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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sources NASA NTRS DOE OSTI

NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗

NASA NTRS2013

Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials

The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

Suh, Jong-ook↗

DOE OSTI2023

Water-Resistant Container Testing: A846-500 Container Design

The purpose of this report is to detail the results of water ingress testing conducted on the A846-500 container design and discuss these results against the water-resistant container requirements of TA55-AP-522 and PA-RD-01009. The A846-500 is a proposed commercially off the shelf inner container option for material storage inside of a glovebox and/or as an approved non-hermetically sealed inner of an approved packaging configuration inside of an approved outer container as listed in PA-RD-01022. The A845-500 is shaped similar to a soda bottle (wide cylindrical base with a narrow, tapered neck at the top), made of 316L stainless steel, and utilizes a knurled, threaded lid with a silicone gasket for closure and containment.

42 ENGINEERING↗

DOE OSTI2023

Water-Resistant Container Testing CNUT INGB Container Design (Rev. 1)

The purpose of this report is to detail the results of water ingress testing conducted on the 5Qt Castle Nut In-Glovebox (5QtCNUT INGB) container design and discuss these results against the water-resistant container requirements of TA55-AP- 522 and PA-RD-01009. The CNUT is a general-purpose container option for material storage inside of a glovebox and/or as an approved non-hermetically sealed inner of an approved packaging configuration inside of an approved outer container as listed in PA-RD-01022. The CNUT containment boundary consists of a filtered lid and deep drawn body with welded collar all made of 316L stainless steel, an aluminum bronze spin down ring to provide compression of a to Viton® O-ring to create a seal for closure and containment.

36 MATERIALS SCIENCE↗

DOE OSTI2023

Water-Resistant Container Testing: A426-1000 Container Design

The purpose of this report is to detail the results of water ingress testing conducted on the A426-1000 container design and discuss these results against the water-resistant container requirements of TA55-AP- 522 and PA-RD-01009. The A426-1000 is a proposed commercially off the shelf inner container option for material storage inside of a glovebox and/or as an approved non-hermetically sealed inner of an approved packaging configuration inside of an approved outer container as listed in PA-RD-01022. The A426-1000 is shaped like a slip lid container, made of 316L stainless steel, and utilizes a smooth, threaded lid with a silicone O-ring for closure and containment. This container both lid and body is machined out of one billet piece of 316L stainless steel with no welds. See Figure 1 and Table 1 for a summary of the container specifications. For more details on the container design, see Section 1.4.

42 ENGINEERING↗

DOE OSTI2024

Water-Resistant Container Testing: 48 oz Bruntmor Container Design

The purpose of this report is to detail the results of water ingress testing conducted on the 48 oz Bruntmor container design and discuss these results against the water-resistant container requirements of TA55-AP 522 and PA-RD-01009. The 48 oz Bruntmor is a proposed commercially off the shelf inner container option for material storage inside of a glovebox and/or as an approved non-hermetically sealed inner of an approved packaging configuration inside of an approved outer container as listed in PA-RD-01022. The 48 oz Bruntmor is shaped like a slip lid container, made of 18-8 stainless steel, and utilizes a smooth, threaded lid with a silicone gasket for closure and containment. This container both lid and body is hot rolled out of 18-8 stainless steel with one seam weld on the body.

42 ENGINEERING↗

NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗

NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗

NASA NTRS2009

EEE Parts Related Issues

The contents include: 1) Water Soluble Flux; 2) Non-Hermetic Packages; 3) Counterfeit Parts; and 4) Lead-Free Solder.

Hughitt, Brian↗

NASA NTRS2009

Packaging Concerns/Techniques for Large Devices

This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

Sampson, Michael J.↗

NASA NTRS2020

Organic flip chip reliability study for space applications

The current state-of-the-art flip chip packages for space applications are the class-Y non-hermetic ceramic packages, whereas for commercial applications, organic packages have been the mainstream technology for about two decades. The high reliability of the class-Y parts suggests that the hermeticity is not critical for the reliability of flip chip devices and that organic flip chip packages could be reliable enough for space applications. The current report summarizes the result of collaboration between JPL and Cobham semiconductor space solutions to study the reliability of the organic flip chip packages.

Measmer, Rich↗

NASA NTRS2022

Bayesian Assessment of Chlorofluorocarbon (CFC), Hydrochlorofluorocarbon (HCFC) and Halon Banks Suggest Large Reservoirs Still Present in Old Equipment

Halocarbons contained in equipment such as air conditioners, fire extinguishers, and foams continue to be emitted after production has ceased. These ‘banks’ within equipment and applications are thus potential sources of future emissions, and must be carefully accounted for in order to evaluate nascent production versus banked emissions. Here, we build on a probabilistic Bayesian model, previously developed to quantify CFC-11, 12 and 113 banks and their emissions. We extend this model to a suite of the major banked chemicals regulated under the Montreal Protocol (HCFC-22, HCFC-141b, and HCFC-142b, halon-1211, and halon-1301, and CFC-114 and CFC-115) along with CFC-11, 12 and 113 in order to quantify a fuller range of ozone-depleting substance banks by chemical and equipment type. We show that if atmospheric lifetime and prior assumptions are accurate, banks are very likely larger than previous international assessments suggest, and that total production has been very likely higher than reported. We identify that banks of greatest climate-relevance, as determined by global warming potential weighting, are largely concentrated in CFC-11 foams and CFC-12 and HCFC-22 non-hermetic refrigeration. Halons, CFC-11, and 12 banks dominate the banks weighted by ozone depletion potential. Thus, we identify and quantify the uncertainties in substantial banks whose future emissions will contribute to future global warming and delay ozone hole recovery if left unrecovered.

Halocarbons↗

NASA NTRS2011