Search NASA⌕ Search

SEARCH · Search NASA

Results for “digital manufacturing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 343 records · Page 19

Mechanical properties, strain hardening, and fracture behavior of ultrasonic additively manufactured Zircaloy-4 after low-temperature neutron irradiation

Ultrasonic additive manufacturing (UAM) is a solid-state, layer-by-layer advanced manufacturing process that has the potential to create custom spatially controlled composites with embedded wires and sensors for nuclear component manufacture. For this work, to assess the feasibility of using UAM for nuclear-relevant materials research, the technique was used to produce a 3.5-mm-thick Zircaloy-4 plate for irradiation testing. The UAM Zircaloy-4 specimens were irradiated in the High Flux Isotope Reactor at a target irradiation temperature of 117 °C to 2.9 displacements per atom (dpa) to assess differences in irradiation-hardening behavior as a function of alloy processing path. The UAM and reference baseplate (BP) materials increased in yield strength by 372±27 MPa and 346±21 MPa, respectively, and both suffered significant reductions in uniform and total elongation attributed to irradiation hardening at low-temperature. Although the materials had similar nanoscale defect structures, including nanoscale black dot/loop features and strain-induced dislocation channels, the UAM material’s processing-related defects resulted in accelerated strain localization and failure as demonstrated by lower post-irradiation uniform elongation of UAM specimens (0.5 %) compared to BP (1.5 %) material. The UAM material also showed considerable anisotropy in mechanical response due to crack propagation along weld boundaries, resulting in differences in strength & ductility when tested parallel and perpendicular to the prior UAM build orientation. Therefore, although the fundamental irradiation response of UAM-processed Zircaloy-4 was phenomenologically comparable to that of BP reference material, additional optimization of the UAM processing is needed to produce irradiation-resistant and nuclear-relevant materials.

Digital image correlation↗

Automotive Stirling Engine Development Program

Development test activities on Mod I engines directed toward evaluating technologies for potential inclusion in the Mod II engine are summarized. Activities covered include: test of a 12-tube combustion gas recirculation combustor; manufacture and flow-distribution test of a two-manifold annular heater head; piston rod/piston base joint; single-solid piston rings; and a digital air/fuel concept. Also summarized are results of a formal assessment of candidate technologies for the Mod II engine, and preliminary design work for the Mod II. The overall program philosophy weight is outlined, and data and test results are presented.

Nightingale, N.↗

Applications of advanced diffractive optical elements

Digital Optics Corporation is a UNC-Charlotte spin-off company, established to transfer technology developed at UNC-Charlotte for the design and manufacture Computer Generated Holograms (CGH's) and to market products based on CGH technology. DOC acquired core technologies from UNC-Charlotte including: (1) a CGH encoding process that can provide holograms with extremely high diffraction efficiency; (2) a low cost, high precision CGH manufacturing process; and (3) extensive holographic and refractive element design capabilities for design and evaluation of complex optical systems. These technologies have been used to design and/or manufacture optical components for a variety of applications including: (1) generation of Spot arrays; (2) fiber optic coupling elements; (3) optical interconnects between VLSI chips within and between multichip modules; and (4) imaging systems for head-mounted displays (HMD's).

Welch, W. Hudson↗

MPEX AI Digital Twins

All magnetically confined plasma fusion power plant concepts (Tokamak, Spherical Tokamak, Stellarator, Mirror, ...) must exhaust the heat and plasma from the core confinement region to the material walls. The primary channel for this exhaust is through a plasma divertor which directs plasma along open magnetic field lines to a material target. The Material Plasma Exposure eXperiment (MPEX) illustrated in Figure 1, is a high-power, steady-state linear plasma device designed to produce the plasma material interaction (PMI) conditions of the divertor of future magnetic confinement fusion power plants: energy flux 20MW/m 2 , ion fluence 1031/m 2 , pulse duration 106 sec. These goals of plasma exposure in MPEX are well beyond those achieved in magnetic fusion experimental devices. Successfully achieving these high power steady state conditions for long pulses requires operational control of the heating and particle sources and the plasma flux to the walls and target. The MPEX AI Hot Spot Controller, proposed in this project, will help achieve the operational milestones of MPEX. The MPEX device will begin commissioning at the end of FY26. A smaller proto-MPEX was operated for 14,666 plasma discharges and will resume operation in September of 2025 as proto-MPEX-lite, with reduced capability, to test a new window for the Helicon plasma source. The proto-MPEX data has undergone surrogate modeling with machine learning methods (R. Archibald, 2022 IEEE International Conference on Big Data). This proto-MPEX data will be used to begin development of the AI digital twins described in this white paper. The scientific mission of MPEX is to qualify materials of different composition for use in the high energy and plasma flux conditions of a fusion power plant. The materials exposed in MPEX will in some cases be exposed to high neutron fluxes at other ORNL facilities to measure the changes to their PMI properties. The targets exposed in MPEX will be transported under vacuum to a Surface Analysis Station (SAS). The SAS will be equipped with the following diagnostics: Focused Ion Beam (FIB) for trench milling, 100-400 angstrom resolution scanning electron microscope (SEM), surface mapping x-ray spectrometer, high resolution camera, and a future upgrade to a laser induced breakdown spectroscopy quadruple mass spectrometer (LIBS-QMS). The MPEX experiments will generate diverse pre- and post-exposure measurement data of detailed material properties down to the crystal grain level in 3D for post-exposure assessment of PMI damage (e.g. cracking, melting, erosion and redeposition of the material). Physics models for the PMI, and how the material composition and manufacturing impact its performance under high energy plasma exposure, need to be validated with MPEX data to guide the selection of new candidate materials. Our vision for the MPEX AI Digital Twins project is to supply experimental and physics model simulation data to train Artificial Intelligence (AI) models for data processing, analysis, operational control, PMI and materials simulation to maximize the scientific output of the MPEX device. Ultimately, an AI digital twin of MPEX material assessment metrics for tested and synthetic material types with simulated PMI will be trained by the AI Modeling Teams on the experimental and physics simulation data submitted to the American Science Cloud by this project. A purely empirical search for the best material is inefficient given the finite number of samples that can be tested on MPEX. In order to expand the material properties database for training the MPEX Material Assessment AI Digital Twin, and to gain physics understanding of the PMI processes, physics models of the material properties and PMI processes are required. The physics simulations provide detailed simulation data, like impact angles for plasma ions, sputtering yields, transport of the ionized sputtered target material in the plasma, and redeposition locations. This simulation data expands the measurement data for deeper physics understanding. The experimental data is essential to validate the PMI and material structure simulation models. The validated models can then be used to generate new simulation data of MPEX material assessments for synthetic material compositions that have not been exposed in MPEX. These predictive simulations, plus the whole experimental dataset, will be used to train the MPEX Material Assessment AI Digital Twin allowing a rapid generative AI search for new materials with reduced PMI damage by interpolating the domain of the training set. These new optimum materials can be simulated with the physics codes and/or tested in MPEX. The ability of AI neural networks to interpolate multi-dimensional parameter spaces and generate virtual data is exploited for a more efficient search for optimum materials. The advent of the Transformational AI Models Consortium (TAIMC) is an opportunity to engage with state of the art private and public AI developers to achieve the goals of the AI digital twins and AI accelerated physics models proposed in this project. Our partners at ORNL from the Advance Scientific Computing Research (ASCR) organization will collaborate in accelerating the integrated plasma material interaction simulation framework. This simulation framework will provide a platform for generating simulation data across a range of physical fidelities, including hybrid methods that produce multi-fidelity results. This data will be leveraged for AI model development, both for generation of surrogates and the automation of simulation campaigns. A part of the research below will include collaborative efforts with the TAIMC to (i) adapt data storage approaches to ensure AI-readiness, (ii) provide a protypical exemplar to inform and exercise constructed workflows, and (iii) generate and share data, using the TAIMC unified AI data standard, for foundational models that will be trained from multiple sources across the DOE complex. We will also collaborate with the TAIMC, as well as the planned AI modeling teams, to develop approaches for reducing the cost of data generation. These include tailored multi-fidelity approaches as well as fine-tuning strategies to augment general, large-scale foundational models.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

HYMOSS signal processing for pushbroom spectral imaging

The objective of the Pushbroom Spectral Imaging Program was to develop on-focal plane electronics which compensate for detector array non-uniformities. The approach taken was to implement a simple two point calibration algorithm on focal plane which allows for offset and linear gain correction. The key on focal plane features which made this technique feasible was the use of a high quality transimpedance amplifier (TIA) and an analog-to-digital converter for each detector channel. Gain compensation is accomplished by varying the feedback capacitance of the integrate and dump TIA. Offset correction is performed by storing offsets in a special on focal plane offset register and digitally subtracting the offsets from the readout data during the multiplexing operation. A custom integrated circuit was designed, fabricated, and tested on this program which proved that nonuniformity compensated, analog-to-digital converting circuits may be used to read out infrared detectors. Irvine Sensors Corporation (ISC) successfully demonstrated the following innovative on-focal-plane functions that allow for correction of detector non-uniformities. Most of the circuit functions demonstrated on this program are finding their way onto future IC's because of their impact on reduced downstream processing, increased focal plane performance, simplified focal plane control, reduced number of dewar connections, as well as the noise immunity of a digital interface dewar. The potential commercial applications for this integrated circuit are primarily in imaging systems. These imaging systems may be used for: security monitoring systems, manufacturing process monitoring, robotics, and for spectral imaging when used in analytical instrumentation.

Ludwig, David E.↗

Building Reliable Printed Circuit Boards - the Lessons Learned

"Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. This one day workshop will discuss a variety of failure mechanisms that effect the functionality of PCBs. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. With the help of examples and case studies, a wide range of failure mechanisms will be discussed, case studies are focused on digital circuits, however some failures in analog, double sided boards are also presented. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues."

Sood, Bhanu↗

Integrated Computational Materials Engineering (ICME) Capability Maturity Levels for Ecosystems Enabling Digital Transformation

Digital engineering (DE) and integrated computational materials engineering (ICME) are widely recognized as critical enablers of faster, more affordable, and more reliable aerospace systems. However, many organizations have struggled to realize the promised return on investment (ROI) from digital initiatives. A primary reason is the absence of a shared, decision-focused framework that distinguishes simple digitization of existing workflows from true digital transformation that fundamentally changes how engineering decisions are made. This paper introduces an ICME capability maturity framework that fills this gap. The framework defines six cumulative ICME capability maturity levels (CMLs), explicitly tied to decision authority, engineering integration, optimization, and uncertainty management across material, process, structure, and performance scales. It is designed to complement established readiness metrics such as technology readiness levels (TRLs), manufacturing readiness levels (MRLs), and integration readiness levels (IRLs), by addressing a missing dimension: the conditions required for model-informed decision authority across scales. A unifying figure and capability table illustrate the six-level ICME Capability Maturity Framework, showing how organizations progress from digitization—with limited or negative ROI—to true digital transformation, where ICME-enabled workflows deliver measurable improvements in decision quality, cycle time, risk reduction, and reuse. The framework is intended for both technical practitioners and executive leadership, providing a common language to assess current state, guide roadmaps, align software ecosystem investments, and set realistic expectations for digital transformation outcomes. A regulatory-relevant statement clarifying the relationship between ICME capability and existing certification frameworks is provided.

ICME↗

Image Processing Software

The Ames digital image velocimetry technology has been incorporated in a commercially available image processing software package that allows motion measurement of images on a PC alone. The software, manufactured by Werner Frei Associates, is IMAGELAB FFT. IMAGELAB FFT is a general purpose image processing system with a variety of other applications, among them image enhancement of fingerprints and use by banks and law enforcement agencies for analysis of videos run during robberies.

Source record↗

Additive Manufacturing and Working Fluid Characterization of Ceramic Heat Pipes

In this work, additively manufactured (AM) aluminum nitride (AlN) ceramic heat pipes were developed to improve spacecraft heat rejection capabilities beyond the current state-of-the-art metal systems. A low sintering temperature aluminum nitride slurry is developed for digital light processing printing (DLP) and the optimal debinding curves are examined. Printed AlN parts are characterized via SEM and optical profilometry. AlN 3D-printed parts are also tested for compatibility with aluminum bromide, aluminum chloride, and iodine, among other proposed working fluids at 350-600 K in an inert atmosphere, with reactivity measured via SEM and Fourier transform infrared spectroscopy (FTIR).

Thermal Management↗

Optical Testing of Integrated Circuits

Optical spot-raster scanner produces weighted photoresponse image (PI) of operating CMOS IC. Digital analysis of PI's, which correlates differences in PI's with electrical behavior of IC, shows promise both as 100-percent screening method for use in IC manufacture and as diagnostic tool in IC development.

Erickson, J.↗

Experimental characterization of the perceptron laser rangefinder

In this report, we characterize experimentally a scanning laser rangefinder that employs active sensing to acquire three-dimensional images. We present experimental techniques applicable to a wide variety of laser scanners, and document the results of applying them to a device manufactured by Perceptron. Nominally, the sensor acquires data over a 60 deg x 60 deg field of view in 256 x 256 pixel images at 2 Hz. It digitizes both range and reflectance pixels to 12 bits, providing a maximum range of 40 m and a depth resolution of 1 cm. We present methods and results from experiments to measure geometric parameters including the field of view, angular scanning increments, and minimum sensing distance. We characterize qualitatively problems caused by implementation flaws, including internal reflections and range drift over time, and problems caused by inherent limitations of the rangefinding technology, including sensitivity to ambient light and surface material. We characterize statistically the precision and accuracy of the range measurements. We conclude that the performance of the Perceptron scanner does not compare favorably with the nominal performance, that scanner modifications are required, and that further experimentation must be conducted.

Kweon, I. S.↗

Active interlocking metasurfaces enabled by shape memory alloys

Interlocking metasurfaces (ILMs) are a newly developed joining technology that relies on arrays of interlocking features that transmit force and constrain motion between adjoining bodies in one or more directions. This study explores harnessing the shape memory effect (SME) in Nickel-Titanium shape memory alloys (NiTi SMAs) in structures fabricated using additive manufacturing (AM) to advance the development of active ILMs by creating unit cells that open or close at specific temperatures. The study encompasses designing and fabricating two distinct interlocking array configurations using near-equiatomic NiTi powder and the laser powder bed fusion (L-PBF) AM technique, following a previously developed AM process optimization framework to manufacture defect-free parts. To guide the design process, finite element analysis (FEA) was employed to predict strain values during engage-disengage cycles. The martensitic transformation characteristics of the ILMs were characterized. Thermomechanical testing revealed that the ILMs demonstrate high locking force once engaged, coupled with complete shape recovery and good cyclic stability. Digital image correlation (DIC) was also employed to validate the FEA predictions during the engage-disengage cycles. The results indicate that NiTi SMA-based ILMs can be designed and fabricated into complex shapes using L-PBF. By leveraging the SME, the functionality of an ILM can be improved upon. The combination of computational modeling, additive manufacturing, and thermomechanical and physical property characterization provides a framework for designing future ILMs out of active materials.

Additive manufacturing↗

Additive Manufacturing of Heat Pipes for Microreactor Applications

Heat pipes are highly effective devices used to passively transport heat by two-phase capillary action. Their small footprint, light weight and lack of moving parts make them ideal for transportable nuclear microreactors, where size and weight are limited, minimal to no operation and maintenance are required, and high reliability is desired. The use of additive manufacturing allows for the fabrication of heat pipes with performance enhancements, such as microchannels, grooves, arteries, or tailored porosity, which are difficult, expensive or impossible to achieve with traditional fabrication techniques. We are evaluating the capabilities of the Admaflex 130 Digital Light Printer to produce these geometries by characterizing feature shrinkage, developing an optimal heat treatment recipe, assessing the effects of heat treatment atmosphere and varying print orientation. Computational simulations are being used to estimate performance of the various 3D printed configurations.

21 SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLANTS↗

Introduction: Neuromorphic Materials

The explosive growth in data collection and the need to process it efficiently, as well as the desire to automate increasingly complex tasks in transportation, medical care, manufacturing, security and many other fields have motivated a growing interest in neuromorphic computing. Unlike the binary, transistorbased ON/OFF logic gates and separate logic and memory functionalities employed in digital computing, neuromorphic computing is inspired by animal brains that use interconnected synapses and neurons to perform processing, storage and transmission of information at the same location, while only consuming ~20 W or less of power. Motivated by the brain’s efficiency, adaptability, self-learning and resiliency qualities, neuromorphic computing can be broadly defined as an approach to processing and storing information using hardware and algorithms inspired by models of biological neural systems. Present research in neuromorphic computing encompasses approaches that vary significantly in their degree of neuro-inspiration, from systems that only incorporate features such as asynchronous, event-driven operation or use crossbar arrays of non-volatile memory (NVM) elements to accelerate deep neural networks (DNNs), to designs that embrace the extreme parallelism, sparsity, reconfigurability, adaptability, complexity and stochasticity observed in nervous systems. The term ‘neuromorphic’ computing is often credited to Carver Mead, who in the 1980s investigated Si-based analog electronics to replicate functions of the animal retina. Earlier important advances in this field include the work of Frank Rosenblatt, who proposed the concept of the perceptron, Bernard Widrow, who used this concept to build one of the first analog neural networks, the Adaline and many other researchers (see ref. 6 for an historical perspective on neuromorphic computing). With the recent increase in the use of artificial intelligence and large language models, and rising concerns over the associated energy costs, interest in neuromorphic hardware has expanded rapidly. According to some estimates, driven largely by the drastic growth in the training use of artificial intelligence (AI) models using the current computing architectures, the energy cost of computing is projected to reach the energy supply worldwide by 2045. Furthermore, while this is not a realistic outcome, it means that, if more efficient computing technologies are not developed -- soon -- the world will soon become one where demand for energy and market constraints limit the continued increase of societal access to AI and cloud services from data centers. Data centers used for training and use of these models consume hundreds of terawatt hours of electricity, already past 4% of the US electricity demand.

Circuits↗

Statistical analysis of low level atmospheric turbulence

The statistical properties of low-level wind-turbulence data were obtained with the model 1080 total vector anemometer and the model 1296 dual split-film anemometer, both manufactured by Thermo Systems Incorporated. The data obtained from the above fast-response probes were compared with the results obtained from a pair of Gill propeller anemometers. The digitized time series representing the three velocity components and the temperature were each divided into a number of blocks, the length of which depended on the lowest frequency of interest and also on the storage capacity of the available computer. A moving-average and differencing high-pass filter was used to remove the trend and the low frequency components in the time series. The calculated results for each of the anemometers used are represented in graphical or tabulated form.

Tieleman, H. W.↗

Robotic Hand

The Omni-Hand was developed by Ross-Hime Designs, Inc. for Marshall Space Flight Center (MSFC) under a Small Business Innovation Research (SBIR) contract. The multiple digit hand has an opposable thumb and a flexible wrist. Electric muscles called Minnacs power wrist joints and the interchangeable digits. Two hands have been delivered to NASA for evaluation for potential use on space missions and the unit is commercially available for applications like hazardous materials handling and manufacturing automation. Previous SBIR contracts resulted in the Omni-Wrist and Omni-Wrist II robotic systems, which are commercially available for spray painting, sealing, ultrasonic testing, as well as other uses.

Source record↗