Development of methods of producing large areas of silicon sheet by the slicing of silicon ingots using Inside-Diameter (I.D.) saws
Inside diametar wafering equipment, blades and processes were used to develop methods to produce large areas of silicon sheet. Modifications to a 16 inch STC automated saw included: programmable feed system, crystal rotating system, and STC dynatrack blade monitoring and control system. By controlling the plating operation and by grinding of the cutting edge, 16 inch ID blades with a cutting edge thickness of .22 mm can be produced. Crystal rotation mechanism was used to slice 100 mm diameter crystals with a 16 inch blade down to a thickness of .20 mm. Cutting rates with crystal rotation were generally slower than with standard plunge ID slicing techniques. Using programmed feeds and programmed rotation, maximum cutting rates were from 0.3 to 1.0 inches per minute.