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At least 37 records · Page 2

Alumina-Reinforced Zirconia Composites

Alumina-reinforced zirconia composites, used as electrolyte materials for solid oxide fuel cells, were fabricated by hot pressing 10 mol percent yttria-stabilized zirconia (10-YSZ) reinforced with two different forms of alumina particulates and platelets each containing 0 to 30 mol percent alumina. Major mechanical and physical properties of both particulate and platelet composites including flexure strength, fracture toughness, slow crack growth, elastic modulus, density, Vickers microhardness, thermal conductivity, and microstructures were determined as a function of alumina content either at 25 C or at both 25 and 1000 C. Flexure strength and fracture toughness at 1000 C were maximized with 30 particulate and 30 mol percent platelet composites, respectively, while resistance to slow crack growth at 1000 C in air was greater for 30 mol percent platelet composite than for 30 mol percent particulate composites.

Choi, Sung R.↗

High-Temperature Characterization of Alumina Substrates and Folded Slot Antenna

The characterization of 99.6% polycrystalline alumina substrates and folded slot antennas is presented in this paper. Coplanar Waveguide (CPW) calibration standards where fabricated on 99.6% polycrystalline alumina substrates. Thru-Reflect-Line (TRL) calibrations were performed at temperatures of 25 to 400 C over a frequency range from 0.5 to 50 GHz. The effective dielectric constant of the alumina substrates was determined to be relatively constant at 5.4 from 25 to 200 C and then increased steadily to approximately 6 at 400 C. The loss of the CPW lines increased as temperature and frequency increased as well noting that the increase in loss is even more profound as both the temperature and frequency increased simultaneously. A CPW fed folded slot antenna fabricated on the alumina substrates is also presented. The Return Loss (RL) of a CPW fed folded slot antenna exhibits a self impedance matching technique. The RL of the folded slot antenna at 25 C displays a resonance at 3.5 GHz and is approximately 16 dB in magnitude. At 300 C the resonance shifts down in frequency to approximately 3.3 dB and has roughly the same magnitude. However the loss of the antenna response also increases at this elevated temperature. This work is part of the initial stages of an effort at NASA Glenn research Center to develop wireless sensors for harsh environments. This work can reduce cost, space to house all the hard wired connections, and reduce the weight of the overall units such as aerospace engines and allow for the placement of the wireless sensors in the engine which are not possible with hard wired sensors.

Scardelletti, Maximilian C.↗

Effects of Variable Aspect-Ratio Inclusions on the Electrical Impedance of an Alumina Zirconia Composite at Intermediate Temperatures

A series of alumina-yttria-stabilized zirconia composites containing either a high aspect ratio (5 and 30 mol%) hexagonal platelet alumina or an alumina low aspect ratio (5 and 30 mol%) spherical particulate was used to determine the effect of the aspect ratio on the temperature-dependent impedance of the composite material. The highest impedance across the temperature range of 373 to 1073 K is attributed to the grain boundary of the hexagonal platelet second phase in this alumina zirconia composite.

Goldsby, Jon C.↗

Moisture-Induced Alumina Scale Spallation: The Hydrogen Factor

For some time the oxidation community has been concerned with interfacial spallation of protective alumina scales, not just upon immediate cool down, but as a time-delayed phenomenon. Moisture-induced delayed spallation (MIDS) and desktop spallation (DTS) of thermal barrier coatings (TBCs) refer to this process. It is most apparent for relatively adherent alumina scales that have survived initial cool down in a dry environment, have built up considerable thickness and strain energy, and have been somewhat damaged, such as by cyclic oxidation cracking. Indeed, a "sensitive zone" can be described that maximizes the observed effect as a function of all the relevant factors. Moisture has been postulated to serve as a source of interfacial hydrogen embrittlement. Hydrogen is derived from reaction with aluminum in the alloy at an exposed interface. The purpose of this monograph is to trace the close analogy of this phenomenon to other hydrogen-induced effects, such as embrittlement of aluminides and blistering of alloys and anodic alumina films. A formalized, top-down, logic-tree structure is presented as a guide to this discussion. A theoretical basis for interfacial weakening by hydrogen is first cited, as are demonstrations of hydrogen detection as a reaction product or interfacial species. Further support is provided by critical experiments that recreate the moisture effect, but by isolating hydrogen from other potential causative factors. These experiments include tests in H 2-containing atmospheres or cathodic hydrogen charging. Accordingly, they strongly indicate that interfacial hydrogen, derived from moisture, is the key chemical species accounting for delayed alumina scale spallation.

Smialek, James L.↗

Interaction of hydrogen chloride with alumina

The influence of outgas conditions and temperature on the adsorptive properties of two aluminas Alon-c and Al6sG were studied using adsorption isotherm measurements. Alon-C and Al6SG were characterized using X-ray powder diffraction, thermogravimetric analysis (TGA), scanning electron microscopy (SEM) and BET nitrogen surface areas. Some of these techniques were applied to two other aluminas but no isotherm data was obtained. Isotherm data and techniques applied to each alumina are summarized in tabular form.

Bailey, R. R.↗

Fabrication of thin layer beta alumina

Beta alumina tubes having walls 700 microns, 300 microns, and 140 microns were processed by extrusion and sintering utilizing Ford proprietary binder and fabrication systems. Tubes prepared by this method have properties similar to tubes prepared by isostatic pressing and sintering, i.e. density greater than 98% of theoretical and a helium leak rate less than 3 x 10 to the -9th power cc/sq cm/sec. Ford ultrasonic bonding techniques were used for bonding beta alumina end caps to open ended beta -alumina tubes prior to sintering. After sintering, the bond was hermetic, and the integrity of the bonded area was comparable to the body of the tube.

Tennenhouse, G. J.↗

Dynamic Modulus and Damping of Boron, Silicon Carbide, and Alumina Fibers

The dynamic modulus and damping capacity for boron, silicon carbide, and silicon carbide coated boron fibers were measured from-190 to 800 C. The single fiber vibration test also allowed measurement of transverse thermal conductivity for the silicon carbide fibers. Temperature dependent damping capacity data for alumina fibers were calculated from axial damping results for alumina-aluminum composites. The dynamics fiber data indicate essentially elastic behavior for both the silicon carbide and alumina fibers. In contrast, the boron based fibers are strongly anelastic, displaying frequency dependent moduli and very high microstructural damping. Ths single fiber damping results were compared with composite damping data in order to investigate the practical and basic effects of employing the four fiber types as reinforcement for aluminum and titanium matrices.

Dicarlo, J. A.↗

Fabrication and evaluation of low fiber content alumina fiber/aluminum composites

The mechanical fabrication of low volume percent fiber, polycrystalline alumina fiber reinforced aluminum composites was accomplished. Wire preform material was prepared by liquid-metal infiltration of alumina fiber bundles. The wires were subsequently encapsulated with aluminum foil and fabricated into bulk composite material by hot-drawing. Extensive mechanical, thermal and chemical testing was conducted on preform and bulk material to develop a process and material data base. In addition, a preliminary investigation of mechanical forming of bulk alumina fiber reinforced aluminum composite material was conducted.

Hack, J. E.↗

Dynamic modulus and damping of boron, silicon carbide, and alumina fibers

The dynamic modulus and damping capacity for boron, silicon carbide, and silicon carbide-coated boron fibers were measured from -190 to 800 C. The single fiber vibration test also allowed measurement of transverse thermal conductivity for the silicon carbide fibers. Temperature-dependent damping capacity data for alumina fibers were calculated from axial damping results for alumina-aluminum composites. The dynamic fiber data indicate essentially elastic behavior for both the silicon carbide and alumina fibers. In contrast, the boron-based fibers are strongly anelastic, displaying frequency-dependent moduli and very high microstructural damping. The single fiber damping results were compared with composite damping data in order to investigate the practical and basic effects of employing the four fiber types as reinforcement for aluminum and titanium matrices.

Dicarlo, J. A.↗

The wetting characteristics and surface tension of some Ni-based alloys on yttria, hafnia, alumina, and zirconia substrates

The surface tension and wetting characteristics of four commercial Ni-based alloys (UD718, Waspaloy, UD720, and UD520), pure Ni, and three special alloys (Ni-20 percent Cr, Ni-20 percent Cr-1 percent Al, and Ni-20 percent Cr-4 percent Al) on various ceramic substrates (including alumina, zirconia, hafnia, and yttria) were investigated using sessile drop experiments. Most of the systems studied exhibited a nonwetting behavior. Wetting improved with holding time at a given temperature to the point that some systems, such as Ni-20Cr on alumina, Ni-20Cr-4Al on alumina and on yttria, became marginally wetting. Wetting characteristics were apparently related to constitutional undercooling, which in turn could be affected by the metal dissolving some of the substrate during measurements.

Kanetkar, C. S.↗

Modeling of lunar basalt petrogenesis - Sr isotope evidence from Apollo 14 high-alumina basalts

This paper reexamines the Sr isotope data available for the Apollo 14 high-alumina basalts in light of the assimilation and fractional crystallization (AFC) process model proposed by Neal et al. (1987, 1988, 1989). Positive linear correlations of Sr-87/Sr-86 with Rb-87/Rb-86 and the Sr abundance (both leading to KREEP) are used as evidence of such an AFC process in the petrogenesis of Apollo 14 high-alumina basalts. The existing Sr isotope data for Apollo 14 high-alumina basalts suggest that there were three AFC cycles.

Neal, C. R.↗

Au/Cr Sputter Coating for the Protection of Alumina During Sliding at High Temperatures

A sputter deposited bilayer coating of gold and chromium was investigated as a potential solid lubricant to protect alumina substrates in applications involving sliding at high temperature. The proposed lubricant was tested in a pin-on-disk tribometer with coated alumina disks sliding against uncoated alumina pins. Three test parameters; temperature, load, and sliding velocity were varied over a wide range in order to determine the performance envelope on the gold/chromium (Au/Cr) solid lubricant film. The tribo-tests were run in an air atmosphere at temperatures of 25 to 1000 C, under loads of 4.9 to 49.0 N and at sliding velocities from 1 to 15 m/sec. Post test analyses included surface profilometry, wear factor determination and scanning electron microscopy/energy dispersive spectroscopy (SEM/EDS) examination of worn surfaces. Compared to unlubricated Al2O3 sliding, the use of the Au/Cr film reduced friction by 30 to 50 percent and wear by one to two orders of magnitude. Increases in test temperature resulted in lower friction and the Au/Cr film continued to provide low friction, about 0.3, even at 1000 C. Pin wear factors and friction were largely unaffected by increasing loads up to 29.4 N. Sliding velocity had essentially no effect on friction, however, increased velocity reduced coating life (total sliding distance). Based upon these research results, the Au/Cr film is a promising lubricant for moderately loaded, low speed applications operating at temperatures as high as 1000 C.

Benoy, Patricia A.↗

Influence of Alumina Reaction Tube Impurities on the Oxidation of Chemically-Vapor-Deposited Silicon Carbide

Pure coupons of chemically vapor deposited (CVD) SiC were oxidized for 100 h in dry flowing oxygen at 1300 C. The oxidation kinetics were monitored using thermogravimetry (TGA). The experiments were first performed using high-purity alumina reaction tubes. The experiments were then repeated using fused quartz reaction tubes. Differences in oxidation kinetics, scale composition, and scale morphology were observed. These differences were attributed to impurities in the alumina tubes. Investigators interested in high-temperature oxidation of silica formers should be aware that high-purity alumina can have significant effects on experiment results.

Opila, Elizabeth↗

Compression Testing of Alumina Fiber Insulation

A series of tests were conducted to measure the response of alumina fiber insulation to compression loading. The alumina fiber insulation is a candidate gasket material for the Space Shuttle Government Furnished Equipment (GFE) Tile Overlay Repair. Tests were conducted at room temperature and 2300 F. The alumina fiber insulation is a fibrous insulation blanket which was supplied to Langley in two forms, a nominal 3 lb/ft3 version and a nominal 9 lb/ft3 version. The 3 lb/ft3 material was tested as sheets 0.15 and 0.25 inches thick and the 9 lb/ft3 material in sheets 1 inch thick. The material showed very non-linear compression behavior with the compressive resistance of the material increasing as the material was compressed. The 3 lb/ft3 0.15-inch thick material required 4.1 psi to reach the nominal installation thickness of 0.045 inches and retain a load of 2.1 lbs during unloading. Testing at 2300 F resulted in a stiffer more board-like material. The 3 lb/ft3 0.15-inch thick material retained 1 psi of compressive resistance after a 10 minute hold at 2300 F and 0.045 inches thickness.

Vaughn, Wallace L.↗

Moisture-Induced Alumina Scale Spallation: The Hydrogen Factor

For some time our community has been concerned with interfacial spallation of protective alumina scales, not just upon immediate cooldown, but as a time-delayed phenomenon. Moisture-induced delayed spallation (MIDS) and desktop spallation (DTS) of TBC's refer to this process. It is most apparent for relatively adherent alumina scales that have survived cool down in a dry environment, built up considerable thickness and strain energy, and have been somewhat damaged, such as by cyclic oxidation cracking. Indeed, a "sweet zone" can be defined that maximizes the observed effect as a function of all the relevant factors. Moisture has been postulated to serve as a source of interfacial hydrogen embrittlement derived from reaction with aluminum in the alloy at an exposed interface. The purpose of this monograph is to trace the close analogy of this phenomenon to other hydrogen effects, such as embrittlement of aluminides and blistering of alloys and anodic alumina films. A formalized, top-down, logic tree structure is presented as a guide to this discussion. A theoretical basis for interfacial weakening by hydrogen is first cited, as are demonstrations of hydrogen as a reaction product or detected interfacial species. Further support is provided by critical experiments that produce the same moisture effect, but by isolating hydrogen from other potential causative factors. These experiments include tests in H2-containing atmospheres or cathodic hydrogen charging.

Smialek, James L.↗

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Chen, Liang-Yu↗

Alumina Paste Sublimation Suppression Barrier for Thermoelectric Device

Alumina as a sublimation suppression barrier for a Zintl thermoelectric material in a thermoelectric power generation device operating at high temperature, e.g. at or above 1000K, is disclosed. The Zintl thermoelectric material may comprise Yb.sub.14MnSb.sub.11. The alumina may be applied as an adhesive paste dried and cured on a substantially oxide free surface of the Zintl thermoelectric material and polished to a final thickness. The sublimation suppression barrier may be finalized by baking out the alumina layer on the Zintl thermoelectric material until it becomes substantially clogged with ytterbia.

Paik, Jong-Ah↗

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

dielectric performance↗