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NASA NTRS2004

Chapter 9: MEMS Applications in Spacecraft Thermal Control and Chapter 13: Handling and Contamination Control Considerations for Critical Space Applications

Thermal control systems (TCS) are an integral part of all spacecraft and instruments. To operate properly all spacecraft components must be maintained within a specified temperature band, which in some instances can be quite tight (less than 1 degree C). Traditionally this is accomplished by "passive" designs, but with modem spacecraft and instruments it is increasingly necessary to use active thermal control technologies. Microelectromechanical System (MEMS) can be useful in developing an active TCS, and may be especially useful for small spacecraft. As the MEMS knowledge matures, the applications of MEMS in spacecraft thermal control emerges as a viable technology for thermal engineers. Potential applications include specialized thermal control coatings, thermal switches, and specialized filters for instruments. Although MEMS technology demonstrates benefits, it also poses challenges for thermal en,oineers due to the lack of in-flight MEMS data. As a consequence, in order to design a MEMS thermal control device and receive the full advantage, it is important to understand the potential impact of the space environment on MEMS devices and the design/operational constraints imposed in their use. An entire chapter is devoted to handling and contamination controls for Micro Electro Mechanical Systems (MEMS) in space applications due to the importance of the topic area to final mission success. Handling and contamination control is discussed relative to the full life cycle from the very basic wafer level processing up through on orbit deployment. MEMS packaging will drive the need to tailor the Handling and Contamination Control Plan in order to assure adequacy of the overall program on a program by program basis. Plan elements are discussed at length to assist the user in preparing and implementing effective plans for both handling and contamination control to prevent deleterious effects.

Osiander, Robert↗
NASA NTRS1997

A Novel Silicon Micromachined Integrated MCM Thermal Management System

"Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.

Kazmierczak, M. J.↗
NASA NTRS2005

RF MEMS Phase Shifters and their Application in Phase Array Antennas

Electronically scanned arrays are required for space based radars that are capable of tracking multiple robots, rovers, or other assets simultaneously and for beam-hopping communication systems between the various assets. ^Traditionally, these phased array antennas used GaAs Monolithic Microwave Integrated Circuit (MMIC) phase shifters, power amplifiers, and low noise amplifiers to amplify and steer the beam, but the development of RF MEMS switches over the past ten years has enabled system designers to consider replacing the GaAs MMIC phase shifters with RF Micro-Electro Mechanical System (MEMS) phase shifters. In this paper, the implication of replacing the relatively high loss GaAs MMICs with low loss MEMS phase shifters is investigated.

Scardelletti, Maximilian↗
NASA NTRS1995

MEMS Technology for Space Applications

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

vandenBerg, A.↗
NASA NTRS1995

Performance Thresholds for Application of MEMS Inertial Sensors in Space

We review types of inertial sensors available and current usage of inertial sensors in space and the performance requirements for these applications. We then assess the performance available from micro-electro-mechanical systems (MEMS) devices, both in the near and far term. Opportunities for the application of these devices are identified. A key point is that although the performance available from MEMS inertial sensors is significantly lower than that achieved by existing macroscopic devices (at least in the near term), the low cost, low size, and power of the MEMS devices opens up a number of applications. In particular, we show that there are substantial benefits to using MEMS devices to provide vibration, and for some missions, attitude sensing. In addition, augmentation for global positioning system (GPS) navigation systems holds much promise.

Smit, Geoffrey N.↗
NASA NTRS2021

Exep: Environmental Testing of High-Actuator-Count Mems Deformable Mirrors for Space-Based Applications

Coronagraph instruments on future space telescopes will rely on deformable mirrors to create high contrast images for the direct detection of exoplanets. As part of the NASA Exoplanet Explorations Program’s coronagraph technology development efforts, two sets of Micro-electro-mechanical systems (MEMS) deformable mirrors manufactured by Boston Micromachines Corporation were exposed to vibration and thermal cycles representative of launch conditions. The first set were 952-actuator Kilo-DMs that successfully demonstrated 100% actuator survival and achieved ~1e-8 contrast after the environment test. The second round used an engineering-grade 2048-actuator deformable mirror on which few changes were identified after the environmental test. However, each actuator that changed behavior was flagged as anomalous beforehand or was directly adjacent to a defective actuator. From this result, we hypothesized that typical actuators on a science grade deformable mirror are robust to environmental testing. A third set of 2048-actuator deformable mirror have been procured for a planned test to characterize the deformable mirrors using interferometric measurements, contrast results on a new in-air coronagraph testbed, and infrared microscopy on the internal structure of the MEMS devices.

Lam, Charlie↗
NASA NTRS2004

The NASA GSFC MEMS Colloidal Thruster

A number of upcoming missions require different thrust levels on the same spacecraft. A highly scaleable and efficient propulsion system would allow substantial mass savings. One type of thruster that can throttle from high to low thrust while maintaining a high specific impulse is a Micro-Electro-Mechanical System (MEMS) colloidal thruster. The NASA GSFC MEMS colloidal thruster has solved the problem of electrical breakdown to permit the integration of the electrode on top of the emitter by a novel MEMS fabrication technique. Devices have been successfully fabricated and the insulation properties have been tested to show they can support the required electric field. A computational finite element model was created and used to verify the voltage required to successfully operate the thruster. An experimental setup has been prepared to test the devices with both optical and Time-Of-Flight diagnostics.

Cardiff, Eric H.↗
NASA NTRS2011

Image Registration for Stability Testing of MEMS

Image registration, or alignment of two or more images covering the same scenes or objects, is of great interest in many disciplines such as remote sensing, medical imaging. astronomy, and computer vision. In this paper, we introduce a new application of image registration algorithms. We demonstrate how through a wavelet based image registration algorithm, engineers can evaluate stability of Micro-Electro-Mechanical Systems (MEMS). In particular, we applied image registration algorithms to assess alignment stability of the MicroShutters Subsystem (MSS) of the Near Infrared Spectrograph (NIRSpec) instrument of the James Webb Space Telescope (JWST). This work introduces a new methodology for evaluating stability of MEMS devices to engineers as well as a new application of image registration algorithms to computer scientists.

Memarsadeghi, Nargess↗
NASA NTRS2002

Tightly Coupled Inertial Navigation System/Global Positioning System (TCMIG)

Many NASA applications planned for execution later this decade are seeking high performance, miniaturized, low power Inertial Management Units (IMU). Much research has gone into Micro-Electro-Mechanical System (MEMS) over the past decade as a solution to these needs. While MEMS devices have proven to provide high accuracy acceleration measurements, they have not yet proven to have the accuracy required by many NASA missions in rotational measurements. Therefore, a new solution has been formulated integrating the best of all IMU technologies to address these mid-term needs in the form of a Tightly Coupled Micro Inertial Navigation System (INS)/Global Positioning System (GPS) (TCMIG). The TCMIG consists of an INS and a GPS tightly coupled by a Kalman filter executing on an embedded Field Programmable Gate Array (FPGA) processor. The INS consists of a highly integrated Interferometric Fiber Optic Gyroscope (IFOG) and a MEMS accelerometer. The IFOG utilizes a tightly wound fiber coil to reduce volume and the high level of integration and advanced optical components to reduce power. The MEMS accelerometer utilizes a newly developed deep etch process to increase the proof mass and yield a highly accurate accelerometer. The GPS receiver consists of a low power miniaturized version of the Blackjack receiver. Such an IMU configuration is ideal to meet the mid-term needs of the NASA Science Enterprises and the new launch vehicles being developed for the Space Launch Initiative (SLI).

Watson, Michael D.↗
NASA NTRS2005

Application of MEMS Microphone Array Technology to Airframe Noise Measurements

Current generation microphone directional array instrumentation is capable of extracting accurate noise source location and directivity data on a variety of aircraft components, resulting in significant gains in test productivity. However, with this gain in productivity has come the desire to install larger and more complex arrays in a variety of ground test facilities, creating new challenges for the designers of array systems. To overcome these challenges, a research study was initiated to identify and develop hardware and fabrication technologies which could be used to construct an array system exhibiting acceptable measurement performance but at much lower cost and with much simpler installation requirements. This paper describes an effort to fabricate a 128-sensor array using commercially available Micro-Electro-Mechanical System (MEMS) microphones. The MEMS array was used to acquire noise data for an isolated 26%-scale high-fidelity Boeing 777 landing gear in the Virginia Polytechnic Institute and State University Stability Tunnel across a range of Mach numbers. The overall performance of the array was excellent, and major noise sources were successfully identified from the measurements.

Humphreys, William M., Jr.↗
NASA NTRS2006

Deep Reactive Ion Etching (DRIE) of High Aspect Ratio SiC Microstructures using a Time-Multiplexed Etch-Passivate Process

High aspect ratio silicon carbide (SiC) microstructures are needed for microengines and other harsh environment micro-electro-mechanical systems (MEMS). Previously, deep reactive ion etching (DRIE) of low aspect ratio (AR less than or = 1) deep (greater than 100 micron) trenches in SiC has been reported. However, existing DRIE processes for SiC are not well-suited for definition of high aspect ratio features because such simple etch-only processes provide insufficient control over sidewall roughness and slope. Therefore, we have investigated the use of a time-multiplexed etch-passivate (TMEP) process, which alternates etching with polymer passivation of the etch sidewalls. An optimized TMEP process was used to etch high aspect ratio (AR greater than 5) deep (less than 100 micron) trenches in 6H-SiC. Power MEMS structures (micro turbine blades) in 6H-SiC were also fabricated.

Evans, Laura J.↗
DOE OSTI2022

Achieving High-Resolution Hard X-ray Microscopy using Monolithic 2D Multilayer Laue Lenses

This article introduces the 2D multilayer Laue lens (MLL) nanofocusing optics recently developed for high-resolution hard X-ray microscopy. The new optics utilized a micro-electro-mechanical-system (MEMS)-based template to accommodate two linear MLL optics in a pre-aligned configuration. Angular misalignment between the two lenses was controlled in tens of millidegrees, and the lateral position error was on a micrometer scale. Using the developed 2D MLLs, an astigmatism-free point focus of approximately 14 nm by 13 nm in horizontal and vertical directions, respectively, at 13.6 keV photon energy was obtained. In conclusion, the success of 2D MLL optics with an approaching 10 nm resolution is a significant step forward for the development of high-resolution hard X-ray microscopy and applications of MLL optics in the hard X-ray community.

36 MATERIALS SCIENCE↗
DOE OSTI2023

In-Situ Transmission Electron Microscopy Study of the Evolution of Extended Defects in Oxide Nuclear Fuels

In-situ transmission electron microscopy (TEM) with simulated extreme environments is an effective tool for understanding and tracking microstructural changes down to the atomic scale. The objective of this research is to study the effect of temperature on the evolution of extended defects in ThO2 and UO2. Here, we present in-situ TEM isochronal thermal annealing experiments using a micro-electro-mechanical-system (MEMS)-based heating holder. ThO2 and UO2 single crystal specimens were grown inside an inert silver ampoule using hydrothermal synthesis. Both samples were irradiated using 2 MeV protons at 600oC up to 0.1 dpa at Texas A&M University’s Accelerator Laboratory. Fig. 1a shows a weak-beam dark field TEM image of ThO2 after irradiation, indicating the presence of faulted 1/3 <111> type dislocation loops. This presentation will discuss the effect of annealing temperature (600oC, 800oC, 1000oC, 1100oC, etc.) on dislocation loop density, size and distribution, loop nature (interstitial/vacancies) and Burgers vector, as well as the formation of voids in both ThO2 and UO2. This work will also discuss the interaction between defects during annealing. The in-situ TEM annealing cycle is shown in Fig 1b. This research significantly improves the understanding of defect behavior in oxide nuclear fuels with temperature and will aid computational modeling efforts. This work was supported as part of the Center for Thermal Energy Transport under Irradiation (TETI) Energy Frontier Research Center, funded by the U.S. Department of Energy Office of Science.

36 MATERIALS SCIENCE↗
DOE OSTI2021

An Acoustic Quench Detection Method for CICC Conductor Operating in Gas or Liquid

A method using micro-electro-mechanical system (MEMS) acoustic sensor technology to detect a quench and abnormal behavior of a superconductor is discussed. MEMS of microphone chips are installed along the coolant space of a superconducting conductor to monitor the coolant condition. By arranging the acoustic sensor array in a coolant flow channel, it is possible to quickly detect a change in the local condition of the coolant with precise spatial resolution. This method is useful for monitoring superconducting magnets and power cables, especially those made with a cable-in-conduit-conductor (CICC) configuration. The methodology described in this work will also be very useful for a high temperature superconducting (HTS) conductor, such as REBCO tape conductors.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
NASA NTRS1995

Liquid metal micro heat pipes for space radiator applications

Micromachining is a chemical means of etching three-dimensional structures, typically in single-crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (micro electro mechanical systems), where in addition to the ordinary two dimensional (planar) microelectronics, it is possible to build three-dimensional micromotors, electrically-actuated microvalves, hydraulic systems, and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor microfabrication. The University of Cincinnati group in collaboration with NASA Lewis formed micro heat pipes in silicon by the above techniques. Work is ongoing at a modest level, but several essential bonding and packaging techniques have been recently developed. Currently, we have constructed and filled water/silicon micro heat pipes. Preliminary thermal tests of arrays of 125 micro heat pipes etched in a 1 inch x 1 inch x 250 micron silicon wafer have been completed. These pipes are instrumented with extremely small P-N junctions to measure their effective conductivity and their maximum operating power. A relatively simple one-dimensional model has been developed in order to predict micro heat pipes' operating characteristics. This information can be used to optimize micro heat pipe design with respect to length, hydraulic diameter, and number of pipes. Work is progressing on the fabrication of liquid-metal micro heat pipes. In order to be compatible with liquid metal (sodium or potassium), the inside of the micro heat pipes will be coated with a refractory metal (such as tungsten, molybdenum, or titanium).

Gerner, F. M.↗
NASA NTRS1995

Proceedings of the International Conference on Integrated Micro/Nanotechnology for Space Applications

The recent evolution of microelectronic technologies coupled with the growth of micro-electro-mechanical systems (MEMS) has had significant impact in the commercial sector. The focus of this conference was to anticipate and extend the incorporation of nano-electronics and MEMS into application specific integrated microinstruments (ASIM's) in space systems. Presentations ranged from mission application of nano-satellites to silicon micromachining for photonic applications.

Source record↗
NASA NTRS1995

Averting Denver Airports on a Chip

As a result of recent advances in software engineering capabilities, we are now in a more stable environment. De-facto hardware and software standards are emerging. Work on software architecture and design patterns signals a consensus on the importance of early system-level design decisions, and agreements on the uses of certain paradigmatic software structures. We now routinely build systems that would have been risky or infeasible a few years ago. Unfortunately, technological developments threaten to destabilize software design again. Systems designed around novel computing and peripheral devices will spark ambitious new projects that will stress current software design and engineering capabilities. Micro-electro-mechanical systems (MEMS) and related technologies provide the physical basis for new systems with the potential to produce this kind of destabilizing effect. One important response to anticipated software engineering and design difficulties is carefully directed engineering-scientific research. Two specific problems meriting substantial research attention are: A lack of sufficient means to build software systems by generating, extending, specializing, and integrating large-scale reusable components; and a lack of adequate computational and analytic tools to extend and aid engineers in maintaining intellectual control over complex software designs.

Sullivan, Kevin J.↗
NASA NTRS1995

Micromechanical Switches on GaAs for Microwave Applications

In this presentation, we describe the fabrication of micro-electro-mechanical system (MEMS) devices, in particular, of low-frequency multi-element electrical switches using SiO2 cantilevers. The switches discussed are related to micromechanical membrane structures used to perform switching of optical signals on silicon substrates. These switches use a thin metal membrane which is actuated by an electrostatic potential, causing the switch to make or break contact. The advantages include: superior isolation, high power handling capabilities, high radiation hardening, very low power operations, and the ability to integrate onto GaAs monolithic microwave integrated circuit (MMIC) chips.

Randall, John N.↗