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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Feasibility of Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System for High Voltage Applications

The newly patented micro-multilayer multifunctional electrical insulation (MMEI) system was developed for future electric aircraft applications which critically require lightweight but high voltage (HV), high temperature, and corona or partial discharge (PD) resistant insulation. During the initial development stages, the concept and practicability of the MMEI system were successfully validated with its exceptionally high dielectric breakdown voltages. The multilayer structures were optimized in terms of material type, individual layer thickness, and overall layer configuration along with potential mechanisms identified for its superior performance. Subsequently, scalability, manufacturability, and commercial applicability of the MMEI system were demonstrated with the 1 meter long, 3-phase HV, high power (HP) bus bar prototypes. Two prototypes, one with the conventional SOA insulation system including Mica sheet and the other with an optimized MMEI, were designed, fabricated, and tested successfully. Both prototypes passed both HiPot and PD tests up to the highest test voltage available, 15 kVAC, although the latter showed a slight increase in PD activities at 12.5 kV. However, the prototype with MMEI was 15% lighter or 12% thinner than the other one. Current efforts to significantly enhance the PD resistance of the MMEI system by employing semiconductive shielding layers, which can be also multifunctional, e.g., electromagnetic interference shielding, moisture blocking, heat dissipation, for various HV applications are also discussed in this paper.

Novel Electrical Insulation↗
NASA NTRS1974

The interaction of spacecraft high voltage power systems with the space plasma environment

Research work has shown that the interaction of a spacecraft and its high voltage power systems with the space plasma environment can result in harmful power loss and damage to insulators and metal surfaces. Insulator and solar panel tests were performed and flight tests are planned. High voltage power processing equipment was shown to be affected by power loss, and by transients due to plasma interactions. Power loss was determined to be roughly proportional to the square of the voltage and increases approximately as the square root of the area. Kapton, Teflon, and glass were found to be satisfactory insulating materials and it is concluded that for large space power stations should consider the effect of large pinhole currents.

Domitz, S.↗
NASA NTRS1974

The interaction of spacecraft high voltage power systems with the space plasma environment

The development of spacecraft with electrical loads that require high voltage power is discussed. The high voltage solar array has been considered for supplying d.c. power directly to high voltage loads such as ion thrusters and communication tubes without intermediate power processing. Space power stations for transferring solar power to earth are being studied in the 40 kilovolt, multikilowatt regime. Analytical and experimental studies have determined that with the advent of high voltage power, new problems will arise through the interaction of the high voltage surfaces with the charged particle environment of space. The interactive environment has been identified and duplicated to some extent in simulation facilities at NASA-Lewis Research Center and at several contractor locations.

Domitz, S.↗
NASA NTRSDate not supplied

Power Quality Analysis for a High Voltage Power System for Urban Air Mobility Application

Maturation of electric power technologies has opened the door for deployment of new types of aircraft within urban air mobility (UAM) markets. These new types of aircraft use non-conventional designs, which do not fall within existing regulatory requirements; this is especially true for the design and verification of the high voltage primary power systems which are being proposed for many of these aircraft. The purpose of this paper is to investigate and inform integration requirements, mainly related to power quality, based on a point design of a NASA Lift-plus-Cruise Vehicle Electrical Power System (EPS) and Utilization Equipment (UE). The results will be used to inform normal and abnormal operating performance of the EPS and UE for future standards in regards to Power Quality.

Nuha S Nawash↗
NASA NTRS2023

X-57 Cockpit Interface Control Document (ICD-CEPT-006)

The Cockpit Interface Control Document defines the hardware interfaces between the X-57 cockpit and subsystems. It provides locational and operational information in support of ground and flight operations with details on controls and displays that include Modes of Operation, Start-Up and Shut- Down Sequence diagrams and captures the current state of the MOD II Avionics Power Architecture. There is also preliminary information of the MOD III and MOD IV configurations. Microsoft PowerPoint was chosen for the document as early development required frequent meetings with multiple customers including aircraft operators (pilots), ground operations, support contractors and power, instrumentation, and human systems integration engineers and PowerPoint enabled presentations that could be quickly modified based on customer and developer interaction. One of the driving requirements for the cockpit design was to keep the left side panel as close the stock Tecnam panel as possible to reduce the failure risk of flight critical indicators. The original annunciator panel in the left side panel was modified to alert the pilot to failures in critical X-57 subsystems and an operator audio alert capability was added for these subsystems. Power-Up switches for the aircraft low voltage 13.8 VDC systems are located at the bottom of the left side panel and center panel, the same location as the stock Tecnam 13.8 VDC switches. The switches for energizing the high voltage system were located in the overhead panel to reduce the risk of inadvertently energizing the high voltage system during the low voltage power-up sequence. The Cruise Motor ARM switches were also located in the overhead panel and correspond to the same location as the stock Tecnam ignition switches. The stock Tecnam throttle levers and prop pitch levers were retained for the X-57. The throttle levers were renamed torque levers since they controlled the commanded torque to the cruise motors. The prop pitch levers provide a commanded RPM signal to an electronic prop pitch controller. X-57 specific displays, located in the right-side panel, are driven by dedicated sensors that monitor right and left side cruise motor RPM, right and left high voltage “Traction Bus” A and B (voltage, current and power) and the Avionics Bus DC converters (A and B) voltage and current. An X-57 Multi-Function Display (MFD) located in the center panel displays CAN Bus parameters. CAN Bus architecture is not certified for flight so these displays could not be used for safety critical information but were designed to be used for test point information only.

Laura Kushner↗
NASA NTRS1984

Advances in solid state switchgear technology for large space power systems

High voltage solid state remote power controllers (RPC's) and the required semiconductor power switches to provide baseline technology for large, high power distribution systems in the space station, all electric airplane and other advanced aerospace applications were developed. The RPC's were developed for dc voltages from 28 to 1200 V and ac voltages of 115, 230, and 440 V at frequencies of 400 Hz to 20 kHz. The benefits and operation of solid state RPC's and highlights of several developments to bring the RPC to technology readiness for future aerospace needs are examined. The 28 V dc Space Shuttle units, three RPC types at 120 V dc, two at 270/300 V dc, two at 230 V ac and several high power RPC models at voltages up to 1200 V dc with current ratings up to 100 A are reviewed. New technology programs to develop a new family of (DI)2 semiconductor switches and 20 kHz, 440 V ac RPC's are described.

Sundberg, G. R.↗
NASA NTRS1984

Advanced in solid state switchgear technology for large space power systems

High voltage solid state remote power controllers (RPC's) and the required semiconductor power switches to provide baseline technology for large, high power distribution systems in the Space Station, all electric airplane and other advanced aerospace applications were developed. The RPC's were developed for dc voltages from 28 to 1200 V and ac voltages of 115, 230, and 440 V at frequencies of 400 Hz to 20 kHz. The benefits and operation of solid state RPC's and highlights of several developments to bring the RPC to technology readiness for future aerospace needs are examined. The 28 V dc Space Shuttle units, three RPC types at 120 V dc, two at 270/300 V dc, two at 230 V ac and several high power RPC models at voltages up to 1200 V dc with current ratings up to 100 A are reviewed. New technology programs to develop a new family of (DI)2 semiconductor switches and 20 kHz, 440 V ac RPC's are described.

Sundberg, G. R.↗
NASA NTRS2023

Evaluation of Elements used for Manufacturing of NanoLam Metallized Polymer Film Capacitors

Metallized polymer film capacitors (MPFC) manufactured by NanoLam technology have a better volumetric efficiency and performance that may exceed the reliability of conventional MPFCs typically used in power and high voltage systems that require high insulation resistance and low power losses. These capacitors can be also an effective replacement for electrolytic and stacked ceramic capacitors currently used in space applications looking to save significant volume and mass. This report evaluates the effects of environmental conditions including radiation and storage at room and high temperatures on the characteristics of NanoLam elements used in the production of MPFCs. Assessments of the reliability acceleration factors and predictions for the useful life are made based on highly accelerated life tests (HALT) using distributions of times to parametric failures at different stress conditions. It has been shown that even a relatively small amount of moisture absorbed at room environments in the dielectric layers may substantially change the probability of failure. In the presence of moisture, degradation processes that started after voltage application continue with time during storage.

Metallized polymer film capacitors (MPFC)↗
NASA NTRS2018

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Electric aircrafts↗
NASA NTRS2018

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Multifunctional↗
NASA NTRS1979

NASCAP modelling of high-voltage power system interactions with space charged-particle environments

A simple space power system operating in geosynchronous orbit was analyzed. This system consisted of two solar array wings and a central body. Each solar array wing was considered to be divided into three regions operating at 2000 volts. The center body was considered to be an electrical ground with the array voltages both positive and negative relative to ground. The system was analyzed for both a normal environment and a moderate geomagnetic substorm environment. Initial results indicate a high probability of arcing at the interconnects on the negative operating voltage wing. The dielectric strength of the substrate may be exceeded giving rise to breakdown in the bulk of the material. The geomagnetic substorm did not seem to increase the electrical gradients at the interconnects on the negative operating voltage wing but did increase the gradients on the positive operating voltage wing which could result in increased coupling current losses.

Stevens, N. J.↗
NASA NTRS2001

An Active Substrate Driver for Enabling Mixed-Voltage SOI Systems-On-A-Chip

The current trend for space application systems is towards fully integrated systems-on-a-chip. To facilitate this drive, high-voltage transistors must reside on the same substrate as low-voltage transistors. These systems must also be radiation tolerant, particularly for space missions such as the Europa Lander and Titan Explorer. SOI CMOS technology offers high levels of radiation hardness. As a result, a high-voltage lateral MOSFET has been developed in a partially-depleted (PD) SOI technology. Utilizing high voltages causes a parasitic transistor to have non-negligible effects on a circuit. Several circuit architectures have been used to compensate for the radiation induced threshold voltage shift of the parasitic back-channel transistor. However, a new architecture for high-voltage systems must be employed to bias the substrate to voltage levels insuring all parasitic transistors remain off. An active substrate driver has been developed to accomplish task. Additional information is contained in the original extended abstract.

Jackson, S. A.↗
NASA NTRS1984

A high voltage electrical power system for low Earth orbit applications

The results of testing a high voltage electrical power system (EPS) breadboard using high voltage power processing equipment developed at Marshall Space Flight Center and Ni-Cd batteries are discussed. These test results are used to extrapolate to an efficient, reliable, high capacity EPS for near term low Earth orbit, high power applications. EPS efficiencies, figures of merit, and battery reliability with a battery protection and reconditioning circuit are presented.

Lanier, J. R., Jr.↗
NASA NTRS1973

Skylab high voltage electrical/electronic systems corona assessment.

Six significant design parameters which must be considered in the corona assessment include the operating voltage, radio frequency power, the 'pressure times spacing' relation, operating temperature, gases and contaminants in the environment, and configuration and field gradients. An equipment and experiments survey is presented, giving attention to corona-free equipment and equipment requiring detailed investigations.

Dunbar, W. G.↗
NASA NTRS1978

Investigation of high voltage spacecraft system interactions with plasma environments

An experimental investigation was undertaken for insulator and conductor test surfaces biased up to + or - 1kV in a simulated low earth orbit charged particle environment. It was found that these interactions are controlled by the insulator surfaces surrounding the biased conductors. For positive applied voltages the electron current collection can be enhanced by the insulators. For negative applied voltages the insulator surface confines the voltage to the conductor region. Understanding these interactions and the technology to control their impact on system operation is essential to the design of solar cell arrays for ion drive propulsion applications that use direct drive power processing.

Stevens, N. J.↗
NASA NTRS1979

NASCAP modelling of high-voltage power system interactions with space charged-particle environments

The NASA Charging Analyzer Program (NASCAP), an engineering tool capable of analyzing the impact of the charged particle environment on spacecraft surfaces and systems, is described. NASCAP is a quasi-static computational program which analyzes the charging of a 3-dimensional complex body as a function of time and system-generated voltages for given space environmental conditions. The material properties of the surfaces are taken into account; the surface potentials, low energy sheath, potential distribution in space and particle trajectories are calculated. An application of NASCAP to a simple space solar power station consisting of two 6 m by 18 m solar array wings surrounding a central body is presented. Each solar array wing is considered to be divided into three regions operating at 2000 volts. Results of NASCAP analysis of the system for a normal environment and a moderate geomagnetic substorm environment are discussed.

Stevens, N. J.↗
NASA NTRS1995

Insulation Requirements of High-Voltage Power Systems in Future Spacecraft

The scope, size, and capability of the nation's space-based activities are limited by the level of electrical power available. Long-term projections show that there will be an increasing demand for electrical power in future spacecraft programs. The level of power that can be generated, conditioned, transmitted, and used will have to be considerably increased to satisfy these needs, and increased power levels will require that transmission voltages also be increased to minimize weight and resistive losses. At these projected voltages, power systems will not operate satisfactorily without the proper electrical insulation. Open or encapsulated power supplies are currently used to keep the volume and weight of space power systems low and to protect them from natural and induced environmental hazards. Circuits with open packaging are free to attain the pressure of the outer environment, whereas encapsulated circuits are imbedded in insulating materials, which are usually solids, but could be liquids or gases. Up to now, solid insulation has usually been chosen for space power systems. If the use of solid insulation is continued, when voltages increase, the amount of insulation for encapsulation also will have to increase. This increased insulation will increase weight and reduce system reliability. Therefore, non-solid insulation media must be examined to satisfy future spacecraft power and voltage demands. In this report, we assess the suitability of liquid, space vacuum, and gas insulation for space power systems.

Qureshi, A. Haq↗