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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS2017

Ultra-Wideband Array in PCB for Millimeter-Wave 5G and ISM

Next generation 5G mobile architectures will take advantage of the millimeter-wave spectrum to deliver unprecedented bandwidth. Concurrently, there is a need to consolidate numerous disparate allocations into a single, multi-functional array. Existing arrays are either narrow-band, prohibitively expensive or cannot be scaled to these frequencies. In this paper, we present the first ultra-wideband millimeter-wave array to operate across the six 5G and ISM bands spanning 24-71 GHz. Critically, the array is realized using low-cost PCB. The design concept and optimized layout are presented, and fabrication and measurement considerations are discussed.

Ultra-Wideband Array↗
NASA NTRS2009

Embedded passives emulator FY2003 interim report

The National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program has been evaluating state-of-the-art Embedded Passive Technology for the printed circuit board (PCB) industry for the past several years and has conducted its own testing on embedded passive coupons (resistors and capacitors). This document is a progress report of the work performed through fiscal year 2008 by NASA and the Navy to convert an existing PWB (printed wiring board) design to a design that incorporates embedded passive components. The work is being performed through a memorandum of understanding (MOU) between the NEPP Program (NASA) and the Naval Surface Warfare Center (NSWC) Crane Emerging Critical Interconnect Technology (ECIT) Program. NSWC Crane’s ECIT Program has funding to convert two PCB designs from the military and aerospace industry to a PCB design with embedded passives. ECIT will provide a design team that will take a well characterized design and convert it to an embedded design. They will also provide electrical modeling and layout expertise as well as build the PWB in their facility in Indiana. NEPP, through the Jet Propulsion Laboratory (JPL), will assemble any passives deemed not suitable for embedding and the active components and electrically test the new design to the existing (non-embedded) design

Gerke, David↗
NASA NTRS2013

Compact Radar Transceiver with Included Calibration

The Digital Beamforming Synthetic Aperture Radar (DBSAR) is an eight-channel phased array radar system that employs solid-state radar transceivers, a microstrip patch antenna, and a reconfigurable waveform generator and processor unit. The original DBSAR transceiver design utilizes connectorized electronic components that tend to be physically large and heavy. To achieve increased functionality in a smaller volume, PCB (printed circuit board) transceivers were designed to replace the large connectorized transceivers. One of the most challenging problems designing the transceivers in a PCB format was achieving proper performance in the calibration path. For a radar loop-back calibration path, a portion of the transmit signal is coupled out of the antenna feed and fed back into the receiver. This is achieved using passive components for stability and repeatability. Some signal also leaks through the receive path. As these two signal paths are correlated via an unpredictable phase, the leakage through the receive path during transmit must be 30 dB below the calibration path. For DBSAR s design, this requirement called for a 100-dB isolation in the receiver path during transmit. A total of 16 solid-state L-band transceivers on a PCB format were designed. The transceivers include frequency conversion stages, T/R switching, and a calibration path capable of measuring the transmit power-receiver gain product during transmit for pulse-by-pulse calibration or matched filtering. In particular, this calibration path achieves 100-dB isolation between the transmitted signal and the low-noise amplifier through the use of a switching network and a section of physical walls achieving attenuation of radiated leakage. The transceivers were designed in microstrip PCBs with lumped elements and individually packaged components for compactness. Each transceiver was designed on a single PCB with a custom enclosure providing interior walls and compartments to isolate transceiver subsystems from radiated interference. The enclosure also acts as a heat sink for the voltage regulators and power amplifiers inside the system. The PCB transceiver design produces transmit pulses of 2 W with an arbitrary duty cycle. Each transceiver is fed by an external 120-MHz signal transmit and two 1,140-MHz local oscillator signals. The received signal is amplified and down-converted to 120 MHz and is fed to the data processor. The transceiver dimensions are approximately 3.5 11.5 0.6 in. (9 29 1.5 cm). The PCB transceiver design reduces the volume and weight of the DBSAR instrument while maintaining the functionality found in the original design. Both volume and weight are critical for airborne and flight remote sensing instrumentation.

McLinden, Matthew↗
DOE OSTI2025

Packaging a 650V/400A GaN Half-bridge Power Module with Ultra-low Parasitics for Electric Vehicle Drive Applications

This paper proposes a compact and efficient half-bridge power module with three 650 V / 150 A GaN dies in parallel. The power module incorporates a main power printed circuit board (PCB), an interface PCB, and a flex PCB to achieve low parasitics in both power loop and gate-side connection, resolving the issue of high parasitics typically encountered with wire bonding in high-current applications. Additionally, the interface PCB decouples the design constraints between the power loop and the gate loops. The proposed design is optimized with a vertical loop configuration to reduce power loop inductance through magnetic flux cancellation. Finite element analysis indicates that the power loop inductance is 0.58 nH at 100 MHz, while the maximum die junction temperature reaches 131 °C under an ambient temperature of 65 °C and a load current of 385 A. The proposed multi-piece PCB structure reduces the inductance of the drive circuit to minimize EMI and to mitigate false triggering. At the same time, it reduces impedance mismatches across different driver circuits, thereby achieving dynamic current sharing in multi-chip parallel configurations. Under simulation conditions of 400 V / 385 A, the current imbalance among chips was limited to 5 A. A 400 V / 385 A double-pulse test was conducted to experimentally validate the performance of the proposed power module.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2026

Adiabatic Propagation Fixture

Previous simulations have tested HTS magnets with dissipative flux flow regimens for thermal runaway. My goal was to make a system that would be able to take real world data on this for Quench Detection. My poster will show the design for a PCB I made and the test setup for conducting said experiment.

Mercado, E. [NIU, DeKalb]↗
NASA NTRS2019

Modeling and Mitigation of Multi-Loops Related Device Overvoltage in Three Level Active Neutral Point Clamped Converter

This paper establishes an analytical model for the device drain-source overvoltage related to the two loops in three level active neutral point clamped (3L-ANPC) converters. Taking into account the non-linear device output capacitance, two commonly used modulations are investigated in detail. The result shows that the line switching frequency device usually has higher overvoltage, and the switching speed of the high switching frequency device is not strongly influenced by the multiple loops. By keeping the non-active clamping switch off, the effect of the non-linear device output capacitance can be significantly mitigated, which helps reduce the overvoltage. Moreover, the loop inductance can be reduced with vertical loop layout and magnetic cancellation in PCB and busbar design. A 500 kVA 3L-ANPC converter using SiC MOSFETs is built and tested. The experimental results validate the overvoltage model of the two modulations as well as the busbar design. With the non-active clamping switch off, the overvoltage of both the high and line switching frequency devices is significantly reduced, which helps achieve higher switching speed.

Model↗
NASA NTRS2012

Design and Operation of the Planetary In-Situ Capillary Electrophoresis System (PISCES)

The PISCES instrument is a portable, miniature, modular instrument designed to analyze organic molecular signatures of life. PISCES uses microcapillary electrophoresis (μCE) with laser-induced fluorescence detection (LIFD) to analyze fluorescently-labeled analytes prepared on a multi-layer microfluidic chip. As a modular instrument composed of five independently functioning units, each module can be easily detached from the system and used for subsystem testing in different environments, e.g. low temperature. The pneumatic module contains mechanical and electrical components necessary to control pneumatically-actuated valves for on-chip sample processing. A prototype LabVIEW program and two custom printed circuit boards (PCBs) operate the pneumatics module using an Arduino microcontroller, and a tentative design for the module’s housing has been developed. The high-voltage module contains circuitry required to apply varying electrical potentials to the electrophoretic channel of the microdevice. Work is currently being done to design the circuit and PCB for this module in collaboration with our SBIR partners at Los Gatos Research. The optical electronics module contains the spectrometer, laser, and laser power supply. The mounting components for the electronics and housing for the module have been designed, assembled, and tested. The optical module contains optical components to focus the laser to a 20μm spot in the center of the electrophoretic channel.The housing for this module has been designed and assembled with the aligned optical components inside.

Willis, Peter A.↗
NASA NTRS2018

Building Reliable Printed Circuit Boards - the Lessons Learned

"Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. This one day workshop will discuss a variety of failure mechanisms that effect the functionality of PCBs. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. With the help of examples and case studies, a wide range of failure mechanisms will be discussed, case studies are focused on digital circuits, however some failures in analog, double sided boards are also presented. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues."

Sood, Bhanu↗
NASA NTRSDate not supplied

Passive PCB Mounted Thermal Switch

A printed circuit board (PCB) generates heat during operation. In a vacuum this heat can only be rejected by conduction and radiation. In order to reject heat effectively the PCB needs to be thermally conductive to the electronics enclosure. However, when the enclosure temperature gets too low, too much heat is rejected from the PCB and it can fail. This thermal switch has been designed to allow for heat rejection when the PCB is sufficiently warm but then greatly reduce heat rejection when the temperature gets low enough.

Jarret Bone↗
DOE OSTI2024

High-Power Polyphase PCB-Type Inductive Coupler for Wireless Electric Vehicle Charging

The cost and manufacturing difficulty of traditionally wound coils for wireless charging of electric vehicles has led to the exploration of alternative manufacturing for scalable deployment at a range of rated powers. A rotating-field polyphase wireless coupler is developed with balanced fully pitched coils which are not possible with conventional Litz wire. The usage of printed circuit board (PCB) technology is proposed for the innovative construction at large dimensions due to reduced cost, increased ease of manufacturability, and potential geometric customization compared to would coils. Design considerations specific to PCBs are detailed for wireless power transfer coils including advantages such as the potential for many turns and transposition with planar interconnections. A design procedure is developed which may be used to investigate the frequency to power to dimension correlation and limits associated with PCB coils. Designs are simulated in 3D electromagnetic finite element analysis (FEA) for the polyphase coil to evaluate the coupling between coils with varying geometric parameters at 100mm and 500mm outer diameters. A discussion is included on methods to increase PCB power ratings through a mixture of layer stacking, connections, and material selection.

Lewis, Donovin D.↗
DOE OSTI2026

IMPACT 2025-2026 Internship Poster

At Sandia National Laboratories, I developed a C++ program that converts printed circuit boards(PCB) and integrated circuits(IC) design files to be compatible for computed tomography (CT) simulations through Monte Carlo methods.

97 MATHEMATICS AND COMPUTING↗
NASA NTRS2017

24-71 GHz PCB Array for 5G ISM

Millimeter-wave 5G mobile architectures need to consolidate disparate frequency bands into a single, multifunctional array. Existing arrays are either narrow-band, prohibitively expensive or cannot be scaled to these frequencies. In this paper, we present the first ultra-wideband millimeter wave array to operate across six 5G and ISM bands spanning 24-71 GHz. Importantly, the array is realized using low-cost PCB. The paper presents the design and optimized layout, and discusses fabrication and measurements.

5G and ISM↗
DOE OSTI2025

Capacitor Design for Self-Resonant Coils for Long-Distance Wireless Power Transfer System

In this paper, an integrated capacitor design is proposed for higher-order resonant tank topologies for self-resonant coils, such as series, parallel, LCC, LLC, etc. The capacitor is one of the large, lossy, and thermally vulnerable components of a high-frequency resonant tank, and designing a high-voltage, thermally stable resonant capacitor can be highly challenging. Designing the extremely high-voltage capacitor as an integral part of the coil reduces the size and complexity of the coil assembly. This paper proposes a low-loss PCB-based high-voltage capacitor design to achieve that target, which can be implemented as an integral part of the coil. The proposed capacitor designs are simulated using Multiphysics FEA and tested experimentally. A 23 kV, 133 pF capacitor prototype was built and tested as part of a 1 kW long-distance wireless charging system. The test results verify the capacitor’s voltage, current, and thermal resiliency performance.

Mohammad, Mostak [ORNL] (ORCID:0000000256388783)↗
NASA NTRSDate not supplied

Operational Experience with the Electromagnetic Position Sensor (EPS) for the NASA 6-inch MSBS

We rebuilt the wind tunnel model position signal conditioner for the MIT 6-Inch Magnetic Suspension and Balance System (MSBS) Electromagnetic Position Sensor (EPS) that is now in use at the NASA Langley Research Center (LaRC). The effort began at LaRC in ~1990 to replace the original MIT system that was still operating with the low speed wind tunnel until its decommissioning a few years later. The MIT filtering and demodulating scheme mostly remained in the newly designed two-layer printed circuit boards (PCB) with some rearranging of order. The finished product was hampered by noise problems due to problematic grounding design etc. and never successfully operated in the MSBS. After over 20 years, the Langley unit was recovered from Old Dominion University where the MSBS was on loan from NASA but never refurbished. The EPS was brought back to LaRC in 2015 while planning for the return of the MSBS and work began to evaluate its condition and acquire supporting instrumentation. The repair, testing, operational issues, and future improvements are discussed along with an overview of the EPS as a subsystem.

Timothy D Schott↗
NASA NTRS2022

Finite Element Modeling of Rigid-Flex PCB Robotic Structures for Dynamic Environments

Rigid-flex circuit boards are becoming moreprevalent as the limits are pushed on the size, mass, and geometryof electronic systems. A key aspect of designing a rigid-flexprinted circuit boards (PCB) system is an assessment of thedynamic properties of the PCB and predicting system perfor-mance under dynamic loading. Among current modeling method-ologies for rigid-flex PCB, a simplified modeling methodology thatadequately captures the system dynamics does not exist. This arti-cle presents a novel, computationally efficient approach formodeling rigid-flex PCB systems and the calibration of the mate-rial models via modal testing. The resulting simplified model isable to capture system frequencies, mode shapes, and representa-tive force-displacement behavior. The proposed methodology isused to model NASA Jet Propulsion Laboratory’s Pop-Up FlatFolding Explorer Robot (PUFFER) and assess the sensitivity of asystem model to input parameters.

John Bell↗
NASA NTRS1999

Integrated Advanced Microwave Sounding Unit-A (AMSU-A). As-Designed Parts List: Electrical, Electronic and Electromechanical (EEE) As-Designed Parts List

This report comprises the Electrical, Electronic, and Electromechanical (EEE) As Designed Parts List to be used in the Integrated Advanced Microwave Sounding Unit-A (AMSU-A) instrument. The purpose of the EEE As-Designed Parts List is to provide a listing of EEE parts identified for use on the Integrated AMSU-A. All EEE parts used on the AMSU-A must meet the parts control requirements as defined in the Parts Control Plan (POP). All part applications are reviewed by the Parts Control Board (PCB) and granted approval if POP requirements are met. The "As Designed Parts Lists" indicates PCB approval status, and thus also serves as the Program Approved Parts List.

Lorenz, E.↗
NASA NTRS2023

Flex-Capsules for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the gimbal output flange. Such a mechanism had often utilized round wire bundles or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗