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This presentation will cover NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance Structure, NASA Electronic Parts and Packaging (NEPP) Program, NASA Electronic Parts Assurance Group (NEPAG), examples of assurance challenges, and future challenges.
The NASA Electronic Parts & Packaging Program Manager, requested a NASA Engineering and Safety Center independent assessment to summarize Commercial Crew Program and NASA Centers’ current and best practices, and lessons learned, on use of commercial-off-the-shelf (COTS) for all mission risk classifications, and provide recommendations that could lead to future NASA Electronic Parts and Packaging Program and/or Agency guidance on COTS parts. This document contains the outcome of the assessment.
Artificially produced electron beams were used extensively during the past decade as a means of probing the magnetosphere, and more recently as a means of actively controlling spacecraft potential. Experimentation in these areas has proven valuable, yet at times confusing, due to the interaction of the electron beam with the ambient plasma. The OSS-1/STS-3 Mission in March 1982 provided a unique opportunity to study beam-plasma interactions at an altitude of 240 km. On board for this mission was a Fast Pulse Electron Generator (FPEG). Measurements made by the Plasma Diagnostics Package (PDP) while extended on the Orbiter RMS show modifications of the ion and electron energy distributions during electron beam injection. Observations made by charged particle detectors are discussed and related to measurements of Orbiter potential. Several of the PDP instruments, the joint PDP/FPEG experiment, and observations made during electron beam injection are described.
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A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.
Entry Science Package preliminary design for Voyager flight capsule
This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.
Automating 'paper' workflow processes with electronic forms and email can dramatically improve the efficiency of those processes. However, applications that involve complex forms that are used for a variety of purposes or that require numerous and varied approvals often require additional software tools to ensure that (1) the electronic form is correctly and completely filled out, and (2) the form is routed to the proper individuals and organizations for approval. The prototype electronic purchase request (PEPR) system, which has been in pilot use at NASA Ames Research Center since December 1993, seamlessly links a commercial electronics forms package and a CLIPS-based knowledge system that first ensures that electronic forms are correct and complete, and then generates an 'electronic routing slip' that is used to route the form to the people who must sign it. The PEPR validation module is context-sensitive, and can apply different validation rules at each step in the approval process. The PEPR system is form-independent, and has been applied to several different types of forms. The system employs a version of CLIPS that has been extended to support AppleScript, a recently-released scripting language for the Macintosh. This 'scriptability' provides both a transparent, flexible interface between the two programs and a means by which a single copy of the knowledge base can be utilized by numerous remote users.
Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.
To increase contact conductance between two mating surfaces, a conductive tape has been developed by growing dense arrays of carbon nanotubes (CNTs, graphite layers folded into cylinders) on both sides of a thermally conductive metallic foil. When the two mating surfaces are brought into contact with the conductive tape in between, the CNT arrays will adhere to the mating surface. The van der Waals force between the contacting tubes and the mating surface provides adhesion between the two mating surfaces. Even though the thermal contact conductance of a single tube-to-tube contact is small, the tremendous amount of CNTs on the surface leads to a very large overall contact conductance. Interface contact thermal resistance rises from the microroughness and the macroscopic non-planar quality of mating surfaces. When two surfaces come into contact with each other, the actual contact area may be much less than the total area of the surfaces. The real area of contact depends on the load, the surface roughness, and the elastic and inelastic properties of the surface. This issue is even more important at cryogenic temperatures, where materials become hard and brittle and vacuum is used, which prevents any gas conduction through the interstitial region. A typical approach to increase thermal contact conductance is to use thermally conducting epoxies or greases, which are not always compatible with vacuum conditions. In addition, the thermal conductivities of these compounds are often relatively low. The CNTs used in this approach can be metallic or semiconducting, depending on the folding angle and diameter. The electrical resistivity of multiwalled carbon nanotubes (MWCNTs) has been reported. MWCNTs can pass a current density and remain stable at high temperatures in air. The thermal conductivity of a MWCNT at room temperature is measured to be approximately 3,000 W/m-K, which is much larger than that of diamond. At room temperature, the thermal conductance of a 0.3 sq cm array of CNTs was measured to be as high as 10 W/K. The high thermal conductivity and the nanoscale size make CNTs ideal as thermal interface materials. The CNT-based thermal tape can be used for the thermal management of microelectronic packages and electronic systems. It also can be integrated with current device technology and packaging. The material would allow for an efficient method to manage excess heat generation without requiring any additional power. Lastly, the CNT tape can be used to enhance thermal contact conductance across two mating surfaces on some NASA missions.
Molecular power supply synchronizer - logic, interconnect pattern and method, nonlinear load switch, packaging design, and system fabrication
Hardware, software, and service interfaces between capsule bus, entry science package, and Voyager spacecraft
High-temperature environment operable sensors and electronics are required for long-term exploration of Venus and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500 C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors in relevant environments. This talk will discuss a ceramic packaging system developed for high temperature electronics, and related testing results of SiC integrated circuits at 500 C facilitated by this high temperature packaging system, including the most recent progress.
Thin film circuit modules and packaging developed for communications and telemetry system
Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles
Operational support equipment preliminary design for entry science package portion of Voyager flight capsule system
Packaging system for extendable oriented photovoltaic and flat-plate thermoelectric solar arrays