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At least 37 records · Page 2

Reactive Brazing of Carbon-Carbon Composites to Titanium

The Ti-metal/C-C composite joints were formed by reactive brazing with three commercial brazes, namely, Cu-ABA, TiCuNi, and TiCuSil. The joint microstructures were examined using optical microscopy, and scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). The results of the microstructure analysis indicate solute redistribution across the joint and possible metallurgical bond formation via interdiffusion, which led to good wetting and spreading.

Shpargel, Tarah↗

Active Metal Brazing and Characterization of Brazed Joints in Titanium to Carbon-Carbon Composites

The Ti-metal/C-C composite joints were formed by reactive brazing with three commercial brazes, namely, Cu-ABA, TiCuNi, and TiCuSiI. The joint microstructures were examined using optical microscopy and scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). The results of the microstructure analysis indicate solute redistribution across the joint and possible metallurgical bond formation via interdiffusion, which led to good wetting and spreading. A tube-on-plate tensile test was used to evaluate joint strength of Ti-tube/ C-C composite joints. The load-carrying ability was greatest for the Cu-ABA braze joint structures. This system appeared to have the best braze spreading which resulted in a larger braze/C-C composite bonded area compared to the other two braze materials. Also, joint loadcarrying ability was found to be higher for joint structures where the fiber tows in the outer ply of the C-C composite were aligned perpendicular to the tube axis when compared to the case where fiber tows were aligned parallel to the tube axis.

Singh, M.↗

Effect of Composite Substrates on the Mechanical Behavior of Brazed Joints in Metal-Composite System

Advanced composite components are being considered for a wide variety of demanding applications in aerospace, space exploration, and ground based systems. A number of these applications require robust integration technologies to join dissimilar materials (metalcomposites) into complex structural components. In this study, three types of composites (C-C, C-SiC, and SiC-SiC) were vacuum brazed to commercially pure Ti using the active metal braze alloy Cusil-ABA (63Ag-35.3Cu-1.75Ti). Composite substrates with as fabricated and polished surfaces were used for brazing. The microstructure and composition of the joint, examined using scanning electron microscopy (SEM) coupled with energy dispersive spectroscopy (EDS), showed sound metallurgical bonding in all systems. The butt strap tensile (BST) test was performed on bonded specimens at room and elevated temperatures. Effect of substrate composition, interlaminar properties, and surface roughness on the mechanical properties and failure behavior of joints will be discussed.

Singh, M.↗

Installing a Test Tap on a Metal Battery Case

A mechanical fitting and relatively simple and safe method of installing it on the metal case of a battery have been devised to provide access to the interior of the battery to perform inspection and/or to measure such internal conditions as temperature and pressure. A metal boss or stud having an exterior thread is attached to the case by capacitor-discharge stud welding (CDSW), which takes only 3 to 6 milliseconds and in which the metallurgical bond (weld) and the heat-affected zone are limited to a depth of a few thousandths of an inch (a few hundredths of a millimeter). These characteristics of CDSW prevent distortion of the case and localized internal heating that could damage the chemical components inside of the battery. An access hole is then drilled through the stud and case, into the interior of the battery. A mechanical fitting having a matching thread is installed on the stud and the interior end of the fitting is sealed with a pressure-sealing washer/gasket. The exterior end of the fitting is configured for attachment of whatever instrumentation is required for the selected inspection or measurement.

Mayes, Daniel R.↗

Plasticity and Damage Modeling of Stress Asymmetry and Dynamic Behavior of AFS Additive Manufactured Aluminum Alloy 2219

The Solid State Additive Manufacturing (AM) process referred as MELD that fabricated the samples in this study, provides a new path for repairing, coating, joining and additive manufacturing metals and metal matrix composites. This research will be the first application of a physics-based microstructure dependent internal state variable (ISV) plasticity and damage material model to capture the mechanical response of an AM Aluminum Alloy (AA) 2219 via the MELD process. In this research, a microstructure-based internal state variable (ISV) plasticity-damage model was used to capture the mechanical behavior of AFS 2219 aluminum alloy. Aeroprobe Corporation, creator and patent holder for the MELD process, fabricated the material by pushing a solid filler rod of AA2219-T861 material through a hollow rotating tool onto an AA2219 T851 plate substrate. As feedstock, solid or powder precursor metals are pushed through a nonconsumable rotating cylindrical tool. Herein, added layers are deposited and metallurgically bonded to substrate material or previously deposited layers by the heat generated from the rotating tool through plastic deformation of the filler material. Once a layer has been added, the tool height increases, and starts the deposition of the next layer. This process results in beneficial properties such as grain refinement, homogenization and reduced porosity (fully dense). This process will experience temperatures similar to those in the weld nugget zone (WNZ) in friction stir welding (FSW), ranging from 0.6-0.9 Tm, with Tm being the melting point of the material. MELD is highly scalable with AA deposition rates reaching over 1000 cm3/hr, which allows for MELD being used for repairs, coatings, and building components. A motivating factor driving the research for physics-based history dependent material modeling of MELD components is the ability to accurately capture the stress-state and strain rate dependence in the material caused by variations in material microstructure from the MELD processing of new or repaired components. The ISV model incorporates microstructural content and is consistent with continuum level kinematics, kinetics, and thermodynamics. These features allow the ISV model to capture large deformations at the structural scale using the kinematic and isotropic hardening, while microscale damage is obtained from the microstructural features. The benefits of the ISV model arise from the inclusion of structure-property relationships identified from microstructural characterization and experimentation. The Bauschinger effect (BE) is an important concept, vital in the accurate prediction of cyclic stress-strain response of ductile materials such as metals. The ISV model has been successfully used to capture the behavior and damage, and the BE of different aluminum alloys and steels. The ISV model uses kinematic and isotropic hardening to help capture deformations of the material at the macro scale. To understand this hardening relationship, calculating the kinematic and isotropic hardening relationship in the material is warranted for a high-fidelity model. Electron Backscattered Diffraction (EBSD) was used to characterize the as-fabricated microstructure, where a fully-dense equiaxed grain morphology with average grain size of 2.5 μm was observed. Microhardness mapping of the as-built structures, monotonic tension and compression experiments at both quasi-static (0.001/s) strain rates, tension-followed-by-compression and compression-followed-by-tension experiments were performed to obtain the set of plasticity and damage constants necessary to capture strain rate and stress state behavior of this additive material. To calibrate the plasticity-damage model, a single set of constants were determined to capture the different stress states the MELD AA2219. One set of the constants was determined from experimental true stress-strain curves for the tension and compression data. Additionally, microstructural information and data from the open literature were used as the other model constants. This research is a first of its kind for AFS AA2219, includes correlating the ISV model to the monotonic experimental results that capture the isotropic and kinematic plasticity mechanical response.

Rivera, O. G.↗

Metallization for Yb14MnSb11-Based Thermoelectric Materials

Thermoelectric materials provide a means for converting heat into electrical power using a fully solid-state device. Power-generating devices (which include individual couples as well as multicouple modules) require the use of ntype and p-type thermoelectric materials, typically comprising highly doped narrow band-gap semiconductors which are connected to a heat collector and electrodes. To achieve greater device efficiency and greater specific power will require using new thermoelectric materials, in more complex combinations. One such material is the p-type compound semiconductor Yb14MnSb11 (YMS), which has been demonstrated to have one of the highest ZT values at 1,000 C, the desired operational temperature of many space-based radioisotope thermoelectric generators (RTGs). Despite the favorable attributes of the bulk YMS material, it must ultimately be incorporated into a power-generating device using a suitable joining technology. Typically, processes such as diffusion bonding and/or brazing are used to join thermoelectric materials to the heat collector and electrodes, with the goal of providing a stable, ohmic contact with high thermal conductivity at the required operating temperature. Since YMS is an inorganic compound featuring chemical bonds with a mixture of covalent and ionic character, simple metallurgical diffusion bonding is difficult to implement. Furthermore, the Sb within YMS readily reacts with most metals to form antimonide compounds with a wide range of stoichiometries. Although choosing metals that react to form high-melting-point antimonides could be employed to form a stable reaction bond, it is difficult to limit the reactivity of Sb in YMS such that the electrode is not completely consumed at an operating temperature of 1,000 C. Previous attempts to form suitable metallization layers resulted in poor bonding, complete consumption of the metallization layer or fracture within the YMS thermoelement (or leg).

Firdosy, Samad↗

TAB interconnects for space concentrator solar cell arrays

The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

Avery, J.↗

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗

Explosive bonding of metal-matrix composites

Explosive bonding process produces sheet composites of aluminum alloy reinforced by high-strength stainless steel wires. The bonds are excellent metallurgically, no external heat is required, various metals can be bonded, and the process is inexpensive.

Reece, O. Y.↗

Microstructural and Mechanical Evaluation of a Cu-Based Active Braze Alloy to Join Silicon Nitride Ceramics

Self-joining of St. Gobain Si3N4 (NT-154) using a ductile Cu-Al-Si-Ti active braze (Cu-ABA) was demonstrated. A reaction zone approx.2.5-3.5 microns thick) developed at the interface after 30 min brazing at 1317 K. The interface was enriched in Ti and Si. The room temperature compressive shear strengths of Si3N4/Si3N4 and Inconel/Inconel joints (the latter created to access baseline data for use with the proposed Si3N4/Inconel joints) were 140+/-49MPa and 207+/-12MPa, respectively. High-temperature shear tests were performed at 1023K and 1073 K, and the strength of the Si3N4/Si3N4 and Inconel/Inconel joints were determined. The joints were metallurgically well-bonded for temperatures above 2/3 of the braze solidus. Scanning and transmission electron microscopy studies revealed a fine grain microstructure in the reaction layer, and large grains in the inner part of the joint with interfaces being crack-free. The observed formation of Ti5Si3 and AlN at the joint interface during brazing is discussed.

Singh, M.↗

Semiconductor measurement technology: Microelectronic ultrasonic bonding

Information for making high quality ultrasonic wire bonds is presented as well as data to provide a basic understanding of the ultrasonic systems used. The work emphasizes problems and methods of solving them. The required measurement equipment is first introduced. This is followed by procedures and techniques used in setting up a bonding machine, and then various machine- or operator-induced reliability problems are discussed. The characterization of the ultrasonic system and its problems are followed by in-process bonding studies and work on the ultrasonic bonding (welding) mechanism. The report concludes with a discussion of various effects of bond geometry and wire metallurgical characteristics. Where appropriate, the latest, most accurate value of a particular measurement has been substituted for an earlier reported one.

Harman, G. G.↗

Explosive Welding in the 1990's

Explosive bonding is a unique joining process with the serious potential to produce composite materials capable of fulfilling many of the high performance materials capable of fulfilling many of the high performance materials needs of the 1990's. The process has the technological versatility to provide a true high quality metallurgical compatible and incompatible systems. Metals routinely explosively bonded include a wide variety of combinations of reactive and refractory metals, low and high density metals and their alloys, corrosion resistant and high strength alloys, and common steels. The major advantage of the process is its ability to custom design and engineer composites with physical and/or mechanical properties that meet a specific or unusual performance requirement. Explosive bonding offers the designer unique opportunities in materials selection with unique combinations of properties and high integrity bonds that cannot be achieved by any other metal joining process. The process and some applications are discussed.

Lalwaney, N. S.↗

Development of beryllium honeycomb sandwich composite for structural and other related applications

The feasibility of fabricating large beryllium honeycomb panels was demonstrated. Both flat and curved sandwich structures were manufactured using practical, braze bonding techniques. The processes developed prove that metallurgically assembled beryllium honeycomb panels show decided potential where rigid, lightweight structures are required. Three panels, each 10 square feet in surface area, were fabricated, and radiographically inspected to determine integrity. This examination revealed a 97 percent braze in the final panel. It is believed that ceramic dies for forming and brazing would facilitate the fabrication techniques for higher production rates. Ceramic dies would yield a lower thermal gradient in the panel during the braze cycle. This would eliminate the small amount of face sheet wrinkling present in the panels. Hot forming the various panel components demonstrated efficient manufacturing techniques for scaling up and producing large numbers of hot formed beryllium components and panels. The beryllium honeycomb panel demonstrated very good vibrational loading characteristics under test with desirable damping characteristics.

Vogan, J. W.↗

Investigation of Methods for Selectively Reinforcing Aluminum and Aluminum-Lithium Materials

Several studies have indicated that selective reinforcement offers the potential to significantly improve the performance of metallic structures for aerospace applications. Applying high-strength, high-stiffness fibers to the high-stress regions of aluminum-based structures can increase the structural load-carrying capability and inhibit fatigue crack initiation and growth. This paper discusses an investigation into potential methods for applying reinforcing fibers onto the surface of aluminum and aluminum-lithium plate. Commercially-available alumina-fiber reinforced aluminum alloy tapes were used as the reinforcing material. Vacuum hot pressing was used to bond the reinforcing tape to aluminum alloy 2219 and aluminum-lithium alloy 2195 base plates. Static and cyclic three-point bend testing and metallurgical analysis were used to evaluate the enhancement of mechanical performance and the integrity of the bond between the tape and the base plate. The tests demonstrated an increase in specific bending stiffness. In addition, no issues with debonding of the reinforcing tape from the base plate during bend testing were observed. The increase in specific stiffness indicates that selectively-reinforced structures could be designed with the same performance capabilities as a conventional unreinforced structure but with lower mass.

Bird, R. Keith↗