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At least 37 records · Page 2

Enhancement of peptide bond formation by polyribonucleotides on clay surfaces in fluctuating environments

The selective effects of polyribonucleotides on the formation of glycine peptide bonds in glycine on clay surfaces are investigated as a model for a template mechanism for the effects of polynucleotides on peptide bond formation. Free oligoglycine yields were determined for the cycling reaction of glycine in the presence and absence of clay and polyribonucleotides or polydeoxyribonucleotides. The polyribonucleotides are observed to lead to increases of up to fourfold increases in oligoglycine formed, with greater enhancements for poly-G nucleotides than for poly-A, poly-U and poly-C, indicating a codonic bias. Polydeoxyribonucleotides are found to provide no enhancement in peptide formation rates, and yields were also greatly reduced in the absence of clay. A mechanism for peptide synthesis is proposed which involves the activation of glycine on the clay surface, followed by the formation of esters between glycine and the 2-prime OH groups of the polyribonucleotide and peptide bonds between adjacent amino acyl esters. It is pointed out that if this mechanism is correct, it may provide a basis for a direct template translation process, which would produce a singlet genetic code.

White, D. H.↗

Low Earth Orbital Atomic Oxygen Interactions With Materials

Atomic oxygen is formed in the low Earth orbital environment (LEO) by photo dissociation of diatomic oxygen by short wavelength (< 243 nm) solar radiation which has sufficient energy to break the 5.12 eV O2 diatomic bond in an environment where the mean free path is sufficiently long (~ 108 meters) that the probability of reassociation or the formation of ozone (O3) is small. As a consequence, between the altitudes of 180 and 650 km, atomic oxygen is the most abundant species. Spacecraft impact the atomic oxygen resident in LEO with sufficient energy to break hydrocarbon polymer bonds, causing oxidation and thinning of the polymers due to loss of volatile oxidation products. Mitigation techniques, such as the development of materials with improved durability to atomic oxygen attack, as well as atomic oxygen protective coatings, have been employed with varying degrees of success to improve durability of polymers in the LEO environment. Atomic oxygen can also oxidize silicones and silicone contamination to produce non-volatile silica deposits. Such contaminants are present on most LEO missions and can be a threat to performance of optical surfaces. The LEO atomic oxygen environment, its interactions with materials, results of space testing, computational modeling, mitigation techniques, and ground laboratory simulation procedures and issues are presented.

Banks, Bruce A.↗

Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs

Degradation of wire bonds (WBs) is one of the major factors limiting reliability of plastic encapsulated microcircuits (PEMs) at high temperatures. Use of PEMs in military and aerospace applications requires extended and thorough evaluation of encapsulating materials and reliability of packages in harsh environments. However, the effect of environmental conditions on characteristics of molding compounds (MCs) and reliability of wire bonds has not been studied sufficiently to date. In this work, two types of PEMs in QFP-style packages have been stored in different environments at temperatures from 130 C to 225 C for up to 4,500 hours in some cases. To assess the effect of oxygen, the parts were aged at 198 C in air and vacuum chambers. The effect of humidity was evaluated during long-term highly accelerated temperature and humidity stress testing (HAST) at temperatures of 130 C and 150 C. Thermo-mechanical and thermo-gravimetrical analyses were used to evaluate the effect of environment on characteristics of molding compound used. Measurements of contact resistances of wire bonds and their mechanical strength were employed to monitor degradation of wire bonds throughout the testing. Correlation between degradation of MC and WB failures has been analyzed. The effect of environmental conditions on accelerating factors of WB failures has been assessed, and the mechanism of wire bond degradation due to the presence of moisture and oxygen is discussed.

Teverosky, Alexander↗

Failure analysis for composite laminates

A discussion of the tensor polynomial failure criterion is presented together with a description of a biaxial compression test procedure used in the evaluation of the interaction strength parameters. In addition, a formulation for predicting the fatigue life of laminates is given based on the experimental evaluation of fatigue functions which are also utilized in a form of the tensor polynomial failure criterion as well. Experimental results are provided to compare with the fatigue life predictions and to demonstrate the effect of flaws and environment. Both bond-line defects in sandwich beam construction and inter-laminar disbond flaws are studied. Up to present, compressive strength test data have been obtained for ambient and elevated temperature, moisture-saturated conditions, including results from thermal-spike cycling simulating supersonic flight.

Tennyson, R. C.↗

LCF Life of As-Deposited and Annealed NiCr-Y Coatings for Oxidation and Hot Corrosion Protection of Disk Alloys

Increasing temperatures in aero gas turbines is resulting in oxidation and hot corrosion attack of turbine disks. Since disks are sensitive to low cycle fatigue (LCF), any environmental attack, and especially hot corrosion pitting, can seriously degrade the life of the disk. Application of metallic coatings is one means of protecting disk alloys from this environmental attack. However, the presence of a metallic coating can degrade the LCF life of a disk alloy. Therefore, coatings must be designed which are not only resistant to oxidation and corrosion attack, but do not significantly degrade the LCF life of the alloy.Three different NiCr-Y coating compositions (29, 35.5, 44 wt.% Cr, all with 0.1 wt.% Y) were applied at two thicknesses by Plasma Enhanced Magnetron Sputtering (PEMS) to two similar Ni-based disk alloys. One Ni-35.5Cr-0.1Y coating also received a thin ZrO2 overcoat. The coated samples were also given a short thermal anneal in a low PO2 environment to encourage bonding of the coating and substrate as well as initiating formation of a chromia scale. Without further environmental exposure, the LCF life of coated and uncoated samples was evaluated at 760°C in air. The LCF lifetime of all coated samples was less than that of uncoated samples. The LCF life scaled with the Cr content and the high-Cr, thin coating showed the highest LCF life. Pre and post-test characterization of the various coatings, including identification of crack initiation sites, will be presented and the effect of the coating on the LCF life discussed.

low cycle fatigue↗

Assessment of Proper Bonding Methods and Mechanical Characterization FPGA CQFPs

This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.

Davis, Milton C.↗

Constrained Vapor Bubble

The nonisothermal Constrained Vapor Bubble, CVB, is being studied to enhance the understanding of passive systems controlled by interfacial phenomena. The study is multifaceted: 1) it is a basic scientific study in interfacial phenomena, fluid physics and thermodynamics; 2) it is a basic study in thermal transport; and 3) it is a study of a heat exchanger. The research is synergistic in that CVB research requires a microgravity environment and the space program needs thermal control systems like the CVB. Ground based studies are being done as a precursor to flight experiment. The results demonstrate that experimental techniques for the direct measurement of the fundamental operating parameters (temperature, pressure, and interfacial curvature fields) have been developed. Fluid flow and change-of-phase heat transfer are a function of the temperature field and the vapor bubble shape, which can be measured using an Image Analyzing Interferometer. The CVB for a microgravity environment, has various thin film regions that are of both basic and applied interest. Generically, a CVB is formed by underfilling an evacuated enclosure with a liquid. Classification depends on shape and Bond number. The specific CVB discussed herein was formed in a fused silica cell with inside dimensions of 3x3x40 mm and, therefore, can be viewed as a large version of a micro heat pipe. Since the dimensions are relatively large for a passive system, most of the liquid flow occurs under a small capillary pressure difference. Therefore, we can classify the discussed system as a low capillary pressure system. The studies discussed herein were done in a 1-g environment (Bond Number = 3.6) to obtain experience to design a microgravity experiment for a future NASA flight where low capillary pressure systems should prove more useful. The flight experiment is tentatively scheduled for the year 2000. The SCR was passed on September 16, 1997. The RDR is tentatively scheduled for October, 1998.

Huang, J.↗

Adhesive bonding and the use of corrosion resistant primers

The use of an anti-corrosive primer has been shown to be essential to assure survival of a bonded structure in a hostile environment, particularly if a stress is to be applied to the adhesively bonded joint during the environmental exposure. For example, the Lockheed L-1011 TriStar assembly, after exhaustive evaluation tests specifies use of chromate filled inhibitive polysulfide sealants, and use of corrosion inhibiting adhesive primers prior to structural bonding with film adhesive.

Hockridge, R. R.↗

Catalysis of peptide bond formation by histidyl-histidine in a fluctuating clay environment

The condensation of glycine to form oligoglycines during wet-dry fluctuations on clay surfaces was enhanced up to threefold or greater by small amounts of histidyl-histidine. In addition, higher relative yields of the longer oligomers were produced. Other specific dipeptides tested gave no enhancement, and imidazole, histidine, and N-acetylhistidine gave only slight enhancements. Histidyl-histidine apparently acts as a true catalyst (in the sense of repeatedly catalyzing the reaction), since up to 52 nmol of additional glycine were incorporated into oligoglycine for each nmol of catalyst added. This is the first known instance of a peptide or similar molecule demonstrating a catalytic turnover number greater than unity in a prebiotic oligomer synthesis reaction, and suggests that histidyl-histidine is a model for a primitive prebiotic proto-enzyme. Catalysis of peptide bond synthesis by a molecule which is itself a peptide implies that related systems may be capable of exhibiting autocatalytic growth.

White, D. H.↗

Copper/nickel eutectic brazing of titanium

Technique joins titanium or one of its alloys to materials, such as iron, nickel or cobalt base material, or to refractory metals. To ensure formation of a satisfactory bond, the temperature, time, environment and pressure must be controlled.

Kutchera, R. E.↗

Development of LARC-13 adhesive systems

Various adhesive formulations were evaluated and the effects of various environments upon different titanium bond surface treatments were noted. Initial data show LARC-13 to possess good 589K (600 F) stability as compared to other high temperature stable systems.

Hoggatt, J. T.↗

Clays as prebiotic photocatalysts

Clay minerals catalyze peptide bond formation in fluctuating environments. A number of plausible mechanisms have been proposed and tested. The possibility that clays may actually be energizing the reaction by means of electronic excitation, creating mobile or trapped holes and electrons in the lattice, is explored. It has been discovered that clays emit light upon dehydration. The correlation between dehydration-induced, or thermoluminescent, processes and the yield of glycine oligomers after treatments known to affect the luminescent yields is being tested, in an effort to understand the catalytic mechanism

Coyne, L. M.↗

NASA Tech Briefs, April 2012

Topics include: Computational Ghost Imaging for Remote Sensing; Digital Architecture for a Trace Gas Sensor Platform; Dispersed Fringe Sensing Analysis - DFSA; Indium Tin Oxide Resistor-Based Nitric Oxide Microsensors; Gas Composition Sensing Using Carbon Nanotube Arrays; Sensor for Boundary Shear Stress in Fluid Flow; Model-Based Method for Sensor Validation; Qualification of Engineering Camera for Long-Duration Deep Space Missions; Remotely Powered Reconfigurable Receiver for Extreme Environment Sensing Platforms; Bump Bonding Using Metal-Coated Carbon Nanotubes; In Situ Mosaic Brightness Correction; Simplex GPS and InSAR Inversion Software; Virtual Machine Language 2.1; Multi-Scale Three-Dimensional Variational Data Assimilation System for Coastal Ocean Prediction; Pandora Operation and Analysis Software; Fabrication of a Cryogenic Bias Filter for Ultrasensitive Focal Plane; Processing of Nanosensors Using a Sacrificial Template Approach; High-Temperature Shape Memory Polymers; Modular Flooring System; Non-Toxic, Low-Freezing, Drop-In Replacement Heat Transfer Fluids; Materials That Enhance Efficiency and Radiation Resistance of Solar Cells; Low-Cost, Rugged High-Vacuum System; Static Gas-Charging Plug; Floating Oil-Spill Containment Device; Stemless Ball Valve; Improving Balance Function Using Low Levels of Electrical Stimulation of the Balance Organs; Oxygen-Methane Thruster; Lunar Navigation Determination System - LaNDS; Launch Method for Kites in Low-Wind or No-Wind Conditions; Supercritical CO2 Cleaning System for Planetary Protection and Contamination Control Applications; Design and Performance of a Wideband Radio Telescope; Finite Element Models for Electron Beam Freeform Fabrication Process Autonomous Information Unit for Fine-Grain Data Access Control and Information Protection in a Net-Centric System; Vehicle Detection for RCTA/ANS (Autonomous Navigation System); Image Mapping and Visual Attention on the Sensory Ego-Sphere; HyDE Framework for Stochastic and Hybrid Model-Based Diagnosis; and IMAGESEER - IMAGEs for Education and Research.

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