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This presentation will cover NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance Structure, NASA Electronic Parts and Packaging (NEPP) Program, NASA Electronic Parts Assurance Group (NEPAG), examples of assurance challenges, and future challenges.
Outside NASA: Single Agency document that can be referenced in NASA contracts (e.g. CCP) and used in NASA-ESA-JAXA Mutual Recognition of SMA Standards Within NASA: - Lists requirements from Center documents that must be addressed by Programs and Projects in their EEE Parts Management and Control Plan (EPMCP) - Tailor-able by Center/Project Technical Authority - Standardize requirements for “Low Risk” projects -not to overburden “Higher Risk” projects with excessive requirements
The NASA Electronic Parts & Packaging Program Manager, requested a NASA Engineering and Safety Center independent assessment to summarize Commercial Crew Program and NASA Centers’ current and best practices, and lessons learned, on use of commercial-off-the-shelf (COTS) for all mission risk classifications, and provide recommendations that could lead to future NASA Electronic Parts and Packaging Program and/or Agency guidance on COTS parts. This document contains the outcome of the assessment.
An overview of NEPP plans for small missions and electrical, electronic, and electromechanical (EEE) parts.
NEPP Mission Statement: Provide NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry.
This viewgraph information provides information on how the NASA Electronic Parts and Packaging (NEPP) Program evaluates the reliability of technologies for Electrical, Electronic, and Electromechanical (EEE) parts, and their suitability for spacecraft applications.
NEPP Mission Statement: Provide NASAs leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry.
The NASA Electronic Parts and Packaging Program continue to support Electrical, Electronic and Electromagnetic Parts for the agency with an eventful year of workshops, innovations, testing and challenges.
The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.
NASA Electronic Parts and Packaging (NEPP) Program Overview Mission Statement: Provide NASA's leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of EEE parts by NASA, in collaboration with other government agencies and industry. The NASA Electronic Parts Assurance Group (NEPAG) is a core portion of NEPP.
Mission Statement: The NASA Electronic Parts and Packaging (NEPP) Program provides NASA's leadership for developing and maintaining guidance for the screening, qualification, test. and usage of EEE parts by NASA as well as in collaboration with other government Agencies and industry. NASA Space Technology Mission Directorate (STMD) "STMD rapidly develops, demonstrates, and infuses revolutionary, high-payoff technologies through transparent, collaborative partnerships, expanding the boundaries of the aerospace enterprise." Mission Statement: The Space Environments Testing Management Office (SETMO) will identify, prioritize, and manage a select suite of Agency key capabilities/assets that are deemed to be essential to the future needs of NASA or the nation, including some capabilities that lack an adequate business base over the budget horizon. NESC mission is to perform value-added independent testing, analysis, and assessments of NASA's high-risk projects to ensure safety and mission success. NASA Space Environments and Avionics Fellows as well as Radiation and EEE Parts Community of Practice (CoP) leads.
The presentation is about the NASA Electronic Parts & Packaging (NEPP) Program. The mission statement of NEPP, “Provide NASA’s leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of EEE parts by NASA, in collaboration with other government agencies and industry” is dissected and explained using examples.
The NASA Engineering and Safety Center (NESC) has an urgent need to understand how system-level reliability of an avionics architecture is compromised when portions of the architecture are temporarily unavailable due to single event effects (SEE). The proposed activity parametrically evaluated these SEE impacts on system reliability based on mission duration, upset rate and recovery times for a representative redundant architecture. The key stakeholders for this study are NASA programs and projects that expect to use avionics architectures with electrical, electronic and electromechanical (EEE) parts susceptible to SEE when exposed to the mission expected radiation environment.
Secondary power is produced by DDCU's (direct current to direct current converter units) and routed to and through secondary power distribution assemblies (SPDA's) to loads or tertiary distribution assemblies. This presentation outlines requirements of Space Station Freedom (SSF) EEE (electrical, electronic, and electromechanical) parts wire and the approved electrical wire and cable. The SSF PDRD (Program Definition and Requirements Document) language problems and resolution are reviewed. The cable routing to and from the SPDA's is presented as diagrams and the wire recommendations and characteristics are given.
This presentation provides a background summary of the NEPP Program, its origins and operating principles followed by examples of issues and opportunities that NEPP is currently pursuing. These examples include Electrostatic Discharge protection procedures that are not being properly applied, one reason for which is the confusion caused by the numerous, different standards covering this topic. Updates are provided for key activities in radiation hardness assurance, and the evaluation of automotive grade electronic parts for use in space applications. Some recent examples of part problems experienced by NASA are briefly described and the latest trending of incidences of counterfeit electronic parts is shown graphically. Finally some forward actions are identified and the time, place and typical topics is provided for the next NEPP Electronic Technology Workshop (ETW).
The Major Constituent Analyzer (MCA) is a mass spectrometer-based instrument designed to provide critical monitoring of six major atmospheric constituents; nitrogen, oxygen, hydrogen, carbon dioxide, methane, and water vapor on-board the International Space Station. The analyzer has been an integral part of the Environmental Control and Life Support System (ECLSS) since the station went on-line. The Orion Air Monitor (OAM) was derived from the MCA and heavily optimized for reduced mass, lower power, faster water vapor response, and maintenance-free operation. The resulting OAM is approximately the size of the analyzer portion of the MCA, orbital-replacement unit 02 (ORU 02), while incorporating the functions of three other modules: Data Processing and Communication (ORU 01), Verification Gas Assembly (ORU 08), and Low Voltage Power Supply (ORU 04). The overlap in MCA and OAM requirements makes it possible to derive a common Air Monitor design that spans both applications while minimally impacting the weight and power limits imposed by the Multipurpose Crew Vehicle (MPCV). Benefits to ISS include the retirement of ORUs 01, 04, and 08, reducing up-mass and eliminating EEE parts obsolescence issues through the extended ISS mission phases. Benefits to MPCV and future deployed habitats under the Constellation program include greater interchangeability across ECLSS subsystems. This paper discusses the results of the requirements development study, where a superset of ISS and Orion air monitoring requirements were distilled; evaluated against increases in OAM functionality, mass, and power; and traded-off where possible using simple operating mode modifications. A system architecture and preliminary design addressing the common requirements will be presented.
The EEE Links Newsletter is a quarterly publication produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. The newsletter is produced as an electronic format deliverable made available via the referenced www site administered by Code 562, The newsletter publishes brief articles on topics of interest to NASA programs and projects in the area of electronic parts and packaging. The newsletter does not provide information pertaining to patented or proprietary information. The information provided is at the level of that produced by industry and university researchers and is published at national and international conferences.