Basic failure mechanisms in advanced composites
Analysis of failure mechanisms of carbon-epoxy composite materials and methods of predicting performance under load conditions
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Analysis of failure mechanisms of carbon-epoxy composite materials and methods of predicting performance under load conditions
This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced failure mechanisms varied from conventional surface mount (SM) failures for CSPs. Examples of unrealistic life projections for other CSPs are also presented. The cumulative cycles to failure for ceramic BGA assemblies performed under different conditions, including plots of their two Weibull parameters, are presented. The results are for cycles in the range of -30 C to 100 C, -55 C to 100 C, and -55 C to 125 C. Failure mechanisms as well as cycles to failure for thermal shock and thermal cycling conditions in the range of -55 C to 125 C were compared. Projection to other temperature cycling ranges using a modified Coffin-Manson relationship is also presented.
The objective of the study was to identify and study the failure mechanisms associated with compressive-loaded uniply graphite/epoxy square plates with a central circular hole. It is found that the type of compressive failure depends on the hole size. For large holes with the diameter/width ratio exceeding 0.062, fiber buckling/kinking initiated at the hole is found to be the dominant failure mechanism. In plates with smaller hole sizes, failure initiates away from the hole edge or complete global failure occurs. Critical buckle wavelengths at failure are presented as a function of the normalized hole diameter.
Evaluation of anion impurities effects on mechanical failure of polycrystalline ceramic materials
The acoustic emission of graphite fiber polyimide composite failure mechanisms was investigated with emphasis on frequency spectrum analysis. Although visual examination of spectral densities could not distinguish among fracture sources, a paired-sample t statistical analysis of mean normalized spectral densities did provide quantitative discrimination among acoustic emissions from 10 deg, 90 deg, and plus or minus 45 deg, plus or minus 45 deg sub s specimens. Comparable discrimination was not obtained for 0 deg specimens.
It is the intent of this project to provide a platform to visualize the various data collected from stress-strain testing of composite ceramic matrix materials. The data collected from the stress-strain tests are acoustic emissions (AE). As a material is subjected to a stress-strain test, various failure mechanisms occur in the material. The recorded sounds emitted during the test may correspond to various failure mechanisms. This project, thus, will give a possible way to visualize the data and data derived from the recorded AE. The stress-strain testing was performed on several composite matrix material combinations. Each of these tests produced anywhere from 1000 to 10,000+ AE events. For each AE event recorded, several characteristics in both the time and frequency domains are created. This project has two goals. First, this project will provide a summation page for a selected waveform. This page will include all of the characteristics determined from the AE event waveform along with graphs of the AE event waveform and its corresponding Power Spectrum. The other function of this project is to retrieve and display selected AE event waveforms for comparison.
Integrated-circuit devices using the Ti/W/Au metal system are subject to failure mechanisms based on electrolytic corrosion. The migratory gold resistive short (MGRS) failure mode is one example of this mechanism and results in the formation of filamentary or dendritic deposits of gold between adjacent stripes on the IC chip. This reaction requires the presence of a sufficient amount of water, a bias voltage between adjacent stripes, and the activation of the cathodic (-) stripe. Gold ions are transported from anode to cathode through a film of moisture adsorbed on the surface of the chip; halide ions are probably involved in the transfer. Their presence is verified experimentally by X-ray photoelectron spectroscopy. Some of the chemical and electrostatic factors involved in the MGRS mechanism are discussed in this paper, including the questions of a threshold level of moisture and contamination.
An experimental study is reported in which a nondestructive technique involving the use of a transparent fiberglass-epoxy composite birefringent material has been used to investigate compression failure mechanisms in graphite-epoxy laminates. It is shown that the birefringency and transparency of the fiberglass-epoxy material permits regions of high stress to be located and the mechanisms of local failure propagation to be identified within the laminate. The material may also be useful for studying stress fields and for identifying failure initiation and propagation mechanisms in a wide variety of composite-structure problems.
Statistical analysis and metallographic aspects of fatigue failure mechanisms in copper alloys
Reliability handbook for silicon monolithic microcircuits - failure mechanisms
We explore and elucidate physical failure mechanisms in a 4H-SiC, high voltage, superjunction (SJ) vertical DMOSFET from a single heavy ion strike using three-dimensional electro-thermal transient simulations. The single-event burnout (SEB) failure is thermal runaway from second breakdown, initiated by impact ionization and terminated with mesoplasma formation, at the center of the P-pillar/N+ substrate interface. We also demonstrate that the SEB performance of this SiC SJ DMOSFET is insensitive to the pillar width but sensitive to the strike location with ion strike at the P-pillar causing SEB at a lower blocking voltage than at the N-pillar. Compared to commercially available 1.2 kV blocking-rated non-SJ DMOSFETs, which have been demonstrated to survive SEB up to 525 V, the SJ DMOSFET increases SEB survival threshold voltage (VSEB) by a factor of 2.2, making it close to 1200 V, while the on-resistance is increased by only 11%. Using our recently developed figure of merit (FoM), which considers the trade-off between VSEB and on-state performance, we find that the SiC SJ DMOSFET achieves a FoM that is 14 times better, making it superior to conventional 1.2 kV SiC DMOSFETs for long-term radiation-tolerant operation in space applications.
Phase change materials (PCM) may be useful for thermal control systems that involve cyclical heat loads or cyclical thermal environments such as Low Earth Orbit (LEO) and Low Lunar Orbit (LLO). Thermal energy can be stored in the PCM during peak heat loads or in adverse thermal environments. The stored thermal energy can then be released later during minimum heat loads or in more favorable thermal environments. One advantage that PCM s have over evaporators in this scenario is that they do not use a consumable. The use of water as a PCM rather than the more traditional paraffin wax has the potential for significant mass reduction since the latent heat of formation of water is approximately 70% greater than that of wax. One of the potential drawbacks of using ice as a PCM is its potential to rupture its container as water expands upon freezing. In order to develop a space qualified ice PCM heat exchanger, failure mechanisms must first be understood. Therefore, a methodical experimental investigation has been undertaken to demonstrate and document specific failure mechanisms due to ice expansion in the PCM. A number of ice PCM heat exchangers were fabricated and tested. Additionally, methods for controlling void location in order to reduce the risk of damage due to ice expansion were investigated. This paper presents the results of testing that occurred from March through September of 2010 and builds on testing that occurred during the previous year.
Phase change materials (PCM) may be useful for thermal control systems that involve cyclical heat loads or cyclical thermal environments such as specific spacecraft orientations in Low Earth Orbit (LEO) and low beta angle Low Lunar Orbit (LLO). Thermal energy can be stored in the PCM during peak heat loads or in adverse thermal environments. The stored thermal energy can then be released later during minimum heat loads or in more favorable thermal environments. One advantage that PCM s have over evaporators in this scenario is that they do not use a consumable. The use of water as a PCM rather than the more traditional paraffin wax has the potential for significant mass reduction since the latent heat of formation of water is approximately 70% greater than that of wax. One of the potential drawbacks of using ice as a PCM is its potential to rupture its container as water expands upon freezing. In order to develop a space qualified ice PCM heat exchanger, failure mechanisms must first be understood. Therefore, a methodical experimental investigation has been undertaken to demonstrate and document specific failure mechanisms due to ice expansion in the PCM. A number of ice PCM heat exchangers were fabricated and tested. Additionally, methods for controlling void location in order to reduce the risk of damage due to ice expansion were investigated. This paper presents the results of testing that occurred from March through September of 2010 and builds on testing that occurred during the previous year.
Phase change materials (PCM) may be useful for thermal control systems that involve cyclical heat loads or cyclical thermal environments such as Low Earth Orbit (LEO) and Low Lunar Orbit (LLO). Thermal energy can be stored in the PCM during peak heat loads or in adverse thermal environments. The stored thermal energy can then be released later during minimum heat loads or in more favorable thermal environments. One advantage that PCM s have over evaporators in this scenario is that they do not use a consumable. Wax PCM units have been baselined for the Orion thermal control system and also provide risk mitigation for the Altair Lander. However, the use of water as a PCM has the potential for significant mass reduction since the latent heat of formation of water is approximately 70% greater than that of wax. One of the potential drawbacks of using ice as a PCM is its potential to rupture its container as water expands upon freezing. In order to develop a space qualified ice PCM heat exchanger, failure mechanisms must first be understood. Therefore, a methodical experimental investigation has been undertaken to demonstrate and document specific failure mechanisms due to ice expansion in the PCM. An ice PCM heat exchanger that replicates the thermal energy storage capacity of an existing wax PCM unit was fabricated and tested. Additionally, methods for controlling void location in order to reduce the risk of damage due to ice expansion are investigated. This paper presents the results to date of this investigation.
Phase change materials (PCM) may be useful for thermal control systems that involve cyclical heat loads or cyclical thermal environments such as Low Earth Orbit (LEO) and Low Lunar Orbit (LLO). Thermal energy can be stored in the PCM during peak heat loads or in adverse thermal environments. The stored thermal energy can then be released later during minimum heat loads or in more favorable thermal environments. One advantage that PCM's have over evaporators in this scenario is that they do not use a consumable. Wax PCM units have been baselined for the Orion thermal control system and also provide risk mitigation for the Altair Lander. However, the use of water as a PCM has the potential for significant mass reduction since the latent heat of formation of water is approximately 70% greater than that of wax. One of the potential drawbacks of using ice as a PCM is its potential to rupture its container as water expands upon freezing. In order to develop a space qualified ice PCM heat exchanger, failure mechanisms must first be understood. Therefore, a methodical experimental investigation has been undertaken to demonstrate and document specific failure mechanisms due to ice expansion in the PCM. An ice PCM heat exchanger that replicates the thermal energy storage capacity of an existing wax PCM unit was fabricated and tested. Additionally, methods for controlling void location in order to reduce the risk of damage due to ice expansion are investigated. This paper presents the results to date of this investigation. Nomenclature
Aluminum alloys reinforced with silicon carbide whiskers exhibit significantly higher strength and modulus than the unreinforced alloys. However, the composites also exhibit low ductility and poor fracture toughness for reasons which are not well-understood. In this study, high resolution and conventional TEM techniques are used to analyze interface microstructure and failure mechanisms in P/M 2124 and 6061 aluminum alloys reinforced with silicon carbide whiskers. Interfacial oxides are typical of both composite materials, often distributed in clusters or in a discrete layer 2-5 nm thick along the whisker-matrix interface. Highly deformed regions beneath bulk tensile fracture surfaces reveal possible fracture nucleation centers as well as sites of stress concentration where intense plastic strain has occurred. Observations of such highly deformed regions include (1) void initiation at whisker ends, (2) interface decohesion involving the thin oxide layer, (3) transverse cracks in whiskers, and (4) cracks in large constituent particles. TEM results are presented and discussed in relation to mechanisms of composite failure.
Mechanical properties of polycrystalline ceramics with anion impurities
An experimental and analytical study was conducted to delineate the compression failure mechanisms of composite structures. The present report summarizes further results on kink band formation in unidirectional composites. In order to assess the compressive strengths and failure modes of fibers them selves, a fiber bundle was embedded in epoxy casting and tested in compression. A total of six different fibers were used together with two resins of different stiffnesses. The failure of highly anisotropic fibers such as Kevlar 49 and P-75 graphite was due to kinking of fibrils. However, the remaining fibers--T300 and T700 graphite, E-glass, and alumina--failed by localized microbuckling. Compressive strengths of the latter group of fibers were not fully utilized in their respective composite. In addition, acoustic emission monitoring revealed that fiber-matrix debonding did not occur gradually but suddenly at final failure. The kink band formation in unidirectional composites under compression was studied analytically and through microscopy. The material combinations selected include seven graphite/epoxy composites, two graphite/thermoplastic resin composites, one Kevlar 49/epoxy composite and one S-glass/epoxy composite.