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At least 37 records · Page 2

A numerical analysis of the effects of conjugate heat transfer, vapor compressibility, and viscous dissipation in heat pipes

The effects of conjugate heat transfer, vapor compressibility, and viscous dissipation in heat pipes are discussed. The accuracy of the partially parabolic versus the elliptic presentation of the governing equations is also examined. The results show that the axial wall conduction has a tendency to make the temperature distribution more uniform for heat pipes with large ratios of pipe wall to effective liquid-wick thermal conductivity. The compressible and incompressible models show very close agreement for the total pressure drop, while the local pressure variations along the heat pipe are quite different for these two models when the radial Reynolds number at the interface is high.

Faghri, Amir↗

Thermal Considerations of Space Solar Power Concepts with 3.5 GW RF Output

This paper presents the thermal challenge of the Space Solar Power (SSP) design concepts with a 3.5 GW radio-frequency (RF) output. High efficiency klystrons are thermally more favored than solid state (butterstick) to convert direct current (DC) electricity to radio-frequency (RF) energy at the transmitters in these concepts. Using klystrons, the heat dissipation is 0.72 GW. Using solid state, the heat dissipation is 2.33 GW. The heat dissipation of the klystrons is 85% at 500C, 10% at 300C, and 5% at 125C. All the heat dissipation of the solid state is at 100C. Using klystrons, the radiator area is 74,500 square m Using solid state, the radiator area is 2,362,200 square m Space constructable heat pipe radiators are assumed in the thermal analysis. Also, to make the SSP concepts feasible, the mass of the heat transport system must be minimized. The heat transport distance from the transmitters to the radiators must be minimized. It can be accomplished by dividing the radiator into a cluster of small radiators, so that the heat transport distances between the klystrons and radiators can be minimized. The area of each small radiator is on the order of 1 square m. Two concepts for accommodating a cluster of small radiators are presented. If the distance between the transmitters and radiators is 1.5 m or less, constant conductance heat pipes (CCHPs) are acceptable for heat transport. If the distance exceeds 1.5 m, loop heat pipes (LHPs) are needed.

Choi, Michael K.↗

The Effect of Cathode Composition on the Thermal Characteristics of Lithium-Ion Cells

The specific thermal capacity and heat dissipation rate for lithium ion cells containing LiNiO2 and mixed oxide (75%LiCoO2+ 25%LiNiO2) as cathode materials are compared. The experimental measurements were made using a radiative calorimeter consisting of a copper chamber maintained at -168 C by circulating liquid nitrogen and enclosed in a vacuum bell jar. The specific thermal capacity was determined based on warm-up and cool-down transients. The heat dissipation rate was calculated from the values measured for heat radiated and stored, and the resulting values were corrected for conductive heat dissipation through the leads. The specific heat was 1.117 J/ C-g for the LiNiO2 cell and 0.946 J/ C-g for the 75%LiCoO2,25%LiNiO2 cell. Endothermic cooling at the beginning of charge was very apparent for the cell containing 75%LiCoO2,25%LiNiO2 as the cathode. Exothermic heating began at a higher state of charge for the cell with the 75%LiCoO2,25%LiNiO2 cathode compared to the LiNiO2 cathode cell. During discharge, the rate of heat dissipation increased with increase in the discharge current for both types of cells. The maximum heat dissipated at C/5 discharge was 0.065 W and 0.04 W for the LiNiO2 and 75%LiCoO2,25%LiNiO2 cells, respectively, The thermoneutral potential showed variability toward the end of discharge. The plateau region of the curves was used to calculate average thermoneutral potentials of 3.698 V and 3.837 V for the LiNiO2 cell and the 75%LiCoO2,25%LiNiO2 cell, respectively.

Vaidyanathan, Hari↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

Heat Transfer of Airfoils and Plates

The few available test data on the heat dissipation of wholly or partly heated airfoil models are compared with the corresponding data for the flat plate as obtained by an extension of Prandtl's momentum theory, with differentiation between laminar and turbulent boundary layer and transitional region between both, the extent and appearance of which depend upon certain critical factors. The satisfactory agreement obtained justifies far-reaching conclusions in respect to other profile forms and arrangements of heated surface areas. The temperature relationship of the material quantities in its effect on the heat dissipation is discussed as far as is possible at tk.e present state of research, and it is shown that the profile drag of heated wing surfaces can increase or decrease with the temperature increase depending upon the momentarily existent structure of the boundary layer.

Seibert, Otto↗

An Innovative Very Low Thermal Power Waste Heat Recovery System for Thermal Control of Deep Space Missions: A Thermal Flask in Space

Future missions to deep space, such as those to the outer planets (Jupiter, Saturn, etc.), which would rely on solar photovoltaic power, would need extremely large solar arrays to produce sufficient power for their operations because solar intensity is so low at those locations. Hence any additional power that would be needed for thermal control is extremely limited. Previous deep space missions like Juno (to Jupiter) required almost 200 W of electrical power for thermal control. This is prohibitively large for many future mission concepts, and leads to them needing very large solar arrays. For Saturn, where the solar flux is 1/4th the flux at Jupiter, this would entail an extremely large increase in the solar array size to accommodate the need for thermal survival power, which would be prohibitively large in size and mass, and very expensive. Hence there is a need to come up with a thermal architecture and design options that would not need such prohibitively large thermal power levels. One solution relies on harvesting the pre-existing waste heat from all the heat dissipation that would be present from operation of electronics, instruments, etc. for their own functionality. For example, for a generic Saturn mission, the various electronics would already dissipate about 200 Watts of heat that is simply "thrown away" to space from the spacecraft surfaces. The amount of thermal power that would be required for the safe thermal control of components within the spacecraft in deep space would be roughly of this magnitude for this class of spacecraft. So it makes good sense to try to harvest the waste heat and employ it to maintain the temperatures of all the components within their allowable limits. In particular, propulsion systems typically need to be kept above their freezing limits, around room temperature (15 C). Electronics needs to be kept typically above -40 C and batteries above -20 C. The next question becomes how to harvest this waste heat and direct it to the components that would need it for their survival. The proposed system utilizes a mechanically pumped, single phase fluid loop to pick up the waste heat from components attached to this loop's tubing and then directed to a thermal flask that has tubing attached to it. The thermal flask is cylindrically shaped and contains essentially all systems and components in the spacecraft within it, with the exception of the solar array, antennae, thrusters and various apertures of instruments, etc. to allow them an unobstructed view of space. Waste heat from the heat-dissipating components warms up the fluid and is carried to the flask surface and deposited on it via the fluid loop's flow. The entire flask is covered with Multi-Layered Insulation (MLI) to minimize the heat loss from the flask and allow it to remain warm. Hence the flask essentially creates a thermal environment within which the spacecraft components reside. The temperature of the components within the flask is then essentially the same as the temperature of the flask. This approach could be a very enabling feature for deep space missions. This paper describes the approach utilized for this thermal architecture, along with its mechanical and implementation aspects. Additionally it will compare and contrast this approach with the more conventional solutions utilized earlier.

Bhandari, Pradeep↗

Direct coronal heating from dissipation of magnetic field

The visible corona of the Sun appears to be heated by direct dissipation of magnetic fields. The magnetic fields in the visible corona are tied at both ends to the photosphere where the active convection continually rotates and shuffles the footpoints in a random pattern. The twisting and wrapping of flux tubes about each other produce magnetic neutral sheets in a state of dynamical nonequilibrium such that the current sheets become increasingly concentrated with the passage of time. Dissipation of the high current densities takes place regardless of the high electrical conductivity of the fluid. The convection on the feet of the lines of force at the surface of the Sun goes directly (within a matter of 10 to 20 hours) into heat in the corona. The rate of doing work seems adequate to supply the necessary 10 to the 7th power ergs/square cm. sec for the active corona.

Parker, E. N.↗

Radiator Design and Installation - II, Special Report

A mathematical analysis of radiator design has been made. The volume of the radiator using least total power has been expressed in a single formula which shows that the optimum radiator volume is independent of the shape of the radiator and which makes possible the construction of design tables that give the optimum radiator volume per 100-horsepower heat dissipation as a function of the speed, of the altitude, and of one parameter involving characteristics of the airplane. Although, for a given set of conditions, the radiator volume using the least total power is fixed, the frontal area, or the length of the radiator needs to be separately specified in order to satisfy certain other requirement such as the ability to cool with the pressure drop available while the airplane is climbing. In order to simplify the specification for the shape of the radiator and in order to reduce the labor involved in calculating the detailed performance of radiators, generalized design curves have been developed for determining the pressure drop, the mass flow of air, and the power expended in overcoming the cooling drag of a radiator from the physical dimensions of the radiator. In addition, a table is derived from these curves, which directly gives the square root of the pressure drop required for ground cooling as a function of the radiator dimensions, of the heat dissipation and of the available temperature difference. Typical calculations using the tables of optimum radiator volume and the design curves are given. The jet power that can be derived from the heated air is proportional to the heat dissipation and is approximately proportional to the square of the airplane speed and to the reciprocal of the absolute temperature of the atmosphere. A table of jet power, per 100 horsepower of heat dissipation at various airplane speeds and altitudes is presented.

Tifford, Arthur N.↗

Electrical and Thermal Characteristics of Lithium-Ion Cells

The 18650 type lithium ion cells are characterized by a cell resistance of 130 m Omega, capacity of 1.27 Ah at 25C, and a mid-discharge voltage of 3.6 V. The capacity loss in the 72-hour stand test was 3.39 percent. The heat dissipation properties were determined by a radiative calorimeter. During charge, initial endothermic cooling and subsequent exothermic cooling beyond 55 percent state-of-charge were observed. At C/2 rate of discharge (which is considered medium rate), the heat dissipated was 17 mW/cc. The heat dissipation profile during discharge is also unique in the presence of a minimum that is different from that observed for Ni-Cd, Ni-MH, and Ni-H2 cells.

Vaidyanathan, Hari↗

Electrical and Thermal Characteristics of Lithium-Ion Cells

The 18,650 type lithium ion cells are characterized by a cell resistance of 130 mOmega, capacity of 1.27 Ah at 25 C, and a mid-discharge voltage of 3.6 V. The capacity loss in the 72-hour stand test was 3.39%. The heat dissipation properties were determined by a radiative calorimeter. During charge, initial endothermic cooling and subsequent exothermic cooling beyond 55% state- of-charge were observed. At C/2 rate of discharge (which is considered medium rate), the heat dissipated was 17 mW/cu cm. The heat dissipation profile during discharge is also unique in the presence of a minimum that is different from that observed for Ni-Cd, Ni-MH, and Ni-H2 cells.

Rao. Gopalskrishna M.↗

Silicon Heat Pipe Array

Improved methods of heat dissipation are required for modern, high-power density electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology. Heat pipes offer a solution to this problem. Heat pipes are passive, self-contained, two-phase heat dissipation devices. Heat conducted into the device through a wick structure converts the working fluid into a vapor, which then releases the heat via condensation after being transported away from the heat source. Heat pipes have high thermal conductivities, are inexpensive, and have been utilized in previous space missions. However, the cylindrical geometry of commercial heat pipes is a poor fit to the planar geometries of microelectronic assemblies, the copper that commercial heat pipes are typically constructed of is a poor CTE (coefficient of thermal expansion) match to the semiconductor die utilized in these assemblies, and the functionality and reliability of heat pipes in general is strongly dependent on the orientation of the assembly with respect to the gravity vector. What is needed is a planar, semiconductor-based heat pipe array that can be used for cooling of generic MCM (multichip module) assemblies that can also function in all orientations. Such a structure would not only have applications in the cooling of space electronics, but would have commercial applications as well (e.g. cooling of microprocessors and high-power laser diodes). This technology is an improvement over existing heat pipe designs due to the finer porosity of the wick, which enhances capillary pumping pressure, resulting in greater effective thermal conductivity and performance in any orientation with respect to the gravity vector. In addition, it is constructed of silicon, and thus is better suited for the cooling of semiconductor devices.

Yee, Karl Y.↗

Joule-heating power dissipation in a type-II superconductor tube.

The theoretical analysis of the Joule-heating power density in a specific hollow cylinder of a NbZr superconductor is presented. It is seen that the power density, which is the primary source of internal heating neglecting localized annihilation heating, can have a very complicated behavior, especially in the circular region. Rough estimates of the relative temperature changes are made, and the locations at which instabilities are more likely to initiate are considered.

Urban, E. W.↗

Tidal dissipation, surface heat flow, and figure of viscoelastic models of Io

The deformation of Io, the tidal dissipation rate, and its interior spatial distribution are investigated by means of numerical simulations based on (1) a three-layer model (with dissipation in the mantle) or (2) a four-layer model (with dissipation in the asthenosphere). The mathematical derivation of the models is outlined; the selection of the input-parameter values is explained; the results are presented in extensive graphs and contour maps; and the constraints imposed on the models by observational data on the hot-spot distribution, tidal deformation, and gravity field are discussed in detail. It is found that both dissipation mechanisms may play a role on Io: model (2) is better able to explain the concentration of hot spots near the equator, while the presence of a large hot spot near the south pole (if confirmed by observations) would favor model (1).

Segatz, M.↗

Water Membrane Evaporator

A water membrane evaporator (WME) has been conceived and tested as an alternative to the contamination-sensitive and corrosion-prone evaporators currently used for dissipating heat from space vehicles. The WME consists mainly of the following components: An outer stainless-steel screen that provides structural support for the components mentioned next; Inside and in contact with the stainless-steel screen, a hydrophobic membrane that is permeable to water vapor; Inside and in contact with the hydrophobic membrane, a hydrophilic membrane that transports the liquid feedwater to the inner surface of the hydrophobic membrane; Inside and in contact with the hydrophilic membrane, an annular array of tubes through which flows the spacecraft coolant carrying the heat to be dissipated; and An inner exclusion tube that limits the volume of feedwater in the WME. In operation, a pressurized feedwater reservoir is connected to the volume between the exclusion tube and the coolant tubes. Feedwater fills the volume, saturates the hydrophilic membrane, and is retained by the hydrophobic membrane. The outside of the WME is exposed to space vacuum. Heat from the spacecraft coolant is conducted through the tube walls and the water-saturated hydrophilic membrane to the liquid/vapor interface at the hydrophobic membrane, causing water to evaporate to space. Makeup water flows into the hydrophilic membrane through gaps between the coolant tubes.

Ungar, Eugene K.↗

Bioprocessing: Prospects for space electrophoresis

The basic principles of electrophoresis are reviewed in light of its past contributions to biology and medicine. The near-zero gravity environment of orbiting spacecraft may present some unique advantages for a variety of processes, by abolishing the major source of convection in fluids. As the ground-based development of electrophoresis was heavily influenced by the need to circumvent the effects of gravity, this process should be a prime candidate for space operation. Nevertheless, while a space facility for electrophoresis may overcome the limitations imposed by gravity, it will not necessarily overcome all problems inherent in electrophoresis. These are, mainly, electroosmosis and the dissipation of the heat generated by the electric field. The NASA program has already led to excellent coatings to prevent electroosmosis, while the need for heat dissipation will continue to impose limits on the actual size of equipment. It is also not excluded that, once the dominant force of gravity is eliminated, disturbances in fluid stability may originate from weaker forces, such as surface tension.

Bier, M.↗

Expert System For Heat Exchanger

Diagnosis simplified for non-engineers. Developmental expert-system computer program assists operator in controlling, monitoring operation, diagnosing malfunctions, and ordering repairs of heat-exchanger system dissipating heat generated by 20-kW radio transmitter. System includes not only heat exchanger but also pumps, fans, sensors, valves, reservoir, and associated plumbing. Program conceived to assist operator while avoiding cost of keeping engineer in full-time attendance. Similar programs developed for heating, ventilating, and air-conditioning systems.

Bagby, D. Gordon↗

Thermal Analysis and Design Considerations of NASA's Passively Cooled 35K Next Generation Space Telescope (NGST)

The configuration and thermal analyses of NASA's Next Generation Space Telescope (NGST) Yardstick concept utilizing a novel sunshield approach for passive cooling is described. The NGST mission concept of a large aperture optical telescope passively cooled to less than 40 K and instrument detectors passively cooled to below 30 K is unique from any other mission flown to date. Achieving such a low operational temperature requires reducing by a factor of several thousand the internal heat dissipation and environmental heating of the telescope. The techniques for achieving these requirements, i.e. orbit selection, configuration, etc., along with the supporting thermal analyses are described.

Parrish, Keith↗