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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1976

Deployable radiators for waste heat dissipation from Shuttle payloads

Thermal control of Shuttle instruments will require the use of a pumped fluid space radiator system to reject large quantities of waste heat. Many payloads, however, will have insufficient vehicle surface area available for radiators to reject this waste heat and will, therefore, require the use of deployed panels. It is desirable to utilize modularized, deployable radiator systems which have a high degree of configuration and component commonality to minimize the design, development, and fabrication costs. Prototypes of two radiator systems which meet these criteria are currently under development for Shuttle payload utilization: a 'rigid' radiator system which utilizes aluminum honeycomb panels of the Shuttle Orbiter configuration that are deployed by an Apollo Telescope Mount type scissors mechanism; and two 'flexible' radiator systems which use panels constructed from flexible metal/dielectric composite materials that are deployed by 'unrolling' or 'extending' in orbit. Detailed descriptions of these deployable radiator systems, along with design and performance features, are presented.

Cox, R. L.↗
NASA NTRS1976

Deployable radiators for waste heat dissipation from Shuttle payloads

Prototypes of two types of modularized, deployable radiator systems with a high degree of configuration and component commonality to minimize design, development and fabrication costs are currently under development for Shuttle payloads with high waste heat: a rigid radiator system which utilizes aluminum honeycomb panels that are deployed by a scissors mechanism; and two 'flexible' radiator systems which use panels constructed from flexible metal/dielectric composite materials that are deployed by 'unrolling' or 'extending' in orbit. Detail descriptions of these deployable radiator systems along with design and performance features are presented.

Cox, R. L.↗
NASA NTRS1994

Heat dissipation in water-cooled reflectors

The energy balance of a lamp varies with the thermal and optical characteristics of the reflector. The photosynthetic radiation efficiency of lamps, defined as input power divided by photosynthetically active radiation (PAR, 400-700 nm) emitted from the lamp ranges between 0.17 and 0.26. The rest of the energy input is wasted as longwave (3000 nm and over) and non-PAR shortwave radiation (from 700 nm to 3000 nm), convective, and conductive heat from the lamp, reflector, and ballast, and simply for increasing the cooling load. Furthermore, some portion of the PAR is uselessly absorbed by the inner walls, shelves, vessels, etc. and some portion of the PAR received by the plantlets is converted into sensible and latent heat. More than 98% of the energy input is probably converted into heat, with only less than 2% of the energy input being converted into chemical energy as carbohydrates by photosynthesis. Therefore, it is essential to reduce the generation of heat in the culture room in order to reduce the cooling load. Through use of a water-cooled reflector, the generation of convective and conductive heat and longwave radiation from the reflector can be reduced, without reduction of PAR.

Kozai, Toyoki↗
NASA NTRS1975

Metabolism and heat dissipation during Apollo EVA periods

The extravehicular activity life support equipment, suit temperature control, metabolic rate measurement methods, and energy production are discussed. The Apollo crewmen were able to perform planned extravehicular activities and to extend them to the maximum time allowable without medical problems. The metabolic rates experienced during the lunar surface extravehicular activities were lower than conservative premission estimates. A manually controlled liquid cooling garment was effectively used to minimize fatigue and water loss from sweating during lunar surface extravehicular activities. Gas cooling was adequate during the short zero-g extravehicular activities performed from the command module. The prediction of EVA workloads became more reliable as inflight data was accumulated. The prediction of the average metabolic cost of an EVA was more reliable than the cost of an individual short-term task.

J.M. Waligora↗
NASA NTRS1994

Heat dissipation in controlled environment enclosures through the application of water screens

The use of plate glass-water thermal barriers in controlled environment facilities effectively reduces the thermal load within the plant growth chamber. This allows high PPFs to be provided for plant growth and development studies, adequate simulation of daily light integrals, and simulation of peak PPF's. Further, substantial amounts of incandescent lamp supplementation can be used to achieve simulation of daylight R:FR ratios which are needed to ensure adequate stem development in some species. While the focus in this paper is on the use of entire thermal barriers which separate the lighting enclosure from the plant growth chamber, the same principles apply to the use of water jackets for cooling individual lamps (such as can occur with xenon-arc lamps). In this instance, the barrier separating the lamps from the plant chamber can be much simpler (e.g., plexiglass) as the main function of the barrier is to separate the air ventilation of the lamp enclosure from the air system within the plant growth chamber. The main advantage of water as a thermal barrier is the negligible absorption of radiation in the photosynthetically-active and near infrared wavebands. Consequently, plate glass-water barriers typically allow transmission of approximately 90% of radiation in these regions. While ventilated double and triple glazing systems appear to be attractive alternative to water barriers from an operating standpoint, their significant absorption in the biologically-important wavebands (7 - 12%) with each glass layer and longer-wave cut-offs (typically 2500 - 4000 nm) makes them a much less attractive alternative. The data presented here demonstrate clearly that measurement of PPF alone is not an adequate representation of the radiation environment being used in a controlled environment study. The amounts and proportions of long-wave and short-wave radiation in a plant growth chamber are dependent on lamp type, lamp combination, presence of a thermal barrier, the type of thermal barrier between the lamps and the plant growing area and the overall construction and design of the chamber. It is important, therefore, in reporting results of controlled environment studies, to adequately describe both the details of the lighting system used and the characteristics of the radiation produced by that system, so results of different studies can be adequately evaluated and compared.

Warrington, I. J.↗
NASA NTRS2019

Level Set Topology Optimization of Load Carrying Heat Dissipation Devices

In this paper, we introduce a level set method topology optimization method of structures subjected to coupled mechanical and thermal loads. Different examples considering compliance minimization and stress minimization under temperature and volume constraints, and mass minimization under stress and temperature constraints, are presented. The p-norm of the stress field and temperature field is used to approximate the maximum stress and temperature, respectively. The developed method is applied in the design of an L-bracket and a battery package. The results show that designs obtained by ignoring the thermal or structural constraints can result in high values of temperature or stress, respectively.

Kambampati, Sandilya↗
DOE OSTI2020

Cryogenic C-band wavelength division multiplexing system using an AIM Photonics Foundry process design kit

Cryogenic environments make superconducting computing possible by reducing thermal noise, electrical resistance and heat dissipation. Heat generated by the electronics and thermal conductivity of electrical transmission lines to the outside world constitute two main sources of thermal load in such systems. As a result, higher data rates require additional transmission lines which come at an increasingly higher cooling power cost. Hybrid or monolithic integration of silicon photonics with the electronics can be the key to higher data rates and lower power costs in these systems. We present a 4-channel wavelength division multiplexing photonic integrated circuit (PIC) built from modulators in the AIM Photonics process development kit (PDK) that operate at 25 Gbps at room temperature and 10 Gbps at 40 K. We further demonstrate 2-channel operation for 20 Gbps aggregate data rate at 40 K using two different modulators/wavelengths, with the potential for higher aggregate bit rates by utilizing additional channels.

42 ENGINEERING↗
DOE OSTI2022

Reactor fuel pellets with thermally-conductive inserts, and related reactor fuel pellet arrangements

Fuel pellets and fuel pellet arrangements include thermally-conductive inserts within a fuel. The inserts have at least one portion of a thermally-conductive material, such as radially-extending fins. The inserts are configured to dissipate heat during use of the fuel pellets, while minimizing the amount of the total volume of the fuel pellet that is occupied by non-fissile material. The inclusion of heat-dissipating inserts enables the fuel pellets to exhibit improved thermal performance over the lifetime of the fuel, including a relatively low peak temperature and relatively low integrated average temperatures, while the minimal volume of the inserts avoids significantly decreasing the percent of enrichment achievable.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
NASA NTRS1989

A numerical analysis of the effects of conjugate heat transfer, vapor compressibility, and viscous dissipation in heat pipes

The effects of conjugate heat transfer, vapor compressibility, and viscous dissipation in heat pipes are discussed. The accuracy of the partially parabolic versus the elliptic presentation of the governing equations is also examined. The results show that the axial wall conduction has a tendency to make the temperature distribution more uniform for heat pipes with large ratios of pipe wall to effective liquid-wick thermal conductivity. The compressible and incompressible models show very close agreement for the total pressure drop, while the local pressure variations along the heat pipe are quite different for these two models when the radial Reynolds number at the interface is high.

Faghri, Amir↗
NASA NTRS2000

Thermal Considerations of Space Solar Power Concepts with 3.5 GW RF Output

This paper presents the thermal challenge of the Space Solar Power (SSP) design concepts with a 3.5 GW radio-frequency (RF) output. High efficiency klystrons are thermally more favored than solid state (butterstick) to convert direct current (DC) electricity to radio-frequency (RF) energy at the transmitters in these concepts. Using klystrons, the heat dissipation is 0.72 GW. Using solid state, the heat dissipation is 2.33 GW. The heat dissipation of the klystrons is 85% at 500C, 10% at 300C, and 5% at 125C. All the heat dissipation of the solid state is at 100C. Using klystrons, the radiator area is 74,500 square m Using solid state, the radiator area is 2,362,200 square m Space constructable heat pipe radiators are assumed in the thermal analysis. Also, to make the SSP concepts feasible, the mass of the heat transport system must be minimized. The heat transport distance from the transmitters to the radiators must be minimized. It can be accomplished by dividing the radiator into a cluster of small radiators, so that the heat transport distances between the klystrons and radiators can be minimized. The area of each small radiator is on the order of 1 square m. Two concepts for accommodating a cluster of small radiators are presented. If the distance between the transmitters and radiators is 1.5 m or less, constant conductance heat pipes (CCHPs) are acceptable for heat transport. If the distance exceeds 1.5 m, loop heat pipes (LHPs) are needed.

Choi, Michael K.↗
DOE OSTI2023

SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm 2

Thermal management has become a major barrier in the development of high-power micro-devices. Microchannel heat sinks (MCHS) are a promising method to dissipate high heat fluxes from high power density devices. Reducing the thermal resistance will reduce the temperature increase of the electronic device, allowing for higher powers to be achieved while maintaining a safe operating temperature. This paper reports on the use of silicon carbide (Sic) microchannels to dissipate high heat fluxes up to 1 kW/cm 2 over a footprint of 0.25 cm 2 . The use of high aspect ratio and decreased hydraulic diameter channels has allowed for very low thermal resistances to be achieved at higher heat duties compared to previous studies. The experiments performed resulted in heater temperatures of less than 60 °C and thermal resistances as low as 0.024 cm 2 . ° $C$/W between the heater surface and fluid inlet temperature. In conclusion, the demonstrated thermal performance of the SiC MCHS is an encouraging means for dissipating heat from high power density microelectronic devices.

42 ENGINEERING↗
NASA NTRS1999

The Effect of Cathode Composition on the Thermal Characteristics of Lithium-Ion Cells

The specific thermal capacity and heat dissipation rate for lithium ion cells containing LiNiO2 and mixed oxide (75%LiCoO2+ 25%LiNiO2) as cathode materials are compared. The experimental measurements were made using a radiative calorimeter consisting of a copper chamber maintained at -168 C by circulating liquid nitrogen and enclosed in a vacuum bell jar. The specific thermal capacity was determined based on warm-up and cool-down transients. The heat dissipation rate was calculated from the values measured for heat radiated and stored, and the resulting values were corrected for conductive heat dissipation through the leads. The specific heat was 1.117 J/ C-g for the LiNiO2 cell and 0.946 J/ C-g for the 75%LiCoO2,25%LiNiO2 cell. Endothermic cooling at the beginning of charge was very apparent for the cell containing 75%LiCoO2,25%LiNiO2 as the cathode. Exothermic heating began at a higher state of charge for the cell with the 75%LiCoO2,25%LiNiO2 cathode compared to the LiNiO2 cathode cell. During discharge, the rate of heat dissipation increased with increase in the discharge current for both types of cells. The maximum heat dissipated at C/5 discharge was 0.065 W and 0.04 W for the LiNiO2 and 75%LiCoO2,25%LiNiO2 cells, respectively, The thermoneutral potential showed variability toward the end of discharge. The plateau region of the curves was used to calculate average thermoneutral potentials of 3.698 V and 3.837 V for the LiNiO2 cell and the 75%LiCoO2,25%LiNiO2 cell, respectively.

Vaidyanathan, Hari↗
NASA NTRSDate not supplied

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗