their lifetime as composite matrices. The present study characterizes bonding rearrangements in the oxycarbide network accompanying increases in pyrolysis temperature. It also addresses the changes in susceptibility to oxidation due to variations in the distribution of Si bonded species obtained under different processing conditions. The study is carried out using Si-29 nuclear magnetic resonance (NMR) spectroscopy and a design of experiments approach to model the oxidation behavior. The NMR results are compared with those obtained by thermogravimetric analysis (TGA). Samples pyrolyzed under inert conditions are compared to those pyrolyzed in reactive ammonia environments.

Hurwitz, F. I.↗
NASA NTRS1997

Computer-aided design of a proton pump

The use of transmembrane proton gradients in energy transduction is an almost universal feature of life on earth. These proton gradients are established and maintained by specialized assemblies of proteins which actively pump protons across membranes. One broad class of proton pumps uses captured light energy to drive the proton pumping. Our goal is to elucidate the minimum structural requirements of a light-driven proton-pump. There are two basic components to a simple light-driven proton pump: a source of photo-generated protons and a "gate-keeper" which prevents these protons from reattaching themselves to their source. A wide variety of molecules in the membrane, even as simple as polycyclic aromatic hydrocarbons, are capable of releasing protons when illuminated. Our work is therefore focused on the design of the "gate-keeper." Our initial model involves a pair of proton acceptors, coupled to each other by a transient water bridge, and supported in the membrane by a small bundle of peptide helices. Upon illumination, the proton source transfers its proton to the:- first acceptor of the gate-keeper. While the reverse reaction is highly probable, all that is needed to ensure irreversibility is a nonvanishing probability that the proton will be transferred to the second acceptor across a transient water bridge. Back transfer of the proton to the first acceptor, and thence to the proton source, is impeded by the free energy required to move the proton uphill towards the. proton source and by the disruption of the transient water bridge. As a prototypical water-bridged proton transfer system, we are studying the transfer of a proton across a water bridge from a formic acid to a formate anion. With a pK(sub alpha), of 3.7. formic acid is a good model for the acidic amino acids glutamate and aspartate which are good candidates for gate-keeper proton acceptors. Simulations of proton transfer reactions in a membrane are complicated by the quantum mechanical nature of the process breaking and forming chemical bonds.

New, Michael H.↗
NASA NTRS2017

A Cryogenic Thermal Source for Detector Array Characterization

We describe the design, fabrication, and validation of a cryogenically compatible quasioptical thermal source for characterization of detector arrays. The source is constructed using a graphite-loaded epoxy mixture that is molded into a tiled pyramidal structure. The mold is fabricated using a hardened steel template produced via a wire electron discharge machining process. The absorptive mixture is bonded to a copper backplate enabling thermalization of the entire structure and measurement of the source temperature. Measurements indicate that the reflectance of the source is less than 0.001 across a spectral band extending from 75 to 330 gigahertz.

Chuss, David T.↗
NASA NTRS2018

A Reliability Comparison of Classical and Stochastic Thickness Margin Approaches to Address Material Property Uncertainties for the Orion Heat Shield

The Orion Thermal Protection System (TPS) margin process uses a root-sum-square approach with branches addressing trajectory, aerothermodynamics, and material response uncertainties in ablator thickness design. The material response branch applies a bondline temperature reduction between the Avcoat ablator and EA9394 adhesive by 60 C (108 F) from its peak allowed value of 260 C (500 F). This process is known as the Bond Line Temperature Material Margin (BTMM) and is intended to cover material property and performance uncertainties. The value of 60 C (108 F) is a constant, applied at any spacecraft body location and for any trajectory. By varying only material properties in a random (monte carlo) manner, the perl-based script mcCHAR is used to investigate the confidence interval provided by the BTMM. In particular, this study will look at various locations on the Orion heat shield forebody for a guided and an abort (ballistic) trajectory.

margins↗
NASA NTRS2021

NASA Facts: AERoBOND Project

Sustainability of the commercial air travel industry requires new aircraft with ultra-efficient structures and designs, which will depend largely on lightweight polymer composites and new assembly methods. Manufacturers of commercial transport aircraft are compelled to install thousands of redundant fasteners into bonded joints to prevent failures due to unpredictable weak bonds. The Adhesive-Free Bonding of Complex Composites (AERoBOND) process enables re-flow of matrix resin during assembly to eliminate the material discontinuity at the interface, thereby eliminating the dependence of mechanical performance on interfacial adhesion.

Frank Louis Palmieri↗
NASA NTRS1989

Wood Bond Testing

A joint development program between Hartford Steam Boiler Inspection Technologies and The Weyerhaeuser Company resulted in an internal bond analyzer (IBA), a device which combines ultrasonics with acoustic emission testing techniques. It is actually a spinoff from a spinoff, stemming from a NASA Lewis invented acousto-ultrasonic technique that became a system for testing bond strength of composite materials. Hartford's parent company, Acoustic Emission Technology Corporation (AET) refined and commercialized the technology. The IBA builds on the original system and incorporates on-line process control systems. The IBA determines bond strength by measuring changes in pulsar ultrasonic waves injected into a board. Analysis of the wave determines the average internal bond strength for the panel. Results are displayed immediately. Using the system, a mill operator can adjust resin/wood proportion, reduce setup time and waste, produce internal bonds of a consistent quality and automatically mark deficient products.

Source record↗
NASA NTRS1992

Transient liquid phase diffusion bonding of Udimet 720 for Stirling power converter applications

Udimet 720 has been selected for use on Stirling power converters for space applications. Because Udimet 720 is generally considered susceptible to strain age cracking if traditional fusion welding is used, other joining methods are being considered. A process for transient liquid phase diffusion bonding of Udimet 720 has been theoretically developed in an effort to eliminate the strain age crack concern. This development has taken into account such variables as final grain size, joint homogenization, joint efficiency related to bonding aid material, bonding aid material application method, and thermal cycle.

Mittendorf, Donald L.↗
NASA NTRS2009

Bonded Invar Clip Removal Using Foil Heaters

A new process uses local heating and temperature monitoring to soften the adhesive under Invar clips enough that they can be removed without damaging the composite underneath or other nearby bonds. Two 1x1 in. (approx.2.5x2.5 cm), 10-W/sq in. (approx.1.6-W/sq cm), 80-ohm resistive foil Kapton foil heaters, with pressure-sensitive acrylic adhesive backing, are wired in parallel to a 50-V, 1-A limited power supply. At 1 A, 40 W are applied to the heater pair. The temperature is monitored in the clip radius and inside the tube, using a dual thermocouple readout. Several layers of aluminum foil are used to speed the heat up, allowing clips to be removed in less than five minutes. The very local heating via the foil heaters allows good access for clip removal and protects all underlying and adjacent materials.

Pontius, James T.↗
DOE OSTI2025

VUV Photoionization Dynamics and Reactivity of Heterogeneous Water Clusters

This feature focuses on bridging isolated water and bulk water studies. It assembles experiments and theory on water clusters, mainly probed by vacuum ultraviolet (VUV) radiation, and summarizes what the effects are of intermolecular interactions on both the spectroscopy and the VUV-induced processes in water. In particular, it highlights studies of heterogeneous water clusters─those incorporating other molecular species such as naphthalene, methane, formic acid, and glycerol─which serve as model systems to investigate the fundamental roles of water in hydrogen bonding networks, proton transfer, and astrochemical processes. These mixed clusters provide a platform to revisit the stability of protonated water clusters and compile observations of ionization-induced structural rearrangements and fragmentation, especially in systems involving hydroxyl-rich cosolvents. This feature then explores energy transfer mechanisms in molecular clusters, following VUV photoexcitation. It concludes with potential future directions. First, we investigate excited-state dynamics in molecular clusters through direct probing, complementing the synchrotron studies discussed here. Second, exploring gas-phase molecule evaporation from confined spaces and interfaces using advanced spectroscopic techniques sheds light on these ubiquitous, yet currently debated, molecular processes.

Cluster chemistry↗
NASA NTRS2017

Ames Engineering Directorate

The Ames Engineering Directorate is the principal engineering organization supporting aerospace systems and spaceflight projects at NASA's Ames Research Center in California's Silicon Valley. The Directorate supports all phases of engineering and project management for flight and mission projects-from R&D to Close-out-by leveraging the capabilities of multiple divisions and facilities.The Mission Design Center (MDC) has full end-to-end mission design capability with sophisticated analysis and simulation tools in a collaborative concurrent design environment. Services include concept maturity level (CML) maturation, spacecraft design and trades, scientific instruments selection, feasibility assessments, and proposal support and partnerships. The Engineering Systems Division provides robust project management support as well as systems engineering, mechanical and electrical analysis and design, technical authority and project integration support to a variety of programs and projects across NASA centers. The Applied Manufacturing Division turns abstract ideas into tangible hardware for aeronautics, spaceflight and science applications, specializing in fabrication methods and management of complex fabrication projects. The Engineering Evaluation Lab (EEL) provides full satellite or payload environmental testing services including vibration, temperature, humidity, immersion, pressure/altitude, vacuum, high G centrifuge, shock impact testing and the Flight Processing Center (FPC), which includes cleanrooms, bonded stores and flight preparation resources. The Multi-Mission Operations Center (MMOC) is composed of the facilities, networks, IT equipment, software and support services needed by flight projects to effectively and efficiently perform all mission functions, including planning, scheduling, command, telemetry processing and science analysis.

Small Satellites↗
DOE OSTI2024

Thermomechanical Degradation of Sintered Copper Under High-Temperature Thermal Shock

The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronics modules, especially in operating temperatures greater than 150 degrees C. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees C to 200 degrees C) conditions. In the fabrication phase of the samples, we used different stencil patterns and found that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality compared to a full-area print. The paste consisted of Cu microflakes, and we performed sintering using a Budatec SP300 sintering press at 275 degrees C with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained scanning electron microscope images, which revealed adhesive fracture as the dominant failure mechanism.

ADVANCED PROPULSION SYSTEMS,INORGANIC, ORGANIC, PH↗
NASA NTRS1989

Automatic determination of fault effects on aircraft functionality

The problem of determining the behavior of physical systems subsequent to the occurrence of malfunctions is discussed. It is established that while it was reasonable to assume that the most important fault behavior modes of primitive components and simple subsystems could be known and predicted, interactions within composite systems reached levels of complexity that precluded the use of traditional rule-based expert system techniques. Reasoning from first principles, i.e., on the basis of causal models of the physical system, was required. The first question that arises is, of course, how the causal information required for such reasoning should be represented. The bond graphs presented here occupy a position intermediate between qualitative and quantitative models, allowing the automatic derivation of Kuipers-like qualitative constraint models as well as state equations. Their most salient feature, however, is that entities corresponding to components and interactions in the physical system are explicitly represented in the bond graph model, thus permitting systematic model updates to reflect malfunctions. Researchers show how this is done, as well as presenting a number of techniques for obtaining qualitative information from the state equations derivable from bond graph models. One insight is the fact that one of the most important advantages of the bond graph ontology is the highly systematic approach to model construction it imposes on the modeler, who is forced to classify the relevant physical entities into a small number of categories, and to look for two highly specific types of interactions among them. The systematic nature of bond graph model construction facilitates the process to the point where the guidelines are sufficiently specific to be followed by modelers who are not domain experts. As a result, models of a given system constructed by different modelers will have extensive similarities. Researchers conclude by pointing out that the ease of updating bond graph models to reflect malfunctions is a manifestation of the systematic nature of bond graph construction, and the regularity of the relationship between bond graph models and physical reality.

Feyock, Stefan↗
DOE OSTI2025

Micro-structural features and material properties impact on adhesive metal joints via computational modeling and machine learning

The quality of structural bonding in practical applications depends on various factors arising from materials, pre-processing conditions, and manufacturing. Understanding how these factors influence bonding performance and determining their relative importance are of significant interest. Thus, this study evaluates the effects of microstructural features and material properties on the structural strength of adhesively-bonded metal joints at the submillimeter scale, utilizing a combination of Finite Element Modeling (FEM) and Machine Learning (ML) with Gradient Boosting Regression (GBR). The microstructural features include adhesive thickness, internal voids within the adhesive, adherend-adhesive interfacial voids, void size and volume fraction, and surface roughness. The material properties include the constitutive behavior of the adhesive, as well as the adherend-adhesive interfacial strength and fracture energy. The changes in structural strength and morphologies of the bonded metal structures with respect to different microstructural features and material properties were clarified by FEM. By further leveraging ML-GBR, the sequence of importance of these factors affecting bonding performance across various scenarios was summarized. This work provides valuable insights into the development of improved structural bonding for adhesive joints in industries such as automotive , aerospace, and beyond.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronic modules, especially in operating temperatures greater than 150 degrees Celsius. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees Celsius to 200 degrees Celsius) conditions. In the fabrication phase of the samples, we used different stencil patterns and found out that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality than a full-area print. The paste consisted of Cu microflakes and we performed sintering using a Budatec SP300 sintering press at 275 degrees Celsius with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained digital microscope images, which revealed adhesive fracture as the dominant failure mechanism.

ADVANCED PROPULSION SYSTEMS↗