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At least 37 records · Page 2

Sensor Development for Active Flow Control

Presented are the developmental efforts for MEMS sensors for a closed-loop active flow control in a low-speed wind tunnel evaluation. The MEMS sensors are designed in-house and fabricated out of house, and the shear sensors are a thermal type that are collocated with temperature and pressure sensors on a flexible polyimide sheet, which conforms to surfaces of a simple curvature. A total of 6 sensors are located within a 1.5 by 3 mm area as a cluster with each sensor being 300 pm square. The thickness of this sensor cluster is 75 pm. Outputs from the shear sensors have been compared with respect to those of the Preston tube for evaluation of the sensors on a flat plate. Pressure sensors are the absolute type and have recorded pressure measurements within 0.05 percent of the tunnel ESP pressure sensor readings. The sensors and signal conditioning electronics have been tested on both a flat plate and a ramp in Langley s 15-Inch Low-Turbulence Tunnel. The system configuration and control PC is configured with LabView, where calibration constants are stored for desired compensation and correction. The preliminary test results are presented within.

Kahng, Seun K.↗

Vibration-based health characterization of multiple IMUs in UAV applications

Inertial measurement units (IMUs) are vital in UAV navigation for vehicle attitude and position estimation, especially in the frequently-occurring case of temporary loss of GPS capabilities. Degradation in these units could yield inaccurate position estimates, resulting in incorrect input for vehicle control systems. A wide variety of these units exist to meet the needs of UAV operators, general aviation, and military vehicles. In recent decades, lightweight and inexpensive MEMS sensors have grown in popularity with respect to UAVs. Studies into the failure modes of MEMS devices suggest that vibration is one of the leading causes of MEMS degradation. MEMS sensors are generally encased in their own hermetic packaging, as their small size and sensitivity cause them to be particularly vulnerable to air damping and particulate contamination when exposed. Exposure to excessive vibration can cause cracking in this packaging as well as damage to connecting electronics, with recorded results that cause sensors to act outside of their specifications, potentially providing unreliable input to controllers. A prior study from the Politecnico di Torino looked into the degradation of MEMS IMUs, specifically the AXIS-AIS402, for aerospace and vibrating environments. In the study, the authors found that after exposing MEMS IMUs to simulated vibrations from working conditions of aerospace applications, the sensors showed increased noise and increased bias instability. At NASA Ames, several widely-used MEMS IMUs were selected for a new IMU degradation study, comparing accelerometer performance before and after exposure to similar levels of vibration simulating aerospace conditions. The IMUs were selected from the Pixhawk autopilot systems, hobby sUAS, or prior experimental studies at NASA. Additionally, the industrial grade VectorNav-100 IMU was selected as a ground truth reference point to which the performance of the test sensors can be compared. In the study, each sensor is exposed to functional levels of UAV vibration as replicated on a single-frequency vibratory table in the NASA Ames SHARP Laboratory, and each accelerometer is characterized for bias, drift, and noise characteristics both before and after vibratory exposure. The focus of this study is to monitor the health of the IMU sensors and determine if sensor degradation can be detected from output error and frequency spectrum analysis, rather than from microscopic examination of the sensors. In this case, sensor degradation and faulty data can be more easily detectable by non-experts hoping to use these sensors as an important piece of an integrated package. In addition, specific sensor degradation modes potentially leading to in-flight hazards could be identified, such as accelerated levels of drift and altered temperature response. The overall goal of this work is to increase levels of safety for future users of these sensors and to provide a clear analysis of sensor limitations currently lacking in most sensor specification documentation.

IMUs↗

Characterization of Polymer-Coated MEMS Humidity Sensors for Flight Applications

Under NASA's Aviation Safety Program (AvSP), in addition to wind velocity and temperature, water vapor is considered one key factor in determining aviation weather, which is a substantial contributor to many general aviation (GA) accidents. The conventional and reliable humidity measuring methods such as radiation reflection or absorption have relatively high cost in addition to highly specialized operating and maintenance characteristics. This paper presents characterizations of inexpensive MEMS and capacitance type humidity sensors for their potential use on aircraft. If installed, these sensors are subjected to ambient environmental conditions as well as to different chemicals and deicing fluids used on aircraft. This paper reports the effect of different deicing fluids and chemicals on these inexpensive humidity sensors.

Shams, Qamar A.↗

MEMS Memory Elements

This paper presents a design example that illustrates the potential of microelectromechanical systems (MEMS) to perform the mechanical positioning required for addressing stored data and to enable an entirely new mechanism for reading and writing magnetic data. Specifically, MEMS sensors and actuators can be used to achieve active servo control of the separation between magnetic probe tips and a media surface with sub-nanometer accuracy. This allows mechanical position to be used to selectively write magnetic marks in a continuous thin-film magnetic media. In addition, MEMS sensors can be used to measure the separation between a magnetic probe tip and the media with a noise floor of roughly 22 picometers, allowing them to be used as position sensors in a magnetic force microscope (MFM) style data detection system.

Carley, L. Richard↗

NASA Tech Briefs, July 2006

Topics covered include: Airport Remote Tower Sensor Systems; Implantable Wireless MEMS Sensors for Medical Uses; Embedded Sensors for Measuring Surface Regression; Coordinating an Autonomous Earth-Observing Sensorweb; Range-Measuring Video Sensors; Stability Enhancement of Polymeric Sensing Films Using Fillers; Sensors for Using Times of Flight to Measure Flow Velocities; Receiver Would Control Phasing of a Phased-Array Antenna; Modern Design of Resonant Edge-Slot Array Antennas; Carbon-Nanotube Schottky Diodes; Simplified Optics and Controls for Laser Communications; Coherent Detection of High-Rate Optical PPM Signals; Multichannel Phase and Power Detector; Using Satellite Data in Weather Forecasting: I; Using Dissimilarity Metrics to Identify Interesting Designs; X-Windows PVT Widget Class; Shuttle Data Center File-Processing Tool in Java; Statistical Evaluation of Utilization of the ISS; Nanotube Dispersions Made With Charged Surfactant; Aerogels for Thermal Insulation of Thermoelectric Devices; Low-Density, Creep-Resistant Single-Crystal Superalloys; Excitations for Rapidly Estimating Flight-Control Parameters; Estimation of Stability and Control Derivatives of an F-15; Tool for Coupling a Torque Wrench to a Round Cable Connector; Ultrasonically Actuated Tools for Abrading Rock Surfaces; Active Struts With Variable Spring Stiffness and Damping; Multiaxis, Lightweight, Computer-Controlled Exercise System; Dehydrating and Sterilizing Wastes Using Supercritical CO2; Alpha-Voltaic Sources Using Liquid Ga as Conversion Medium; Ice-Borehole Probe; Alpha-Voltaic Sources Using Diamond as Conversion Medium; White-Light Whispering-Gallery-Mode Optical Resonators; Controlling Attitude of a Solar-Sail Spacecraft Using Vanes; and Wire-Mesh-Based Sorber for Removing Contaminants from Air.

Source record↗

MEMS based sun sensor

Explore the source record for details and available documents.

MEMS sun sensor attitude determination↗

MEMS based sun sensor on a chip

A prototype sun sensor has been developed. The accuracy of the MEMS based sun sensor on a chip is estimated to be 1 arcminute.

MEMS sun sensor APS attitude determination↗

A Threshold Helium Leakage Detection Switch with Ultra Low Power Operation

Detecting helium leakage is important in many applications, such as in dry cask nuclear waste storage systems. This work develops a helium detection system based on the relative permittivity (dielectric constant) difference between air and helium. This difference changes the status of an electrostatic microelectromechanical system (MEMS) switch. The switch is a capacitive-based device and requires a very negligible amount of power. Exciting the switch’s electrical resonance enhances the MEMS switch sensitivity to detect low helium concentration. This work simulates two different MEMS switch configurations: a cantilever-based MEMS modeled as a single-degree-freedom model and a clamped-clamped beam MEMS molded using the COMSOL Multiphysics finite-element software. While both configurations demonstrate the switch’s simple operation concept, the clamped-clamped beam was selected for detailed parametric characterization due to its comprehensive modeling approach. The beam detects at least 5% helium concentration levels when excited at 3.8 MHz, near electrical resonance. The switch performance decreases at lower excitation frequencies or increases the circuit resistance. The MEMS sensor detection level was relatively immune to beam thickness and parasitic capacitance changes. However, higher parasitic capacitance increases the switch’s susceptibility to errors, fluctuations, and uncertainties.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Ultra-Low-Power MEMS Selective Gas Sensors

This innovation is a system for gas sensing that includes an ultra-low-power MEMS (microelectromechanical system) gas sensor, combined with unique electronic circuitry and a proprietary algorithm for operating the sensor. The electronics were created from scratch, and represent a novel design capable of low-power operation of the proprietary MEMS gas sensor platform. The algorithm is used to identify a specific target gas in a gas mixture, making the sensor selective to that target gas.

Stetter, Joseph↗

NASA NDE Applications for Mobile MEMS Devices and Sensors

NASA would like new devices and sensors for performing nondestructive evaluation (NDE) of aerospace vehicles. These devices must be small in size/volume, mass, and power consumption. The devices must be autonomous and mobile so they can access the internal structures of aircraft and spacecraft and adequately monitor the structural health of these craft. The platforms must be mobile in order to transport NDE sensors for evaluating structural integrity and determining whether further investigations will be required. Microelectromechanical systems (MEMS) technology is crucial to the development of the mobile platforms and sensor systems. This paper presents NASA s needs for micro mobile platforms and MEMS sensors that will enable NDE to be performed on aerospace vehicles.

Wilson, William C.↗

Radio Frequency Telemetry System for Sensors and Actuators

The present invention discloses and teaches apparatus for combining Radio Frequency (RF) technology with novel micro-inductor antennas and signal processing circuits for RF telemetry of real time, measured data, from microelectromechanical system (MEMS) sensors, through electromagnetic coupling with a remote poweringheceiving device. Such technology has many applications, but is especially useful in the biomedical area.

Rainee N Simons↗

Radio frequency telemetry system for sensors and actuators

The present invention discloses and teaches apparatus for combining Radio Frequency (RF) technology with novel micro-inductor antennas and signal processing circuits for RF telemetry of real time, measured data, from microelectromechanical system (MEMS) sensors, through electromagnetic coupling with a remote powering/receiving device. Such technology has many applications, but is especially useful in the biomedical area.

Simons, Rainee N.↗

Evaluation of MEMS-Based Wireless Accelerometer Sensors in Detecting Gear Tooth Faults in Helicopter Transmissions

The diagnostics capability of micro-electro-mechanical systems (MEMS) based rotating accelerometer sensors in detecting gear tooth crack failures in helicopter main-rotor transmissions was evaluated. MEMS sensors were installed on a pre-notched OH-58C spiral-bevel pinion gear. Endurance tests were performed and the gear was run to tooth fracture failure. Results from the MEMS sensor were compared to conventional accelerometers mounted on the transmission housing. Most of the four stationary accelerometers mounted on the gear box housing and most of the CI's used gave indications of failure at the end of the test. The MEMS system performed well and lasted the entire test. All MEMS accelerometers gave an indication of failure at the end of the test. The MEMS systems performed as well, if not better, than the stationary accelerometers mounted on the gear box housing with regards to gear tooth fault detection. For both the MEMS sensors and stationary sensors, the fault detection time was not much sooner than the actual tooth fracture time. The MEMS sensor spectrum data showed large first order shaft frequency sidebands due to the measurement rotating frame of reference. The method of constructing a pseudo tach signal from periodic characteristics of the vibration data was successful in deriving a TSA signal without an actual tach and proved as an effective way to improve fault detection for the MEMS.

gears↗

Nonlinear modeling and performance analysis of cracked beam microgyroscopes

Cracks constitute a common structural defect in microelectromechanical systems that may arise during manufacturing, mechanical fatigue, or shock loading. Areas weakened by cracks increase the flexibility of the microstructure. Furthermore, depending on the crack severity, the increased flexibility can cause dramatic changes in the static and dynamic behaviors of electrically actuated MEMS. In this study, a numerical investigation of the depth and location of multiple edge cracks on the performance of beam microgyroscopes is conducted. Applying the Griffith strain energy release theorem for an edge crack, the vibrational characteristics of microgyroscopes with multiple cracks including the static deflection, natural frequencies, and mode shapes are studied analytically. Then, the differential quadrature method is employed to model the nonlinear dynamic behaviors of the cracked gyroscope system. Cracks initiated along the driving or sensing directions of the microgyroscope are found to have differing effects on its nonlinear dynamic response. This numerical study reveals that the onset of severe single cracks or a series of multiple cracks can significantly affect the sensitivity of the microgyroscope to base rotations and therefore leads to a degradation in the performance of the damaged MEMS sensor. This study also shows that a potential design approach for broadband microgyroscope systems manufactured with cracks can be proposed.

42 ENGINEERING↗

Editorial: Deep-sea observation equipment and exploration technology

The increasing interest in deep-sea exploration is a crucial catalyst for driving advancements in deep-sea observation technology research. Numerous sophisticated sensors have been developed to facilitate comprehensive studies in deep-sea physics, chemistry, and geology. For example, cutting-edge small and compact seabed samplers are now employed on various platforms, such as Autonomous Underwater Vehicles (AUVs), Remotely Operated Vehicles (ROVs), and Human-Operated Vehicles (HOVs), enabling observation of the hadal zone. Additionally, Micro-electromechanical systems (MEMS) sensors are routinely utilized for ocean wave observation. This Research Topic aims to foster new insights into ocean exploration and observation technology, including ocean sensor technology, ocean observation platforms, and ocean observation reliability technology.

47 OTHER INSTRUMENTATION↗

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗