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Development of a piezopolymer pressure sensor for a portable fetal heart rate monitor
A piezopolymer pressure sensor has been developed for service in a portable fetal heart rate monitor, which will permit an expectant mother to perform the fetal nonstress test, a standard predelivery test, in her home. Several sensors are mounted in an array on a belt worn by the mother. The sensor design conforms to the distinctive features of the fetal heart tone, namely, the acoustic signature, frequency spectrum, signal amplitude, and localization. The components of a sensor serve to fulfill five functions: signal detection, acceleration cancellation, acoustical isolation, electrical shielding, and electrical isolation of the mother. A theoretical analysis of the sensor response yields a numerical value for the sensor sensitivity, which is compared to experiment in an in vitro sensor calibration. Finally, an in vivo test on patients within the last six weeks of term reveals that nonstress test recordings from the acoustic monitor compare well with those obtained from conventional ultrasound.
Manchester Coding Option for SpaceWire: Providing Choices for System Level Design
This paper proposes an optional coding scheme for SpaceWire in lieu of the current Data Strobe scheme for three reasons. First reason is to provide a straightforward method for electrical isolation of the interface; secondly to provide ability to reduce the mass and bend radius of the SpaceWire cable; and thirdly to provide a means for a common physical layer over which multiple spacecraft onboard data link protocols could operate for a wide range of data rates. The intent is to accomplish these goals without significant change to existing SpaceWire design investments. The ability to optionally use Manchester coding in place of the current Data Strobe coding provides the ability to DC balanced the signal transitions unlike the SpaceWire Data Strobe coding; and therefore the ability to isolate the electrical interface without concern. Additionally, because the Manchester code has the clock and data encoded on the same signal, the number of wires of the existing SpaceWire cable could be optionally reduced by 50. This reduction could be an important consideration for many users of SpaceWire as indicated by the already existing effort underway by the SpaceWire working group to reduce the cable mass and bend radius by elimination of shields. However, reducing the signal count by half would provide even greater gains. It is proposed to restrict the data rate for the optional Manchester coding to a fixed data rate of 10 Megabits per second (Mbps) in order to make the necessary changes simple and still able to run in current radiation tolerant Field Programmable Gate Arrays (FPGAs). Even with this constraint, 10 Mbps will meet many applications where SpaceWire is used. These include command and control applications and many instruments applications with have moderate data rate. For most NASA flight implementations, SpaceWire designs are in rad-tolerant FPGAs, and the desire to preserve the heritage design investment is important for cost and risk considerations. The Manchester coding option can be accommodated in existing designs with only changes to the FPGA.
Isolated Fast High-Voltage Switching Circuit
Electrically isolated switching circuit supplies pulses at potentials up to 6.5 kV and currents up to 6.5 A, lasting as long as few microseconds. Turn-on time about 40 ns; turn-off time about 3 microseconds. Electrically isolated from control circuitry by means of fiber-optic signal coupling and isolated power supply. Electrical isolation protects both technician and equipment. This and similar circuits useful in such industrial and scientific applications as high-voltage, high-frequency test equipment; electrostatic-discharge test equipment; plasma-laboratory instrumentation; spark chambers; and electromagnetic-interference test equipment.
Lessons Learned From Evaluation and Mitigation of Space Charging Threat Due to Use of Isolated (Hybrid) Bearings on the Pace Ocean Color Instrument
A high precision, high resolution Ocean Color Instrument (OCI) was developed for the Plankton, Aerosol, Cloud ocean Ecosystem (PACE) mission which required the use of electrically isolated Hybrid Bearings (silicon nitride balls). While desirable for technical performance of the instrument, this application caused portions of the instrument to become electrically isolated and come under threat of space charging effects from charged particles and the resultant differential charging. An evaluation of the environment, susceptibility of the components, such as bearings and electronics, and mitigation strategies were performed. As part of that process, simulations of the charging environment, analysis of internal mechanism charging and prediction of most likely discharge paths, testing of the bearings for susceptibility as well as resulting damage were performed and analyzed. Additionally, a novel method to deal with charging was developed. Considerations for dealing with electrically isolated mechanisms, results of the above-mentioned efforts as well as lessons learned are presented.
A Novel Data System for Verification of Internal Parameters of Motor Design
Three major obstacles have limited the amount of information that can be obtained from inside an operating solid rocket motor. The first is a safety issue due to the presence of live propellant interacting with classical, electrical instrumentation. The second is a pressure vessel feed through risk arising from bringing a large number of wires through the rocket motor wall safely. The third is an attachment/protection issue associated with connecting gages to live propellant. Thiokol has developed a highly miniaturized, networked, electrically isolated data system that has safely delivered information from classical, electrical instrumentation (even on the burning propellant surface) to the outside world. This system requires only four wires to deliver 80 channels of data at 2300 samples/second/channel. The feed through leak path risk is massively reduced from the current situation where each gage requires at least three pressure vessel wire penetrations. The external electrical isolation of the system is better than that of the propellant itself. This paper describes the new system.
Design, analysis, and test verification of advanced encapsulation systems
Thermal, optical, structural, and electrical isolation analyses are decribed. Major factors in the design of terrestrial photovoltaic modules are discussed. Mechanical defects in the different layers of an encapsulation system, it was found, would strongly influence the minimum pottant thickness required for electrical isolation. Structural, optical, and electrical properties, a literature survey indicated, are hevily influenced by the presence of moisture. These items, identified as technology voids, are discussed. Analyses were based upon a 1.2 meter square module using 10.2 cm (4-inch) square cells placed 1.3 mm apart as shown in Figure 2-2. Sizing of the structural support member of a module was determined for a uniform, normal pressure load of 50 psf, corresponding to the pressure difference generated between the front and back surface of a module by a 100 mph wind. Thermal and optical calculations were performed for a wind velocity of 1 meter/sec parallel to the ground and for module tilt (relative to the local horizontal) of 37 deg. Placement of a module in a typical array field is illustrated.
CMOS Imager Has Better Cross-Talk and Full-Well Performance
A complementary metal oxide/semiconductor (CMOS) image detector now undergoing development is designed to exhibit less cross-talk and greater full-well capacity than do prior CMOS image detectors of the same type. Imagers of the type in question are designed to operate from low-voltage power supplies and are fabricated by processes that yield device features having dimensions in the deep submicron range. Because of the use of low supply potentials, maximum internal electric fields and depletion widths are correspondingly limited. In turn, these limitations are responsible for increases in cross-talk and decreases in charge-handling capacities. Moreover, for small pixels, lateral depletion cannot be extended. These adverse effects are even more accentuated in a back-illuminated CMOS imager, in which photogenerated charge carriers must travel across the entire thickness of the device. The figure shows a partial cross section of the structure in the device layer of the present developmental CMOS imager. (In a practical imager, the device layer would sit atop either a heavily doped silicon substrate or a thin silicon oxide layer on a silicon substrate, not shown here.) The imager chip is divided into two areas: area C, which contains readout circuits and other electronic circuits; and area I, which contains the imaging (photodetector and photogenerated-charge-collecting) pixel structures. Areas C and I are electrically isolated from each other by means of a trench filled with silicon oxide. The electrical isolation between areas C and I makes it possible to apply different supply potentials to these areas, thereby enabling optimization of the supply potential and associated design features for each area. More specifically, metal oxide semiconductor field-effect transistors (MOSFETs) that are typically included in CMOS imagers now reside in area C and can remain unchanged from established designs and operated at supply potentials prescribed for those designs, while the dopings and the lower supply potentials in area I can be tailored to optimize imager performance. In area I, the device layer includes an n+ -doped silicon layer on which is grown an n-doped silicon layer. A p-doped silicon layer is grown on top of the n -doped layer. The total imaging device thickness is the sum of the thickness of the n+, n, and p layers. A pixel photodiode is formed between a surface n+ implant, a p implant underneath it, the aforementioned p layer, and the n and n+ layers. Adjacent to the diode is a gate for transferring photogenerated charges out of the photodiode and into a floating diffusion formed by an implanted p+ layer on an implanted n-doped region. Metal contact pads are added to the back-side for providing back-side bias.
Method for calculating multidimensional electric fields in photovoltaic modules
A finite element method for evaluating the electrical isolation characteristics of photovoltaic modules was developed; its accuracy was verified by comparison with an exact solution for a geometry similar to that of solar cells. Tests on a square test coupon, employed in electrical isolation tests, and a group of disc-shaped solar cells illustrated the finite element method's usefulness in evaluating module encapsulation designs. Finite element models had to avoid adjacent large and small elements and elements with large aspect ratios, and the NASTRAN output had to be curve fitted to calculate the maximum field. Geometric limits were indicated: cells with very sharp edges, and cells much thinner or thicker than the dielectric pottant layer.
Behavior of Combined Dielectric-Metallic Systems in a Charged Particle Environment
The charging and discharging characteristics of an electrically isolated solar array segment were studied in order to simulate discharges seen during geomagnetic substorms. A solar array segment was floated while bombarded with monoenergetic electrons at various angles of incidence. The potentials of the array surface and of the interconnects were monitored using Trek voltage probes to maintain electrical isolation. A back plate was capacitively coupled to the array to provide information on the characteristics of the transients accompanying the discharges. Several modes of discharging of the array were observed at relatively low differential and absolute potentials (a few kilovolts). A relatively slow discharge response in the array was observed, discharging over one second with currents of nanoamps. Two types of faster discharges were also seen which lasted a few hundredths of a millisecond and with currents on the order of microamps. Some results indicate an electron emission process associated with the arcs.
Antenna for near Field Sensing and Far Field Transceiving
An antenna includes a first electrical conductor that is shaped to form a spiral between its first and second ends that remain electrically unconnected such that the first electrical conductor so-shaped is maintained as an unconnected single-component open-circuit having inductance and capacitance. In the presence of a time-varying electromagnetic field, the first electrical conductor so-shaped resonates to generate a harmonic electromagnetic field response having a frequency, amplitude and bandwidth. A second electrical conductor includes a loop portion overlapping at least a portion of the spiral. The second electrical conductor is electrically isolated from the first electrical conductor. A radio frequency transceiver capable of transmitting and receiving electromagnetic energy is electrically coupled to the second electrical conductor.
Photon-coupled isolation switch First quarterly report, 1 Jan. - 31 Mar. 1966
Photon-coupled isolation switch to provide transistor output electrically isolated from driving sources and all other switch terminals
Photovoltaic module encapsulation design and materials section, volume 2
Tests for chemical structure, material properties, water absorption, aging and curing agent of Ethylene Vinyl Acetate (EVA) and UV absorption studies are carried out. A computer model was developed for thermal optical modeling, to investigate dependence between module operating temperature and solar insolation, and heat dissapation behavior. Structural analyses were performed in order to determine the stress distribution under wind and heat conditions. Curves are shown for thermal loading conditions. An electrical isolation was carried out to investigate electrical stress aging of non-metallic encapsulation materials and limiting material flaws, and to develop a computer model of electrical fields and stresses in encapsulation materials. In addition, a mathematical model was developed and tests were conducted to predict hygroscopic and thermal expansion and contraction on a plastic coated wooden substrate. Thermal cycle and humidity freezing cycle tests, partial discharge tests, and hail impact tests were also carried out. Finally, the effects of soiling on the surface of photovoltaic modules were investigated. Two antisoiling coatings, a fluorinated silane and perflourodecanoic acid were considered.
Method of Fabricating a Piezoelectric Composite Apparatus
A method for fabricating a piezoelectric macro-fiber composite actuator comprises providing a piezoelectric material that has two sides and attaching one side upon an adhesive backing sheet. The method further comprises slicing the piezoelectric material to provide a plurality of piezoelectric fibers in juxtaposition. A conductive film is then adhesively bonded to the other side of the piezoelectric material, and the adhesive backing sheet is removed. The conductive film has first and second conductive patterns formed thereon which are electrically isolated from one another and in electrical contact with the piezoelectric material. The first and second conductive patterns of the conductive film each have a plurality of electrodes to form a pattern of interdigitated electrodes. A second film is then bonded to the other side of the piezoelectric material. The second film may have a pair of conductive patterns similar to the conductive patterns of the first film.
Method of Fabricating a Composite Apparatus
A method for fabricating a piezoelectric macro-fiber composite actuator comprises making a piezoelectric fiber sheet by providing a plurality of wafers of piezoelectric material, bonding the wafers together with an adhesive material to from a stack of alternating layers of piezoelectric material and adhesive material, and cutting through the stack in a direction substantially parallel to the thickness of the stack and across the alternating layers of piezoelectric material and adhesive material to provide at least one piezoelectric fiber sheet having two sides comprising a plurality of piezoelectric fibers in juxtaposition to the adhesive material. The method further comprises bonding two electrically conductive films to the two sides of the piezoelectric fiber sheet. At least one conductive film has first and second conductive patterns formed thereon which are electrically isolated from one another and in electrical contact with the piezoelectric fiber sheet.
High Operating Temperature Barrier Infrared Detector with Tailorable Cutoff Wavelength
A barrier infrared detector with absorber materials having selectable cutoff wavelengths and its method of manufacture is described. A GaInAsSb absorber layer may be grown on a GaSb substrate layer formed by mixing GaSb and InAsSb by an absorber mixing ratio. A GaAlAsSb barrier layer may then be grown on the barrier layer formed by mixing GaSb and AlSbAs by a barrier mixing ratio. The absorber mixing ratio may be selected to adjust a band gap of the absorber layer and thereby determine a cutoff wavelength for the barrier infrared detector. The absorber mixing ratio may vary along an absorber layer growth direction. Various contact layer architectures may be used. In addition, a top contact layer may be isolated into an array of elements electrically isolated as individual functional detectors that may be used in a detector array, imaging array, or focal plane array.
Propellant feed isolator Patent
Internal labyrinth and shield structure to improve electrical isolation of propellant feed source from ion thrustor
Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems
High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.