Contact resistance of electroplated flat conductor cable conductors
Contact resistance of electroplated flat conductor cable conductors
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Contact resistance of electroplated flat conductor cable conductors
Activation process forms adherent electrodeposits of copper, nickel, and chromium on titanium alloy. Good adhesion of electroplated deposits is obtained by using acetic-hydrofluoric acid anodic activation process.
Molybdenum and niobium are often electroplated and subsequently stripped of copper. Since general standard plating techniques produce poor quality coatings, general procedures have been optimized and specified to give good results.
"No buzzer" indicates early problem in electroplating when parts are properly immersed into electropolating bath. Buzzer sounds when current flows through part; however, if current is cut, buzzer stops warning that parts must be removed and refinished thus preventing unnecessary waste of electrical energy and labor.
Report describes tests of durability of electroplated black chromium coatings on solar-collector panels in rural, industrial, and seacoast environments for 60, 36, and 13 months, respectively. Black-chromium coating showed exceptionally-good optical durability in all three environments.
Polyurethane foam proves suitable as filler for slots in parts electroplated with copper or nickel. Polyurethane causes less contamination of plating bath and of cleaning and filtering tanks than wax fillers used previously. Direct cost of maintenance and indirect cost of reduced operating time during tank cleaning also reduced.
Polyurethane foam provides effective mask in electroplating of copper or nickel. Thin layer of Turco maskant painted on area to be masked: Layer ensures polyurethane foam removed easily after served its purpose. Component A, isocyanate, and component B, polyol, mixed together and brushed or sprayed on mask area. Mixture reacts, yielding polyurethane foam. Foam prevents deposition of nickel or copper on covered area. New method saves time, increases productivity and uses less material than older procedures.
Hot isostatic pressing effective in improving ductility of metal plating. Previously hot isostatic pressing used on powder-metallurgy parts and castings but not on electroplated parts. To test idea, copperplated heated to 800 degrees C at pressure of 23,000 psi (160 MN/m2) for 4 hours. When part examined metallographically, completely free from porosity.
Contact patterns traced by laser scanning. Conductor paths deposited on silicon solar-cell wafers by laser irradiation followed by electroplating. Laser-assisted metalization technique offers better resolution and lower contact resistance than does conventional metalization by screen printing. At the same time, less expensive than metalization with masks and photolithography.
Removal of dissolved oxygen from deionized rinse water improves bond between electroplated metal and base metal. Oxygen removed by bubbling nitrogen through rinse water before used.
A novel method for electroplating ultra-high-strength glassy metals, nickel-phosphorous and nickel-cobalt-phosphorous, has been developed at NASA Marshall Space Flight Center, cooperatively with the University of Alabama in Huntsville. Traditionally, thin coatings of these metals are achieved via electroless deposition. Benefits of the new electrolytic process include thick, low-stress deposits, free standing shapes, lower plating temperature, low maintenance, and safer operation with substantially lower cost.
Internal stress and deposit hardness of nickel electrodeposited containing controlled quantities of meta-benzenedisulfonic acid
Cracks in metal parts are filled by electrodeposition in plating tank that conforms to part to be repaired. Principle is applicable to repair of cracks in components of chemical reactors and other critical structures.
The effect of electrodeposition variables on film thickness was investigated using a dilute polyimide solution as a bath into which aluminum (as foil or as a vapor deposited coating) was immersed. The electrodeposited film was dried for 2 hours at 93 C (primarily to remove solvent) and cured for 18 hours at 186 C. Infrared studies indicate that imide formation (curing) occurs at 149 C under vacuum. From a conceptual viewpoint, satisfactory film metallized on one side can be obtained by this method. The cured ultra thin polyimide film exhibits properties equivalent to those of commercial film, and the surface appearance of the strippable polyimide film compares favorably with that of a sample of commercial film of thicker gauge. The feasibility of manufacturing approximately one million sq m of ultra thin film capable of being joined to fabricate an 800 m by 9 800 m square from starting material 0.5 to 1 m wide for space erectable structures was demonstrated.
Thin copper electrodeposited layer protects metal parts in environments with which they may be incompatible. Originally developed for main engine of Space Shuttle where high strength nickle alloy bellows must operate in high-pressure hydrogen, technique protects nickel and is unaffected by forming process or subsequent heat treatment and preinstallation processing.
A study was undertaken to determine the durability of nickel-black chromium plated aluminum in an outdoor rural industrial, and seacoast environment. Test panels were exposed to these environments for 60, 36, and 13 months, respectively. The results of this study showed that no significant optical degradation occurred from exposure to either of these environments, although a considerable amount of corrosion occurred on the panels exposed to the seacoast environment. The rural and industrial atmosphere produced only a slight amount of corrosion on test panels.
Soft ferromagnetic materials have thus far found the most utility in magnetic-MEMS, because the technologies necessary for depositing and micromachining them have been well developed previously by the data storage industry.
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