Search NASA⌕ Search

SEARCH · Search NASA

Results for “Harsh Embedded Systems”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

23 records · Page 2

Distributed Engine Control Empirical/Analytical Verification Tools

NASA's vision for an intelligent engine will be realized with the development of a truly distributed control system featuring highly reliable, modular, and dependable components capable of both surviving the harsh engine operating environment and decentralized functionality. A set of control system verification tools was developed and applied to a C-MAPSS40K engine model, and metrics were established to assess the stability and performance of these control systems on the same platform. A software tool was developed that allows designers to assemble easily a distributed control system in software and immediately assess the overall impacts of the system on the target (simulated) platform, allowing control system designers to converge rapidly on acceptable architectures with consideration to all required hardware elements. The software developed in this program will be installed on a distributed hardware-in-the-loop (DHIL) simulation tool to assist NASA and the Distributed Engine Control Working Group (DECWG) in integrating DCS (distributed engine control systems) components onto existing and next-generation engines.The distributed engine control simulator blockset for MATLAB/Simulink and hardware simulator provides the capability to simulate virtual subcomponents, as well as swap actual subcomponents for hardware-in-the-loop (HIL) analysis. Subcomponents can be the communication network, smart sensor or actuator nodes, or a centralized control system. The distributed engine control blockset for MATLAB/Simulink is a software development tool. The software includes an engine simulation, a communication network simulation, control algorithms, and analysis algorithms set up in a modular environment for rapid simulation of different network architectures; the hardware consists of an embedded device running parts of the CMAPSS engine simulator and controlled through Simulink. The distributed engine control simulation, evaluation, and analysis technology provides unique capabilities to study the effects of a given change to the control system in the context of the distributed paradigm. The simulation tool can support treatment of all components within the control system, both virtual and real; these include communication data network, smart sensor and actuator nodes, centralized control system (FADEC full authority digital engine control), and the aircraft engine itself. The DECsim tool can allow simulation-based prototyping of control laws, control architectures, and decentralization strategies before hardware is integrated into the system. With the configuration specified, the simulator allows a variety of key factors to be systematically assessed. Such factors include control system performance, reliability, weight, and bandwidth utilization.

DeCastro, Jonathan↗

An Intelligent Strain Gauge with Debond Detection and Temperature Compensation

The harsh rocket propulsion test environment will expose any inadequacies associated with preexisting instrumentation technologies, and the criticality for collecting reliable test data justifies investigating any encountered data anomalies. Novel concepts for improved systems are often conceived during the high scrutiny investigations by individuals with an in-depth knowledge from maintaining critical test operations. The Intelligent Strain Gauge concept was conceived while performing these kinds of activities. However, the novel concepts are often unexplored even if it has the potential for advancing the current state of the art. Maturing these kinds of concepts is often considered to be a tangential development or a research project which are both normally abandoned within the propulsion-oriented environment. It is also difficult to justify these kinds of projects as a facility enhancement because facility developments are only accepted for mature and proven technologies. Fortunately, the CIF program has provided an avenue for bringing the Intelligent Strain Gauge to fruition. Two types of fully functional smart strain gauges capable of performing reliable and sensitive debond detection have been successfully produced. Ordinary gauges are designed to provide test article data and they lack the ability to supply information concerning the gauge itself. A gauge is considered to be a smart gauge when it provides supplementary data relating other relevant attributes for performing diagnostic function or producing enhanced data. The developed strain gauges provide supplementary signals by measuring strain and temperature through embedded Karma and nickel chromium (NiCr) alloy elements. Intelligently interpreting the supplementary data into valuable information can be performed manually, however, integrating this functionality into an automatic system is considered to be an intelligent gauge. This was achieved while maintaining a very low mass. The low mass enables debond detection and temperature compensation to be performed when the gauge is utilized on small test articles. It was also found that the element's mass must be relatively small to avoid overbearing the desired thermal dissipation characteristics. Detecting the degradation of a gauge s bond was reliably achieved by correlating thermal dissipation with the bond s integrity. This was accomplished by precisely coupling a NiCr element with a Karma element for accurately interjecting and quantifying thermal energy. A finite amount of thermal energy is consistently placed in the gauge by electrically powering the NiCr element. The energy will only be temporarily stored before it begins to dissipate into the surrounding structure through the gauge bond. The ability to transmit the energy into the structure becomes greatly inhibited by any discontinuity in the bond s substrate. Therefore, the way the thermal dissipation occurs will reveal even the slightest change in the integrity of the bond.

Jensen, Scott L.↗

History and Flight Devleopment of the Electrodynamic Dust Shield

The surfaces of the moon, Mars, and that of some asteroids are covered with a layer of dust that may hinder robotic and human exploration missions. During the Apollo missions, for example, lunar dust caused a number of issues including vision obscuration, false instrument readings, contamination, and elevated temperatures. In fact, some equipment neared failure after only 75 hours on the lunar surface due to effects of lunar dust. NASA's Kennedy Space Center has developed an active technology to remove dust from surfaces during exploration missions. The Electrodynamic Dust Shield (EDS), which consists of a series of embedded electrodes in a high dielectric strength substrate, uses a low power, low frequency signal that produces an electric field wave that travels across the surface. This non-uniform electric field generates dielectrophoretic and electrostatic forces capable of moving dust out of these surfaces. Implementations of the EDS have been developed for solar radiators, optical systems, camera lenses, visors, windows, thermal radiators, and fabrics The EDS implementation for transparent applications (solar panels, optical systems, windows, etc.) uses transparent indium tin oxide electrodes on glass or transparent lm. Extensive testing was performed in a roughly simulated lunar environment (one-sixth gravity at 1 mPa atmospheric pressure) with lunar simulant dust. EDS panels over solar radiators showed dust removal that restored solar panel output reaching values very close to their initial output. EDS implementations for thermal radiator protection (metallic spacecraft surfaces with white thermal paint and reflective films) were also extensively tested at similar high vacuum conditions. Reflectance spectra for these types of implementations showed dust removal efficiencies in the 96% to 99% range. These tests indicate that the EDS technology is now at a Technology Readiness Level of 4 to 5. As part of EDS development, a flight version is being prepared for several flight opportunities. The flight version of the EDS will incorporate significantly smaller electronics, with an expected mass and volume of 500 g and 350 cm(exp. 3) respectively. One of the opportunities is an International Space Station (ISS) experiment: Materials for International Space Station Experiment 10 (MISSE-10). This experiment aims to verify the EDS can withstand the harsh environment of space and will look to closely replicate the solar environment experienced on the moon. A second flight opportunity exists to provide an EDS to several companies as part of NASA's Lunar CATALYST program. The current mission concept would fly the EDS on the footpad of one of the Lunar CATALYST vehicles. Dust will likely deposit on the footpad through normal surface rover activities, but also upon landing where lunar dust is expected to be uplifted. To analyze the e effectiveness of the EDS system, photographs of the footpad with one of the spacecrafts onboard cameras are anticipated. If successful in these test flights, the EDS technology will be ready to be used in the protection of actual mission equipment for future NASA and commercial missions to the moon, asteroids, and Mars.

Lunar↗

Sensor Requirements and Roadmaps

The chapter starts with a brief overview of the state-of-the-art of the sensing technologies. Principles of detection and the stage of integration in conjunction with the need are discussed. Based on the projected sensor requirements to accomplish propulsion systems with distributed active control, the existent gaps and selected types of sensor technologies are addressed, which are foreseen to deliver the required sensitivity, the resolution, the range, and the bandwidth in classes of sensors and which will allow operation under harsh environment conditions. By changing the packaging and/or design of the current sensors, operation environments of 750°C may be possible, which would meet requirements for sensors located towards the engine intake, compressor and in some cases low-pressure turbine. However, the majority of sensors for locations close to the engine combustion chamber or afterburner (with operation temperatures up to 1700°C) do not exist. There is also a need for smart sensors, which would enable future distributed control architecture. In addition a number of sensors, which are of interest for more intelligent gas turbine engines, are being explored or do not yet exist, for example turbine emission species sensors, burning patter factor sensors, fuel property sensors, and exhaust gas composition sensors. Meanwhile, rapid emerging technologies were made available during the three years duration of the Task Group. These include tip clearance measurement technologies such as eddy current, and microwave methods. To meet future sensor requirements, new fabrication and material technologies (MEMS, other), advanced sensing principles (spectroscopy, other), and their potential applications to new sensor types need to be explored. The status of current R&D for new sensors and future expectations are summarized in a comprehensive table. Sensors and associated electronics that have to operate in high temperature are foreseen to be largely available by 2015 (SiC) and 2020 (SiCN). Both of these technologies come with the potential of embedding such high temperature sensors within the structure. The information presented in the chapter represents the state-of-the-art of the sensing technology of the years 2005-2007 to the best knowledge of the authors. The authors are also fully aware of the fact that there may be many ongoing research programs as well as individual research that are not publicly supported and public information is not available. Therefore, the report might miss that section of knowledge. Also, progress in research and development is made every day such that often, the recent information may be fast outdated. The reader should bear in mind these facts.

Ion Stiharu↗

SpaceCube Version 1.5

SpaceCube 1.5 is a high-performance and low-power system in a compact form factor. It is a hybrid processing system consisting of CPU (central processing unit), FPGA (field-programmable gate array), and DSP (digital signal processor) processing elements. The primary processing engine is the Virtex- 5 FX100T FPGA, which has two embedded processors. The SpaceCube 1.5 System was a bridge to the SpaceCube 2.0 and SpaceCube 2.0 Mini processing systems. The SpaceCube 1.5 system was the primary avionics in the successful SMART (Small Rocket/Spacecraft Technology) Sounding Rocket mission that was launched in the summer of 2011. For SMART and similar missions, an avionics processor is required that is reconfigurable, has high processing capability, has multi-gigabit interfaces, is low power, and comes in a rugged/compact form factor. The original SpaceCube 1.0 met a number of the criteria, but did not possess the multi-gigabit interfaces that were required and is a higher-cost system. The SpaceCube 1.5 was designed with those mission requirements in mind. The SpaceCube 1.5 features one Xilinx Virtex-5 FX100T FPGA and has excellent size, weight, and power characteristics [4×4×3 in. (approx. = 10×10×8 cm), 3 lb (approx. = 1.4 kg), and 5 to 15 W depending on the application]. The estimated computing power of the two PowerPC 440s in the Virtex-5 FPGA is 1100 DMIPS each. The SpaceCube 1.5 includes two Gigabit Ethernet (1 Gbps) interfaces as well as two SATA-I/II interfaces (1.5 to 3.0 Gbps) for recording to data drives. The SpaceCube 1.5 also features DDR2 SDRAM (double data rate synchronous dynamic random access memory); 4- Gbit Flash for storing application code for the CPU, FPGA, and DSP processing elements; and a Xilinx Platform Flash XL to store FPGA configuration files or application code. The system also incorporates a 12 bit analog to digital converter with the ability to read 32 discrete analog sensor inputs. The SpaceCube 1.5 design also has a built-in accelerometer. In addition, the system has 12 receive and transmit RS- 422 interfaces for legacy support. The SpaceCube 1.5 processor card represents the first NASA Goddard design in a compact form factor featuring the Xilinx Virtex- 5. The SpaceCube 1.5 incorporates backward compatibility with the Space- Cube 1.0 form factor and stackable architecture. It also makes use of low-cost commercial parts, but is designed for operation in harsh environments.

Geist, Alessandro↗