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At least 37 records · Page 2

The Conductor-Dielectric Junctions in a Low Density Plasma

A conductor-dielectric junction exposed to the space environment is a frequent spacecraft design feature. Due to spacecraft charging and/or solar array operation, the conductor can acquire a high potential with respect to the surrounding plasma. If this potential is positive the insulators adjacent to exposed conductors can collect current as if they were conductors themselves. This phenomenon, called snapover, results in a substantial increase in current collection, and may even result in a glow discharge if the potential is high enough. If a conductor has a negative potential, arcing can occur at the site of a junction. Both of these phenomena negatively affect spacecraft operation. To prevent negative consequences, the physical mechanisms of snapover and arc inception require investigation. In this paper, results are presented of an experimental and theoretical study of snapover, glow discharge, and arc phenomena for different materials immersed in argon or xenon plasmas. The effect of snapover is investigated for several metal-dielectric junctions: copper-teflon, copper-Kapton, copper-glass, aluminum-teflon, aluminum-Kapton, steel-teflon, anodized aluminum with pinholes, and copper-ceramics. I-V curves are measured and snapover inception voltages, essential parameters (increase in current and collection area due to secondary electrons), and glow discharge inception thresholds are determined. Optical spectra are obtained for glow discharges in both argon and xenon plasmas. These spectra provide information regarding atomic species entrapped in the glow region. Some spectral lines can be used to estimate plasma parameters in the discharge area. A video-camera and linear array were used to confirm that snapover inception is accompanied by very low intensity visible light emission. This result seems to be important for the estimate of the light pollution around spacecraft. Optical spectra (wavelengths 380-650 nm) of arcs are also obtained on a negatively biased chromic acid anodized aluminum plate immersed in low density argon and xenon plasmas. Analysis of these spectra confirms our earlier findings that aluminum atoms are ejected from the arc site. Moreover, it is found that chromium atoms are also quite abundant in the arc plasma. It is believed that the latter results contribute considerably to the understanding of processes of plasma contamination caused by arcing.

Vayner, Boris

Free Molecular Heat Transfer Programs for Setup and Dynamic Updating the Conductors in Thermal Desktop

The programs, arrays and logic structure were developed to enable the dynamic update of conductors in thermal desktop. The MatLab program FMHTPRE.m processes the Thermal Desktop conductors and sets up the arrays. The user needs to manually copy portions of the output to different input regions in Thermal Desktop. Also, Fortran subroutines are provided that perform the actual updates to the conductors. The subroutines are setup for helium gas, but the equations can be modified for other gases. The maximum number of free molecular conductors allowed is 10,000 for a given radiation task. Additional radiation tasks for FMHT can be generated to account for more conductors. Modifications to the Fortran subroutines may be warranted, when the mode of heat transfer is in the mixed or continuum mode. The FMHT Thermal Desktop model should be activated by using the "Case Set Manager" once the model is setup. Careful setup of the model is needed to avoid excessive solve times.

Malroy, Eric T.

Method and apparatus for preparing multiconductor cable with flat conductors

A method and apparatus for preparing flat conductor cable having a plurality of ribbon-like conductors disposed upon and adhesively bonded to the surface of a substrate is described. The conductors are brought into contact with the substrate surface, and while maintained in axial tension on said substrate, the combination is seated on a yieldably compressible layer to permit the conductor to become embedded into the surface of the substrate film.

Marcell, G. V.

Novel Processing, Testing and Characterization of Copper/Carbon Nanotube (Cu/CNT) Yarn Composite Conductor

Sustainable electrified aircraft propulsion (EAP) is likely to lead to an increase in the electrical wiring contained within a single aircraft. Since the electrical resistance and mass of copper (Cu) conductors are associated with power losses, it is desirable to design high-conductivity lightweight conductor materials, thus reducing the mass of components like motor windings, low-voltage signal cables, and transmission cables for data and power to improve the overall energy efficiency. This paper describes a unique framework for manufacturing metalized carbon nanotube (CNT) composite conductors, measuring their electrical conductivity and strength, and modeling the overall conductivity and current sharing within such composites. Tensile testing was conducted on the processed composite conductor cables with the use of acoustic emission and electrical resistivity to determine stress-dependent-failure mechanisms while monitoring the electrical conductivity. The average of measured electrical conductivities of annealed Cu/CNT samples from batch 5 was greater than theoretical predictions by 9.8 percent and was also greater than the conductivity of pure annealed Cu by 4.8 percent and had comparable ultimate tensile strengths. Additionally, those Cu/CNT samples provide a 13.5% weight saving over current state of the art copper wires. Theories explaining improved intrinsic conductivity are discussed.

Metalized CNT

Slitting flat conductor cables with the single cutting edge slitter

Manually operated slitter can cut single slit in flat conductor cable to any desired length. Lateral position of flat conductor cable is adjusted with aid of optical magnifier and cursor glass to ensure that slit is accurately placed between conductors. Multiple slits may be made by repeating procedure for single slit.

Angele, W.

Batch fabrication process development for ferrite logic conductors

A process for fabricating ultrareliable magnetic ferrite logic circuits is described in which the conductors are formed by a combination of two batch type processes - photolithography and electroplating - and a mechanized writing process for completing conductors in the third dimension. Up to 4 turns, through an aperture 1 mm in diameter, are formed by the described process. The number of joints in the conductors is reduced by use of this process to only those which are required for input, output and power connections of a logic block. To demonstrate feasibility, 8-stage magnetic ring counter circuits have been fabricated.

Heckler, C. H., Jr.

New solid conductors of Na/+/ and K/+/ ions

About 40 structure types for solid conductors of Na(+) and K(+) ions are surveyed. Five compounds in three structure types are discovered to be good solid conductors of alkali metal ions, capable of ion transport with conductivities in the vicinity of 0.00001/ohm-cm at 25 C. These compounds are a bcc form of NaSbO3, an orthorhombic layer structure of the composition 2M2O.3Nb2O5 with M equal to Na or K, and the Na pyrochlores NaTa2O5F and NaTaWO6. Ion exchange is required to produce each of these Na compounds. Only the 2K2O.3Nb2O5 can so far be synthesized directly from the oxides and thus is the only one which can be sintered readily. The niobate is about as good a conductor of K(+) ion as is K-beta alumina. The NaSbO3 compares well with Na beta at 280 C. A number of phase diagrams are developed.

Singer, J.

Flat conductor cable commercialization project

An undercarpet flat conductor cable and a baseboard flat conductor cable system were studied for commercialization. The undercarpet system is designed for use in office and commercial buildings. It employs a flat power cable, protected by a grounded metal shield, that terminates in receptacles mounted on the floor. It is designed to interface with a flat conductor cable telephone system. The baseboard system consists of a flat power cable mounted in a plastic raceway; both the raceway and the receptacles are mounted on the surface of the baseboard. It is designed primarily for use in residential buildings, particularly for renovation and concrete and masonry construction.

Hogarth, P.

Properties and performance of fine-filament bronze-process Nb3Sn conductors

Fine-filament bronze-process Nb3Sn superconductors were fabricated to fulfill stringent requirements on critical current under tension in a one-inch bend diameter, current density, stability, and conductor losses. A large fraction of niobium filaments was incorporated in a bronze matrix, and a cable containing 4453 2-micron diameter filaments in each of six strands provided a current density of 85,000 A/sq cm at 10 to the -11th ohm-cm, 10 T, and 4.2 K. The next step was to incorporate copper stabilizer in a conductor with 20,538 filaments. These conductors, fabricated so that bend strains of about 1% would be experienced by the filaments in the one-inch bend, stably carried currents in the 200-500 A range. A quench current of 540 A in a 5-cm bend corresponds to 158,000 A/sq cm in the bronze and filament area, believed to be the highest critical current density reported for multifilamentary Nb3Sn.

Walker, M. S.

Flexible, Polymer-Filled Metallic Conductors

Procedure developed to make materials both flexible and reasonably good electrical conductors. Metal or polymer sheet substrate cleaned with beam of energetic inert-gas ions to remove adsorbed gases and contaminants from surface. After cleaning, substrate coated by cosputter deposition of both conductive metal and flexible polymer. Removed by either mechanical or chemical-dissolution technique, and resulting flexible metal/polymer conductor bonded at low temperature to conductor-surface contacts.

Banks, Bruce A.

A simple node and conductor data generator for SINDA

This paper presents a simple, automated method to generate NODE and CONDUCTOR DATA for thermal match modes. The method uses personal computer spreadsheets to create SINDA inputs. It was developed in order to make SINDA modeling less time consuming and serves as an alternative to graphical methods. Anyone having some experience using a personal computer can easily implement this process. The user develops spreadsheets to automatically calculate capacitances and conductances based on material properties and dimensional data. The necessary node and conductor information is then taken from the spreadsheets and automatically arranged into the proper format, ready for insertion directly into the SINDA model. This technique provides a number of benefits to the SINDA user such as a reduction in the number of hand calculations, and an ability to very quickly generate a parametric set of NODE and CONDUCTOR DATA blocks. It also provides advantages over graphical thermal modeling systems by retaining the analyst's complete visibility into the thermal network, and by permitting user comments anywhere within the DATA blocks.

Gottula, Ronald R.

Ionization Properties of Molecules Commonly Used for Plasma Processing of Semi-Conductors

Two types of processes are involved in plasma processing of semi-conductors. They are: plasma etching or cleaning and plasma deposition of the semi-conducting materials. For plasma etching of semi-conductors mostly halogen containing gases are used as additives to gases such as O2 and N2. For plasma deposition gases such as C2H2, SiH4, Si2H6 have been tested in the past. For an optimal performance of a reactor it is important to model the plasma. In this modeling effort electron impact excitation and ionization cross sections play a central role. For ionization balance calculations values of ionization cross sections are needed. Ion molecule reactions determine the ultimate composition of the plasma. Recently it has been discovered that the by products of many of these plasmas are per fluro hydrocarbons (PFCs) which are highly infrared absorbing species and have long life times in the atmosphere. They cause global warming. A lot of research is being pursued at the present time to find alternative molecules which do not produce global warming gases as the and product of the plasma processing reactor. There is also interest in the ionization and dissociative ionization properties of these molecules from the point view of the plasma abatement of the pollutant gases at the exhaust of the semi-conductor processing reactors. At the conference ionization and dissociative ionization properties of some of these molecules will be presented.

Srivastava, S. K.

Effects of via-conductor geometry in the electromigration failure of Al:Cu wires

Electromigration (EM) experiments conducted using two types of via/plug to conductor alignment indicate a geometrical dependence of electromigration failure in Al:Cu conductors. The resistance vs time curves show distinctive steps when the alignment is parallel. This is explained by a successive loss of conductivity through the plug due to void formation. In the perpendicular via/conductor arrangement, resistance increases by smaller and closely spaced steps. EM experiments without vias, found that the conductor life under stress increases by at least an order of magnitude. Kinetic studies at four temperatures between 180-240 C found activation energies to be 1.0 plus or minus 0.1eV.

Al:Cu accelerated testing electromigration activat

Special tool seals conductors with combination of plastic sleeves

Special tool seals electrical conductors connecting instrumentation within space vehicle cryogenic fuel tanks and oxidizer tanks. An inner sleeve of fluorinated ethylene-propylene and an outer sleeve of tetrafluoroethylene enclose a bundle of conductors and are heated with the tool to form a tight seal of the bundle and each individual wire.

Young, S.

Parallel-gap welding for joints between copper conductors and Kovar

Welding technique produces more reliable joints than soldering. Investigation used different sizes of copper conductors and component lead ribbons, corrosion protection platings, and melting points of metals being joined. Optimum combination is gold-plated component lead ribbons and solder-plated copper conductors.

Mc Daniel, G. E.

Termination of flat conductor cable to NASA/MSFC plugs

Data, supplemented with artwork, are presented on the major steps involved with terminating flat conductor cable (FCC) to MSFC's FCC plugs. Cable and shield preparation steps include material cutting, insulation stripping, and plating of exposed conductors. Methods and equipment required to terminate FCC to each of four MSFC plugs are described.

Angele, W.

Testing of flat conductor cable to Underwriters Laboratory standards UL719 and UL83

The flat conductor cable (FCC) which was tested consisted of three AWG No. 12 flat copper conductors laminated between two films of polyethylene terephthalate (Mylar) insulation with a self-extinguishing polyester adhesive. Results of the tests conducted on this cable, according to specifications, warrants the use of this FCC for electrical interconnections in a surface nonmetallic protective covering.

Loggins, R. W.