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Printed-circuit stick module has reduced comb technique to six steps, cutting process time by approximately 50%. Method incorporates all type of components into one assembly. It reduces design and fabrication time for 14-lead flat pack to less than four hours and for the 22-lead flat pack to four hours. Average weight of each flat pack is also reduced to 2 g.
This viewgraph presentation reviews the features of the Lithium-ion batteries, particularly in reference to the hazards and safety of the battery. Some of the characteristics of the Lithium-ion cell are: Highest Energy Density of Rechargeable Battery Chemistries, No metallic lithium, Leading edge technology, Contains flammable electrolyte, Charge cut-off voltage is critical (overcharge can result in fire), Open circuit voltage higher than metallic lithium anode types with similar organic electrolytes. Intercalation is a process that places small ions in crystal lattice. Small ions (such as lithium, sodium, and the other alkali metals) can fit in the interstitial spaces in a graphite lattice. These metallic ions can go farther and force the graphitic planes apart to fit two, three, or more layers of metallic ions between the carbon sheets. Other features of the battery/cell are: The graphite is conductive, Very high energy density compared to NiMH or NiCd, Corrosion of aluminum occurs very quickly in the presence of air and electrolyte due to the formation of HF from LiPF6 and HF is highly corrosive. Slides showing the Intercalation/Deintercalation and the chemical reactions are shown along with the typical charge/discharge for a cylindrical cell. There are several graphs that review the hazards of the cells.
We propose a novel method to compute in an exact manner the left-hand cut discontinuity of the electron-Atom partial wave scattering amplitude in the complex energy plane within the static stage approximation. Zero energy dispersion relations for electron-Hydrogen scattering are computed numerically for illustration.
To cut the lag-lead in motor-driven timing devices, the timing circuit has been extended to include a second switch. This is actuated in time with the first but driven directly at a speed x times faster than the first.
Circuit at output of incremental transducer records progress of longwall shearer. In contrast to mechanical shaft encoders, electronic circuit can be easily packaged to withstand shock and vibration of mining machine as it cuts across coal seam.
The Electrical Capacitance Volume Tomography (ECVT) system has been designed to complement the tools created to sense the presence of water in nonconductive spacecraft materials, by helping to not only find the approximate location of moisture but also its quantity and depth. The ECVT system has been created for use with a new image reconstruction algorithm capable of imaging high-contrast dielectric distributions. Rather than relying solely on mutual capacitance readings as is done in traditional electrical capacitance tomography applications, this method reconstructs high-resolution images using only the self-capacitance measurements. The image reconstruction method assumes that the material under inspection consists of a binary dielectric distribution, with either a high relative dielectric value representing the water or a low dielectric value for the background material. By constraining the unknown dielectric material to one of two values, the inverse math problem that must be solved to generate the image is no longer ill-determined. The image resolution becomes limited only by the accuracy and resolution of the measurement circuitry. Images were reconstructed using this method with both synthetic and real data acquired using an aluminum structure inserted at different positions within the sensing region. The cuboid geometry of the system has two parallel planes of 16 conductors arranged in a 4 4 pattern. The electrode geometry consists of parallel planes of copper conductors, connected through custom-built switch electronics, to a commercially available capacitance to digital converter. The figure shows two 4 4 arrays of electrodes milled from square sections of copper-clad circuit-board material and mounted on two pieces of glass-filled plastic backing, which were cut to approximately square shapes, 10 cm on a side. Each electrode is placed on 2.0-cm centers. The parallel arrays were mounted with the electrode arrays approximately 3 cm apart. The open ends were surrounded by a metal guard to reduce the sensitivity of the electrodes to outside interference and to help maintain the spacing between the arrays. Other uses for this innovation potentially include quantifying the amount of commodity remaining in the fuel and oxidizer tanks while on-orbit without having to fire spacecraft engines. Another orbit application is moisture sensing in plant-growth experiments because microgravity causes moisture in soil to distribute itself in unusual ways. At the moment, the hardware and image reconstruction technique may only be of interest to people involved in nondestructive evaluation. The reconstructed image takes almost a full week to reproduce with existing computer power. However, because computer power and speeds follows Moore s Law, execution times are likely to become acceptable within the next five to eight years. The code was written in Mathematica for dedicated use with the ECVT system. In its present form, it is not suitable to be used directly as a consumer product. However, the code could be likely improved by rewriting it in a compiled language such as C or Fortran.
During the early development stage of balloon deployment systems for missions, nichrome wire cable cutters were often used in place of pyro-actuated cutters. Typically, a nichrome wire is wrapped around a bundle of polymer cables with a low melting point and connected to a relay-actuated electric circuit. The heat from the nichrome reduces the strength of the cable bundle, which quickly breaks under a mechanical load and can thus be used as a release mechanism for a deployment system. However, the use of hand-made heated nichrome wire for cutters is not very reliable. Often, the wrapped nichrome wire does not cut through the cable because it either pulls away from its power source or does not stay in contact with the cable being cut. Because nichrome is not readily soldered to copper wire, unreliable mechanical crimps are often made to connect the nichrome to an electric circuit. A self-contained device that is reusable and reliable was developed to sever cables for device release or deployment. The nichrome wire in this new device is housed within an enclosure to prevent it from being damaged by handling. The electric power leads are internally connected within the unit to the nichrome wire using a screw terminal connection. A bayonet plug, a quick and secure method of connecting the cutter to the power source, is used to connect the cutter to the power leads similar to those used in pyro-cutter devices. A small ceramic tube [0.25-in. wide 0.5-in. long (.6.4-mm wide 13-mm long)] houses a spiraled nichrome wire that is heated when a cable release action is required. The wire is formed into a spiral coil by wrapping it around a mandrel. It is then laid inside the ceramic tube so that it fits closely to the inner surface of the tube. The ceramic tube provides some thermal and electrical insulation so that most of the heat generated by the wire is directed toward the cable bundle in the center of the spiral. The ceramic tube is cemented into an aluminum block, which holds it in position. The leads of the nichrome wire are attached to screw terminals that connect them to power leads. A bayonet plug mounted at the bottom of the rectangular block connects the power leads to a relay circuit. A thin aluminum shell encloses the entire structure, leaving access points to attach to the bayonet plug and to feed a cable into the cylinder. The access holes for the deployment cable are a smaller diameter than the nichrome coil to prevent the cable from coming in direct contact with the nichrome when loaded. It uses the same general method of severing a cable with a heated wire as was used previously, but implements it in such a way that it is more reliable and less prone to failure. It creates a mechanism to create repeatability that was nonexistent in the previous method.
Instrument includes four temperature-sensing, Y-cut quartz crystals to determine wind direction, velocity, and temperature. Two additional AT-cut crystals are used to determine air humidity. Entire signal processing is provided by built-in electronics circuits.
A power saw is disclosed for space or robotic operations with jaw members for clamping to a work piece by an operation of a lever arm. The saw assembly is slidably mounted on the jaw assembly and fed into the work piece by a hand operated feed screw. The saw assembly includes a motor and gear belt. A current sensing circuit provides a current signal which actuates colored lights to visually depict the load on the saw blade during the cutting operations.
A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design has been determined, the board saver can be unsoldered from the contact pads on the first-mentioned printed-circuit board and replaced by the final FPGA.
The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.
Plasma contactors could be used to ground satellites to space plasma to acquire a flow of electrons to propel or power the satellites. A tether would cut across geomagnetic field lines, producing a potential difference between the ends of the tether. Closing the connection between the ends would form a circuit in which an electrical load could be inserted. Design constraints of the circuit are low impedance and a fully reversible high current. The contactor would generate a neutral plasma to connect to the ionospheric plasma. The surface area of the connection would have to be kept large enough for the current density to be equal to the random electron current density in the unperturbed space plasmas. The other contactor would feed electrons and draw ions from the space plasma. Experimental results from spaceborne and ground-based space plasma simulator tests of hollow cathodes that have shown that multiampere currents can be collected are described.
The Piezoelectric Rotary Hammer Drill is designed to core through rock using a combination of rotation and high frequency hammering powered by a single piezoelectric actuator. It is designed as a low axial preload, low mass, and low power device for sample acquisition on future missions to extraterrestrial bodies. The purpose of this internship is to develop and test a prototype of the Piezoelectric Rotary Hammer Drill in order to verify the use of a horn with helical or angled cuts as a hammering and torque inducing mechanism. Through an iterative design process using models in ANSYS Finite Element software and a Mason's Equivalent Circuit model in MATLAB, a horn design was chosen for fabrication based on the predicted horn tip motion, electromechanical coupling, and neutral plane location. The design was then machined and a test bed assembled. The completed prototype has proven that a single piezoelectric actuator can be used to produce both rotation and hammering in a drill string through the use of a torque inducing horn. Final data results include bit rotation produced versus input power, and best drilling rate achieved with the prototype.
The novel Dual-Rasp sampling system has been developed for landed missions to low gravity planetary bodies and is particularly well suited for the unique environment of Saturn’s moon Enceladus. The Dual-Rasp sampling system has two counter-rotating rasp cutters that remove material from the surface and direct it into a guide. The cuttings follow the guide into a sample collection cup. When the sampling collection completes, the tool reconfigures by rotating the guide to create a closed circuit for pneumatic sample transfer from the collection cup to science instruments on the lander. A valve opens a gas tank and the gas flows from that tank into the sample collection cup and down rigid tubing to the science instruments chamber on the lander. A two degree of freedom arm with base actuators is used to deploy the sampler and control its sampling location.
In the Laboratory a high-T(sub c) one-hole squid was built from Y1Ba2Cu3O(7-x) ceramics obtained by a standard procedure of solid state reaction. The ceramics with critical current density J(sub c) is greater than 100 A/sq cm was selected. In the middle of 10 x 10 x 2 mm ceramics pellet a 0.8 mm hole was drilled in which superconducting loop of the squid was located. Between the hole and the edge of the pellet a cut was mechanically filed out with a bridge inside it connecting the superconducting ring. A scheme of the magnetometer is presented. The resonant frequency shift of the tank circuit, the connection of the squid with this circuit, and the squid inductance are evaluated. One of the most interesting fields of the squid-based magnetometer application is biomagnetism, particularly, the human heart magnetocardiogram measuring. The low-temperature squids were used in this area and many interesting and important scientific results have been obtained. The observations have shown that the main noise contribution was not due to the squid but to the Earth's magnetic field variations, industrial inductions, and mainly to the vibrations caused by liquid nitrogen boiling and by vibrations of the box. Further attempts are needed to reduce the magnetic noise inductions. Nevertheless, the estimations promise the maximum signal/noise relation of the high-T(sub c) squid-magnetocardiometer to be not less than 10:1 in a bandwidth of 60 Hz. Apparently, such resolution would be enough not only for steady cardiogram reading but even for thin structure investigation at average technique application.
In our laboratory of high-T(sub c), a one-hole squid was built from Y1Ba2Cu3O(7-x) ceramics obtained by a standard procedure of solid state reaction. The ceramics with critical current density J(sub c) is greater than 100 A/sq cm was selected. In the middle of a 10 x 10 x 2 mm ceramics pellet, a 0.8 mm hole was drilled in which the superconducting loop of the squid was located. Between the hole and the edge of the pellet, a cut was mechanically filed out with a bridge inside it connecting the superconducting ring. A scheme of the magnetometer is presented. The resonant frequency shift of the tank circuit, the connection of the squid with this circuit, and the squid inductance are evaluated. One of the most interesting fields of the squid-based magnetometer application is biomagnetism, particularly, the human heart magnetocardiogram measuring. The low-temperature squids were used in this area and many interesting and important scientific results have been obtained. The observations have shown that the main noise contribution was not due to the squid but to the Earth's magnetic field variations, industrial inductions, and mainly to the vibrations caused by liquid nitrogen boiling and by vibrations of the box. Further attempts are needed to reduce the magnetic noise inductions. Nevertheless, the estimations promise the maximum signal/noise relation of the high-T(sub c) squid-magnetocardiometer to be not less than 10:1 in a bandwidth of 60 Hz. Apparently, such resolution would be enough not only for steady cardiogram reading but even for thin structure investigation at average technique application.
A fabrication process has been developed for cryogenic in-line filtering for the bias and readout of ultrasensitive cryogenic bolometers for millimeter and submillimeter wavelengths. The design is a microstripline filter that cuts out, or strongly attenuates, frequencies (10 50 GHz) that can be carried by wiring staged at cryogenic temperatures. The filter must have 100-percent transmission at DC and low frequencies where the bias and readout lines will carry signal. The fabrication requires the encapsulation of superconducting wiring in a dielectric-metal envelope with precise electrical characteristics. Sufficiently thick insulation layers with high-conductivity metal layers fully surrounding a patterned superconducting wire in arrayable formats have been demonstrated. A degenerately doped silicon wafer has been chosen to provide a metallic ground plane. A metallic seed layer is patterned to enable attachment to the ground plane. Thick silicon dioxide films are deposited at low temperatures to provide tunable dielectric isolation without degrading the metallic seed layer. Superconducting wiring is deposited and patterned using microstripline filtering techniques to cut out the relevant frequencies. A low Tc superconductor is used so that it will attenuate power strongly above the gap frequency. Thick dielectric is deposited on top of the circuit, and then vias are patterned through both dielectric layers. A thick conductive film is deposited conformally over the entire circuit, except for the contact pads for the signal and bias attachments to complete the encapsulating ground plane. Filters are high-aspect- ratio rectangles, allowing close packing in one direction, while enabling the chip to feed through the wall of a copper enclosure. The chip is secured in the copper wall using a soft metal seal to make good thermal and electrical contact to the outer shield.
Detector, intended for use with longwall shearer, determines when cut has pierced through coal layer. Accelerometer measures hardness of material struck by penetrometer ram, while reflectometers measure reflectivity of surface on either side of penetrometer. Signals are combined in voting circuit that indicates "coal" or "shale", depending on information supplied by three sensors. It distinguishes by differences in accelerometer waveforms.