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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 343 records · Page 19

Lunar interaction with the solar wind - Effects on lunar electrical conductivity estimates

The lunar electromagnetic response, measured at very low frequencies with the moon in the solar wind, is used to evaluate interior electrical conductivity at great depth and to determine limits on the size of possible lunar core. A theory is developed wherein compression of the magnetic field in the lunar tail cavity caused by inflowing plasma at the lunar limbs and in the lunar wake, bends the magnetic field in the lunar interior and thereby alters the tangential component of magnetic field observed on the dayside surface. This theory strongly indicates that cavity fringing cannot explain the enhanced East-West fluctuations. It is proposed that the East-West fluctuations might be due to diamagnetic currents caused by lunar surface photoelectrons in the lunar terminator region.

Goldstein, B. E.↗

Substituent effects on the electrical conductivities of the phenazine derivatives

The and/or photoconductivities of 16 substituted phenazines having methoxy, hydroxy, chloro, nitro, amino or t-butyl group at 1-, 2-, 1, 6- or 2,7- positions of the phenazine ring measured by using the surface type cells. The energy gaps of the dark conductivities in the range 2.0 to 2.3 were independent of the kinds and the positions of the substituent groups, although the photo-absorption wavelength of the evaporated films changed with them. No correlation between photoconductivity and fluorescence was observed. The photocurrent was affected by the position of the substituents; namely, the photocurrents of the 1,6-di-substituted phenazines. When the substituent at 1,6-positions was hydroxy or amino group, however, the photocurrents decreased. The photocurrents decreased drastically in the presence of oxygen.

Sugimoto, A.↗

Effect of anisotropic thermal conductivity on the morphological stability of a binary alloy

A linear morphological stability analysis is presented for a planar interface during unidirectional solidification of a binary alloy, in the case of a crystal having an anisotropic thermal conductivity. A dispersion relation shows that the onset of instability depends on the orientation of the growth direction with respect to principal crystallographic axes and on the orientation of the wavevector of the perturbation. The onset of instability can be either oscillatory (traveling waves) or nonoscillatory in time. For growth along a principal axis of the crystal there is an exchange of stabilities, and the onset of instability is nonoscillatory.

Coriell, S. R.↗

Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials

Thermal Interface Materials (TIMs) are critical components in spacecraft thermal management systems, where thermal performance is strongly influenced by vacuum conditions, interface contact resistance, and layered metallic joint behavior. However, manufacturer-reported thermal conductivity values are often derived under idealized conditions and may not accurately represent performance within operational aerospace applications. To address this limitation, the Testbed for Advanced Interface Materials in Vacuum (TAIMV) was developed as a modular vacuum-compatible thermal conductivity characterization platform capable of evaluating aerospace-relevant TIM configurations under both ambient and high-vacuum environments. The testbed was derived from the ASTM C1044-16 guarded hot plate methodology and incorporates interchangeable layers of stainless steel coupon geometries, independently controlled main and guard heaters, embedded resistance temperature detectors (RTDs), thermocouples, multi-layer insulation (MLI), and a temperature-controlled cold plate to characterize through-thickness thermal gradients across layered interfaces. In the current configuration, interface compression is limited to the nominal contact pressure generated by the experimental stack assembly. Initial experimental campaigns were conducted at ambient pressure and below 1×10-5 torr for vacuum cases using multiple interface materials including Braycote 601EF and Krytox-based greases across a range of thermal operating conditions. In parallel, a coupled numerical Python thermal model was developed to predict temperature distribution throughout the stack while accounting for conduction, radiation, and parasitic heat transfer pathways and effective interface resistance effects. Experimental measurements and numerical predictions showed consistent thermal trends across multiple operating conditions and environmental states. Results also revealed measurable differences between ambient and vacuum thermal behavior, demonstrating the importance of interface resistance, parasitic heat transfer mechanisms, and stack geometry in determining effective thermal performance within layered thermal interfaces. The presented work establishes a foundation for future thermal model correlation efforts and expanded characterization of aerospace thermal interface materials under representative environmental conditions. Future work will focus on the integration of a load cell system to enable controlled pressure-dependent characterization of thermal interface materials under compressive loading. This capability will allow investigation of the influence of contact pressure on effective thermal conductivity, interface resistance, and thermal performance within layered aerospace thermal interfaces under representative operational conditions.

Thermal Development Testing↗

Thermal conductivity of heterogeneous mixtures and lunar soils

The theoretical evaluation of the effective thermal conductivity of granular materials is discussed with emphasis upon the heat transport properties of lunar soil. The following types of models are compared: probabilistic, parallel isotherm, stochastic, lunar, and a model based on nonlinear heat flow system synthesis.

Vachon, R. I.↗

Heat Transfer in High-Temperature Fibrous Insulation

The combined radiation/conduction heat transfer in high-porosity, high-temperature fibrous insulations was investigated experimentally and numerically. The effective thermal conductivity of fibrous insulation samples was measured over the temperature range of 300-1300 K and environmental pressure range of 1.33 x 10(exp -5)-101.32 kPa. The fibrous insulation samples tested had nominal densities of 24, 48, and 72 kilograms per cubic meter and thicknesses of 13.3, 26.6 and 39.9 millimeters. Seven samples were tested such that the applied heat flux vector was aligned with local gravity vector to eliminate natural convection as a mode of heat transfer. Two samples were tested with reverse orientation to investigate natural convection effects. It was determined that for the fibrous insulation densities and thicknesses investigated no heat transfer takes place through natural convection. A finite volume numerical model was developed to solve the governing combined radiation and conduction heat transfer equations. Various methods of modeling the gas/solid conduction interaction in fibrous insulations were investigated. The radiation heat transfer was modeled using the modified two-flux approximation assuming anisotropic scattering and gray medium. A genetic-algorithm based parameter estimation technique was utilized with this model to determine the relevant radiative properties of the fibrous insulation over the temperature range of 300-1300 K. The parameter estimation was performed by least square minimization of the difference between measured and predicted values of effective thermal conductivity at a density of 24 kilograms per cubic meters and at nominal pressures of 1.33 x 10(exp -4) and 99.98 kPa. The numerical model was validated by comparison with steady-state effective thermal conductivity measurements at other densities and pressures. The numerical model was also validated by comparison with a transient thermal test simulating reentry aerodynamic heating conditions.

Daryabeigi, Kamran↗

A New Finite-Conductivity Droplet Evaporation Model Including Liquid Turbulence Effect

A new approach to account for finite thermal conductivity and turbulence effects within atomizing droplets of an evaporating spray is presented in this paper. The model is an extension of the T-blob and T-TAB atomization/spray model of Trinh and Chen [9]. This finite conductivity model is based on the two-temperature film theory in which the turbulence characteristics of the droplet are used to estimate the effective thermal diffusivity for the liquid-side film thickness. Both one-way and two-way coupled calculations were performed to investigate the performance cf this model against the published experimental data.

Balasubramanyam, M. S.↗

Mixed Carrier Conduction in Modulation-doped Field Effect Transistors

The contribution of more than one carrier to the conductivity in modulation-doped field effect transistors (MODFET) affects the resultant mobility and complicates the characterization of these devices. Mixed conduction arises from the population of several subbands in the two-dimensional electron gas (2DEG), as well as the presence of a parallel path outside the 2DEG. We characterized GaAs/AlGaAs MODFET structures with both delta and continuous doping in the barrier. Based on simultaneous Hall and conductivity analysis we conclude that the parallel conduction is taking place in the AlGaAs barrier, as indicated by the carrier freezeout and activation energy. Thus, simple Hall analysis of these structures may lead to erroneous conclusions, particularly for real-life device structures. The distribution of the 2D electrons between the various confined subbands depends on the doping profile. While for a continuously doped barrier the Shubnikov-de Haas analysis shows superposition of two frequencies for concentrations below 10(exp 12) cm(exp -2), for a delta doped structure the superposition is absent even at 50% larger concentrations. This result is confirmed by self-consistent analysis, which indicates that the concentration of the second subband hardly increases.

Schacham, S. E.↗

Thermal Characterization for a Modular 3-D Multichip Module

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

Fan, Mark S.↗

Aerogels for Thermal Insulation of Thermoelectric Devices

Silica aerogels have been shown to be attractive for use as thermal-insulation materials for thermoelectric devices. It is desirable to thermally insulate the legs of thermoelectric devices to suppress lateral heat leaks that degrade thermal efficiency. Aerogels offer not only high thermal- insulation effectiveness, but also a combination of other properties that are especially advantageous in thermoelectric- device applications. Aerogels are synthesized by means of sol-gel chemistry, which is ideal for casting insulation into place. As the scale of the devices to be insulated decreases, the castability from liquid solutions becomes increasingly advantageous: By virtue of castability, aerogel insulation can be made to encapsulate devices having any size from macroscopic down to nanoscopic and possibly having complex, three-dimensional shapes. Castable aerogels can permeate voids having characteristic dimensions as small as nanometers. Hence, practically all the void space surrounding the legs of thermoelectric devices could be filled with aerogel insulation, making the insulation highly effective. Because aerogels have the lowest densities of any known solid materials, they would add very little mass to the encapsulated devices. The thermal-conductivity values of aerogels are among the lowest reported for any material, even after taking account of the contributions of convection and radiation (in addition to true thermal conduction) to overall effective thermal conductivities. Even in ambient air, the contribution of convection to effective overall thermal conductivity of an aerogel is extremely low because of the highly tortuous nature of the flow paths through the porous aerogel structure. For applications that involve operating temperatures high enough to give rise to significant amounts of infrared radiation, opacifiers could be added to aerogels to reduce the radiative contributions to overall effective thermal conductivities. One example of an opacifier is carbon black, which absorbs infrared radiation. Another example of an opacifier is micron- sized metal flakes, which reflect infrared radiation. Encapsulation in cast aerogel insulation also can help prolong the operational lifetimes of thermoelectric devices that must operate in vacuum and that contain SiGe or such advanced skutterudite thermoelectric materials as CoSb3 and CeFe3.5Co0.5Sb12. The primary cause of deterioration of most thermoelectric materials is thermal decomposition or sublimation (e.g., sublimation of Sb from CoSb3) at typical high operating temperatures. Aerogel present near the surface of CoSb3 can impede the outward transport of Sb vapor by establishing a highly localized, equilibrium Sb vapor atmosphere at the surface of the CoSb3.

Sakamoto, Jeffrey↗

Effects of Doping on Thermal Conductivity of Pyrochlore Oxides for Advanced Thermal Barrier Coatings

Pyrochlore oxides of general composition, A2B2O7, where A is a 3(+) cation (La to Lu) and B is a 4(+) cation (Zr, Hf, Ti, etc.) have high melting point, relatively high coefficient of thermal expansion, and low thermal conductivity which make them suitable for applications as high-temperature thermal barrier coatings. The effect of doping at the A site on the thermal conductivity of a pyrochlore oxide La2Zr2O7, has been investigated. Oxide powders of various compositions La2Zr2O7, La(1.7)Gd(0.3)Zr2O7, La(1.7)Yb(0.3)Zr2O7 and La(1.7)Gd(0.15)Yb(0.15)Zr2O7 were synthesized by the citric acid sol-gel method. These powders were hot pressed into discs and used for thermal conductivity measurements using a steady-state laser heat flux test technique. The rare earth oxide doped pyrochlores La(1.7)Gd(0.3)Zr2O7, La(1.7)Yb(0.3)Zr2O7 and La(1.7)Gd(0.15)Yb(0.15)Zr2O7 had lower thermal conductivity than the un-doped La2Zr2O7. The Gd2O3 and Yb2O3 co-doped composition showed the lowest thermal conductivity.

Bansal, Narottam P.↗

Effects of Cone Penetrometer Testing on Shallow Hydrogeology at a Contaminated Site

Penetration testing is a popular and instantaneous technique for subsurface mapping, contaminant tracking, and the determination of soil characteristics. While the small footprint and reproducibility of cone penetrometer testing makes it an ideal method for in-situ subsurface investigations at contaminated sites, the effects to local shallow groundwater wells and measurable influence on monitoring networks common at contaminated sites is unknown. Physical and geochemical parameters associated with cone penetrometer testing were measured from a transect of shallow groundwater monitoring wells adjacent to penetrometer testing. For wells screened above the depth of cone refusal, the physical advancement and retraction of the cone had a significant effect ( p < 0.01) on water level for several pushes within 10 meters of a monitoring well, and a measured increase in specific conductivity. No effect on geochemistry or water level was observed in continuous monitoring data from wells screened below the depth of cone refusal, but variability in specific conductivity from these wells during penetration testing was only a fraction of the natural variation measured during precipitation events. Continuous measurements of specific conductivity and water level demonstrated that the effects of penetration testing have limited spatial and temporal distributions with a null effect post-testing.

54 ENVIRONMENTAL SCIENCES↗

Droplet Evaporation on Hot Micro-Structured Superhydrophobic Surfaces: Analysis of Evaporation from Droplet Cap and Base Surfaces

In this study, evaporation of sessile water droplets on hot micro-structured superhydrophobic surfaces is experimentally and theoretically investigated. Water droplets of 4 µL are placed on micro-pillared silicon substrates with the substrate temperature heated up to 120°C. A comprehensive thermal circuit model is developed to analyze the effects of substrate roughness and substrate temperature on the sessile droplet evaporation. For the first time, two components of heat and mass transfer, i.e., one from the droplet cap surface and the other from the droplet base surface, during droplet evaporation are distinguished and systematically studied. As such, the evaporation heat transfer rates from both the droplet cap surface and the interstitial liquid-vapor interface between micropillars at the droplet base are calculated in various conditions. For droplet evaporation on the heated substrates in the range of 40°C – 80°C, the predicted droplet cap temperature matches well with the experimental results. Furthermore, during the constant contact radius mode of droplet evaporation, the decrease of evaporation rate from the droplet base contributes most to the continuously decreasing overall evaporation heat transfer rate, whereas the decrease of evaporation rate from the droplet cap surface is dominant in the constant contact angle mode. The influence of internal fluid flow is considered for droplet evaporation on substrates heated above 100°C, and an effective thermal conductivity is adopted as a correction factor to account for the effect of convection heat transfer inside the droplet. Temperature differences between the droplet base and the substrate base are estimated to be about 2°C, 5°C, 8°C, 13°C and 18°C for droplet evaporation on substrates heated at 40°C, 60°C, 80°C, 100°C, and 120°C, respectively, elucidating the delayed or depressed boiling of water droplets on a heated rough surface due to evaporative cooling.

42 ENGINEERING↗