Results for “Hybrid Microcircuit & Microelectronics” — Page 2

NASA NTRS1975

Contamination control in hybrid microelectronic modules. Part 3: Specifications for coating material and process controls

Resin systems for coating hybrids prior to hermetic sealing are described. The resin systems are a flexible silicone junction resin system and a flexible cycloaliphatic epoxy resin system. The coatings are intended for application to the hybrid after all the chips have been assembled and wire bonded, but prior to hermetic sealing of the package. The purpose of the coating is to control particulate contamination by immobilizing particles and by passivating the hybrid. Recommended process controls for the purpose of minimizing contamination in hybrid microcircuit packages are given. Emphasis is placed on those critical hybrid processing steps in which contamination is most likely to occur.

Himmel, R. P.↗

NASA NTRS1973

Design guidelines for use of adhesives in hybrid microcircuits

Although it is generally accepted that the use of adhesives in the assembly of hybrid microcircuits offers advantages over other bonding methods, there currently does not exist a set of guidelines for the selection of adhesives which will insure that hybrid microcircuits assembled with them will meet the long use-life, high-reliability requirements of electronic equipment for space applications. This study was directed to the identification of the properties of electrically insulative adhesives that potentially could cause problems in such an application, and to the development of evaluation tests to quantify these properties and thus form the basis for establishing suitable guidelines and, ultimately, specifications. Bond strength, outgassing after cure, and corrosivity were selected for detailed attention since they are considered to be especially critical. Introductory discussion includes enumeration and brief comments on the properties of adhesives considered to be important for the proposed application, a general review of polymeric types of adhesives, and identification of the major types of adhesives commercially available and specifically designed for microelectronic use. The specific tests developed to evaluate bond strength, outgassing after cure, and corrosivity are discussed in detail, and comparative results obtained for selected adhesives representative of the major types are given.

Caruso, S. V.↗