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Digital Application Specific Integrated Circuit Design
Single radiation effects can be transient and static. The charge collected from radiation has a prompt (drift) and a slow (diffusion) component. This current spike causes disparate results: SEU, SET, SEB, MBU, and more. A system level SEE mitigation technique, used to overcome, is the triple module redundancy (TMR). TMR for system Verilog (TMR4SV), written in Python, is the first step towards design IP triplication. It allows various triplication methods for flip flops, clocks, and logic.
Project 21-0041 / ?Strategic Radiation Hardening of Advanced Radio Frequency Integrated Circuits?.
Abstract not provided.
Neutron Displacement Damage in Bipolar Junction Transistors Isolated from an Integrated Circuit
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Modeling Neutron Radiation Damage In Bipolar Junction Transistors Isolated from an Integrated Circuit
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Neural-Inspired Dendritic Multiplication Using a Reconfigurable Analog Integrated Circuit
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Ultra-high Bandwidth, Ultra-high Dynamic Range X-Ray Shock Characterization via Photonic Integrated Circuit
Nuclear weapon component assessment tests at the Z Machine rely on accurate X-ray yield measurements for model validation, design and analysis of component survivability, and source optimization. Yield measurement devices currently used do not provide the requisite certainty to enable accurate and efficient data analysis of test results, which leads to an increase in Z-shots required for evaluation, longer device development times, and higher operation costs. Additionally, current X-ray flux detectors lack high temporal resolution at the tails. Similarly, shock measurement techniques used for component assessment often lack the ability to spatially resolve wave behavior thereby limiting the ability to measure shock propagation dynamics needed to design the next generation of ND components. Here we present the development of a photonic micro-calorimeter and shock sensor consisting of meter-long waveguide spirals that are optomechanically coupled to X-ray absorbing layers to characterize yield and shock propagation at nanosecond timescales.
Subminiature deflection circuit operates integrated sweep circuits in TV camera
Small magnetic sweep deflection circuits operate a hand-held lunar television camera. They convert timing signals from the synchronizer into waveforms that provide a raster on the vidicon target. Raster size remains constant and linear during wide voltage and temperature fluctuations.
Self-correcting, synchronizing ring counter using integrated circuit devices
Three nand gate circuits are used to add error detection and reset logic circuitry for initiating and retaining the correct binary state in the flip-flop circuits of a ring counter. As the input signals are counted, the position of the specified state moves in ordered sequence around circuit loop.
Gain and noise considerations in integrated circuits R.F. feedback amplifiers.
Equivalent noise circuit applicable to active RF feedback amplifier
Electron microbeam testing of integrated circuits
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Study of Failure Modes of Multilevel Large Scale Integrated Circuits Interim Report, 15 Apr. - 14 Oct. 1968
Failure modes of large multilevel silicon microcircuit arrays
Process techniques study of integrated circuits Quarterly report no. 13
Dielectric defects in oxide layers by surface irregularities, and treatment
Inter-relations between advanced processing techniques, integrated circuits, materials development and analysis Quarterly report, 1 Mar. - 31 May 1969
Gyrator tuned circuit amplifier and microcircuit interconnections
Improved beam-lead interconnection structure for uncased integrated circuit chips
Interconnection structure eliminates several levels of manually made interconnections and shortens the path lengths from generator to load, permitting reduction in consumed power.
Integrated circuit flat-pack lead bender
Tool bends leads quickly and accurately for mounting on printed circuit boards. It has grooves and bend-angles aligned for particular circuit board applications.
An investigation of the strength of aluminum wire used in integrated circuits
Microloop pull test is developed to stress wire loops in situ until failure. The applied loads, the nature of the fracture, and its location are recorded. This test also stresses the wire bonds.