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DOE OSTI2025

Operational and Performance Monitoring of East Tennessee Technology Park Ponds—2025 Results

Performance and operational monitoring are regulatory requirements associated with a non–time-critical removal action for three surface water bodies at the East Tennessee Technology Park (ETTP) in Oak Ridge, Tennessee (Figure 1): the K-1007-P1 Pond, the K-901-A Pond, and the K-720 Slough. This progress report summarizes the monitoring activities and results from FY 2025. The goal of ecological enhancement of the K-1007-P1 and K-901-A Ponds is to reduce risk from polychlorinated biphenyl (PCB) contamination in fish to humans and wildlife. Lowering PCB concentrations in the water column and in the food that fish eat is expected to decrease PCB bioaccumulation in fish. Performance monitoring of the K-1007-P1 Pond focuses on annual PCB trends in water, clams, and fish. PCBs in fish also are sampled annually at the K-720 Slough. Operational monitoring ensures that ecological enhancement measures—including water quality, plant community, fish community, and wildlife actions—have been implemented as intended. Monitoring provides the information necessary to determine whether modifications are needed to attain the design end state (i.e., a heavily vegetated, clearwater pond dominated by sunfish with significantly diminished or at least downwardly trending PCB levels in fish). In FY 2025, fish removal efforts and vegetation planting primarily focused on the K-901-A Pond. These actions were implemented to help push the systems toward the desired end state. Descriptions of the various monitoring activities and preliminary 2025 results are provided in the following sections. An update on fish and plant management actions in FY 2025 is also included in this report. A summary of the more detailed information in this report will be presented as required in the upcoming Remediation Effectiveness Report.

54 ENVIRONMENTAL SCIENCES↗

DOE OSTI2025

Production, quality assurance and quality control of the SiPM Tiles for the DarkSide-20k Time Projection Chamber

The DarkSide-20k dark matter direct detection experiment will employ a 21 m 2 silicon photomultiplier (SiPM) array, instrumenting a dual-phase 50 tonnes liquid argon Time Projection Chamber (TPC). SiPMs are arranged into modular photosensors called Tiles, each integrating 24 SiPMs onto a printed circuit board (PCB) that provides signal amplification, power distribution, and a single-ended output for simplified readout. Tiles are further grouped into Photo-Detector Units (PDUs). This paper details the production of the Tiles and the Quality Assurance and Quality Control (QA-QC) protocol established to ensure their performance and uniformity. The production and QA-QC of the Tiles are carried out at Nuova Officina Assergi (NOA), an ISO-6 clean room facility at LNGS. This process includes wafer-level cryogenic characterisation, precision die attaching, wire bonding, and extensive electrical and optical validation of each Tile. The overall production yield exceeds 83.5%, matching the requirements of the DarkSide-20k production plan. These results validate the robustness of the Tile design and its suitability for operation in a cryogenic environment.

Acerbi, F. [Fondazione Bruno Kessler]↗

NASA NTRS2016

Space to Space Advanced EMU Radio

The main task for this project was the development of a prototype for the Space to Space Advanced EMU Radio (SSAER). The SSAER is an updated version of the Space to Space EMU Radio (SSER), which is the current radio used by EMUs (Extravehicular Mobility Unit) for communication between suits and with the ISS. The SSER was developed in 1999, and it was desired to update the design used in the system. Importantly, besides replacing out-of-production parts it was necessary to decrease the size of the radio due to increased volume constraints with the updated Portable Life Support System (PLSS) 2.5, which will be attached on future space suits. In particular, it was desired to fabricate a PCB for the front-end of the prototype SSAER system. Once this board was manufactured and all parts assembled, it could then be tested for quality of operation as well as compliancy with the SSER required specifications. Upon arrival, a small outline of the target system was provided, and it was my responsibility to take that outline to a finished, testable board. This board would include several stages, including frequency mixing, amplification, modulation, demodulation, and handled both the transmit and receive lines of the radio. I developed a new design based on the old SSER system and the outline provided to me, and found parts to fit the tasks in my design. It was also important to consider the specifications of the SSER, which included the system noise figure, gain, and power consumption. Further, all parts needed to be impedance matched, and spurious signals needed to be avoided. In order to fulfill these two requirements, it was necessary to perform some calculations using a Smith Chart and excel analysis. Once all parts were selected, I drew the schematics for the system in Altium Designer. This included developing schematic symbols, as well as layout. Once the schematic was finished, it was then necessary to lay the parts out onto a PCB using Altium. Similar to the schematic design, in order to accomplish this it was necessary to develop component land patterns and add component 3D models. All of this was achieved, and the PCB is currently in review. After it is finished being reviewed, this board will be sent out for manufacture. All electronic components used in the PCB have been acquired, and once the board arrives they will be soldered onto the board using a machine in building 44. Finally, the board will be tested for performance on-site. This will likely be accomplished by the end of the internship.

Maicke, Andrew↗

DOE OSTI2026

Recycling of Printed Circuit Boards to Recover Critical Materials

The printed circuit board (PCB), a central component of most electronic devices, represents a significant fraction of the electronic product waste stream. The complex composition of PCBs, consisting of metals, polymers, and fiberglass, requires specialized recovery steps to reclaim valuable and critical materials and the safe disposal of brominated compounds. In this review paper, we describe the current state of critical material recovery and traditional recycling technologies and identify key obstacles to large-scale implementation. Metals present at high concentrations, such as copper, lead, and iron, are conventionally recovered from PCBs using hydrometallurgical, pyrometallurgical, or electrometallurgical processes. Hydrometallurgical methods achieve high selectivity through chemical leaching but pose significant challenges for effluent and reagent recovery. Pyrometallurgical methods facilitate rapid metal separation through smelting but require substantial energy and may release harmful gases. Electrometallurgical techniques produce high-purity metals but are constrained by pretreatment requirements and the consumption of energy. The non-metallic fraction of PCB waste is recycled using thermochemical conversion, microwave-aided heating, and direct recycling of epoxy–fiberglass composites, enabling material or energy recovery. The recovered polymer from direct recycling may have reduced mechanical strength and poor compatibility with new polymer matrices, and the resulting products from the thermal conversion suffer from incomplete conversion, degradation of quality, and residual contamination, as compared to synthetic polymers. Recent process developments have focused on extracting rare earth and supply-critical materials present at lower concentrations in the waste stream. The literature on existing and emerging approaches for recycling PCB wastes is reviewed to identify sustainable, economically viable, and environmentally responsible strategies for the recovery and reuse of critical materials from waste streams.

36 MATERIALS SCIENCE↗

NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the test was to demonstrate the capability of the harness to survive the number of expected flex cycles during the planned mission with appropriate margin. However, during testing, increased trace resistances and open circuits were observed beginning at approximately 10% of the total number of planned flex cycles. This paper discusses the various proximate causes that contributed to increased and open resistance in the flex cables and the subsequent redesign, manufacturing, reliability, and quality-related changes that were instituted. An analysis process, including failure analysis, non-destructive evaluation, digital imaging correlation, and parametric modeling, will also be discussed. The paper will cover the development of a robust dynamic flex harness design and include recommendations to extend flex harness life; make changes to the flex harness life test; and improve flex cable manufacturing, quality, and reliability.

Flexible PCB↗

NASA NTRSDate not supplied

Analysis of a Dynamic Flexed Flat Cable Harness

Flexible PCB↗

DOE OSTI2023

Production and testing of the powerboard for ATLAS ITk Strip barrel modules

The upgrade of the ATLAS ITk strips detector for HL-LHC will employ a custom PCB (powerboard) for on-module DC-DC conversion, HV switching, and monitoring. Production of about 14100 of such PCBs with high reliability is a big challenge. In this paper we will present the production procedure and quality control (QC) testing system for the powerboards to be installed on ITk Strip barrel modules. During production, about 150 powerboards will be produced every week. Each powerboard will need to pass QC tests before they are assembled to module. The QC tests include thermal cycling between -35 °C and 40 °C, soak test (continuous running of DC-DC converter at high load at 20 °C), and basic functionality and characterization electrical tests of the low voltage (LV), high voltage (HV), and monitoring functions of the powerboard. A custom QC test system is described, which is based on a reusable PCB (active board) with all testing circuits, a one-time powerboard carrier card, and a Z-turn SoC board which hosts and runs the testing program. The production procedure and QC test system has been tested with 400 powerboards during pre-production, and the system has been proven ready for production with the desired testing program, speed, safety, and cost. Performance and typical failures of powerboards observed during the QC test of pre-production powerboards is also presented.

47 OTHER INSTRUMENTATION↗

DOE OSTI2018

X-ray Computed Tomography Imaging of Printed Circuit Boards

Nondestructive inspection of printed circuit boards (PCB) can be efficiently carried out with xray Computed Tomography (XCT). However, image artifacts can obscure some of the PCB details. As a demonstration of LLNL’s XCT capabilities, an internally-funded effort was recently executed that acquired XCT data for a PCB. These data were reconstructed with both traditional and physics-based iterative techniques to illustrate the use of advanced algorithms to reduce artifacts and thus improve image quality.

42 ENGINEERING↗

NASA NTRS2016

Printed Circuit Board Quality: Copper Wrap

Outline: Motivation and introduction, requirements in standards and issues, experimental verification, simulation assisted evaluation, lessons learned.

PLATING↗

DOE OSTI2014

Radiation-Hardened Circuitry Using Mask-Programmable Analog Arrays (September 2014 Milestone Report)

This is a report of the activities involving Task 2 of the NEET 2 project Radiation Hardened Circuitry Using Mask-Programmable Analog Arrays. Using the analog blocks available in our currently pre-configured Via-Configured Array (VCA), we will perform a detailed schematic design of our system to include the signal-processing blocks for temperature, radiation and pressure. Control and data acquisition will be implemented with the Spartan-6 Field-Programmable Gate Array (FPGA) as well as wired serial communications with a remote computer to be used with this project. In addition, batteries and associated voltage regulators will be selected for powering the system. Fabrication may include a polyimide, printed circuit board (PCB) for improved radiation and temperature tolerance. The PCB will go through a layout process by one of the organizations we utilize for this function and be fabricated by another external vendor. Population of the system board will be performed using one of our in-house technicians or an outside vendor we commonly use. Five prototype systems (sensors, electronics board, battery power supply, and personal computer (PC) serial communications port) will be constructed to support the testing objectives of this work. Quality assurance will be performed at each step by both the submitters and the vendors.

36 MATERIALS SCIENCE↗

NASA NTRS2014

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Ghaffaroam. Reza↗

DOE OSTI2020

NDE Technology Engineering Program for Hanford DST Non-Visual Volumetric Inspection Technology: Phase II RAVIS Radiation Tolerance Test Report

This test report provides the results of radiation tolerance robustness testing that was performed on samples of robotic components and an ultrasonic guided wave air-slot sensor that represent components/sub-systems of the Robotic Air-slot Volumetric Inspection System (RAVIS) that has been engineered for volumetric inspection of Hanford tank bottom plates via under-tank refractory pad air-slots. The specific components tested for 1) functionality during active irradiation and 2) tolerance to cumulative radiation dose (until failure or upon reaching a cumulative dose test limit) were: • four samples each of a printed circuit board (PCB) and direct current (DC) motor, which are robotic components, and • 26 ultrasonic piezoelectric elements (samples) inside an air-slot sensor. The robotic components are part of the RAVIS air-slot inspection crawler drive control system that is responsible for remote communication with and actuation of the air-slot inspection crawler. The failure of either of these components during under-tank deployment would require manual retrieval via the crawler’s tether, which risks damage to the robot/refractory/tank. Preemptive replacement of the components at appropriately conservative dose/time intervals informed by failure dose would reduce the likelihood of under-tank failure. The components were included in radiation tolerance testing to quantify their failure doses to inform replacement intervals. The air-slot sensor is responsible for collecting ultrasonic inspection data (scan images) for the tank bottom plates during under-tank deployment. Compromised signal quality due to elevated noise levels caused by gamma radiation would compromise inspection performance. The air-slot sensor was included in radiation tolerance testing to quantify the impact of active irradiation on sensor signal quality. The irradiation and in-situ functional tests of the PCBs, DC motors and air-slot sensor took place in June and July 2020 at the Pacific Northwest National Laboratory. Testing was performed at a gamma dose rate near 300 rad/hr., which, in the absence of under-tank dose rate data, has been conservatively estimated to be the upper-bound dose rate beneath the primary tanks at Hanford. Irradiation took place at elevated temperatures of 150-200°F to determine failure doses that reflect the compounding effects of gamma radiation and heat. The test results revealed: • The DC motors can tolerate being actively irradiated at the high dose rate at 200°F and can tolerate a cumulative dose of 300,000 rad, that which would be incurred after 5 years of service at the 300 rad/hr dose rate. The component therefore meets minimum and preferred radiation tolerance and lifecycle requirements for robotic components. • The air-slot sensor can tolerate being actively irradiated at the high dose rate at 150°F and can tolerate a cumulative dose of 60,000 rad, that which would be incurred after 1 year of service at the 300 rad/hr dose rate. The sensor therefore meets minimum radiation tolerance and lifecycle requirements. • The PCB can tolerate being actively irradiated at the high dose rate, but can only tolerate a cumulative dose of 19,000 rad at 150-200°F. The PCB does not meet minimum radiation tolerance and lifecycle requirements; however, because the component is considered replaceable, it can be replaced before a cumulative dose of 19,000 rad is reached, determined through either monitoring with a dosimeter or scheduled time intervals that are calculated based on conservative estimates of under-tank dose rates.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗

DOE OSTI2013

New characterisation method of electrical and electronic equipment wastes (WEEE)

Highlights: ► A novel method of characterisation of components contained in WEEE has been developed. ► This technique was applied on several samples generated from different recycling plants. ► Handheld NIR and XRF were used to determine types of plastics and flame retardants. ► WEEE processing flow-sheet was suggested. - Abstract: Innovative separation and beneficiation techniques of various materials encountered in electrical and electronic equipment wastes (WEEE) is a major improvement for its recycling. Mechanical separation-oriented characterisation of WEEE was conducted in an attempt to evaluate the amenability of mechanical separation processes. Properties such as liberation degree of fractions (plastics, metals ferrous and non-ferrous), which are essential for mechanical separation, are analysed by means of a grain counting approach. Two different samples from different recycling industries were characterised in this work. The first sample is a heterogeneous material containing different types of plastics, metals (ferrous and non-ferrous), printed circuit board (PCB), rubber and wood. The second sample contains a mixture of mainly plastics. It is found for the first sample that all aluminium particles are free (100%) in all investigated size fractions. Between 92% and 95% of plastics are present as free particles; however, 67% in average of ferromagnetic particles are liberated. It can be observed that only 42% of ferromagnetic particles are free in the size fraction larger than 20 mm. Particle shapes were also quantified manually particle by particle. The results show that the particle shapes as a result of shredding, turn out to be heterogeneous, thereby complicating mechanical separation processes. In addition, the separability of various materials was ascertained by a sink–float analysis and eddy current separation. The second sample was separated by automatic sensor sorting in four different products: ABS, PC–ABS, PS and rest product. The fractions were characterised by using the methodology described in this paper. The results show that the grade and liberation degree of the plastic products ABS, PC–ABS and PS are close to 100%. Sink–float separation and infrared plastic identification equipment confirms the high plastic quality. On the basis of these findings, a global separation flow sheet is proposed to improve the plastic separation of WEEE.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

DOE OSTI2012

Ambient Monitoring for Sinclair and Dyes Inlets, Puget Sound, Washington: Chemical Analyses for 2012 Regional Mussel Watch

Under the Project ENVVEST Final Project Agreement, the Puget Sound Naval Shipyard & Intermediate Maintenance Facility (PSNS&IMF), Environmental Protection Agency (EPA), Washington State Department of Ecology (Ecology), and local stakeholders have worked collaboratively to improve the environmental quality of Sinclair and Dyes Inlets. A regional mussel monitoring program began in 2010 to assess the status and trend of ecological resources, assess the effectiveness of cleanup and pollution control measures, and determine if discharges from all sources are protective of beneficial uses including aquatic life. The program collected indigenous mussels to represent a time-integrated measure of bioavailable metals and organic chemicals present in the water column. This document supplements the 2010 indigenous mussel data with 2012 data to provide two years of data on the chemical residue of mussels present in the inter-tidal regions of Sinclair Inlet, Dyes Inlet, Port Orchard Passage, Rich Passage, Agate Passage, Liberty Bay, and Keyport Lagoon. The 2012 data set added one station at PSNS&IMF and one market samples from Penn Cove. Indigenous mussels were collected from a small boat and/or from along the shoreline, measured, composited, and analyzed for percent lipids, percent moisture, stable isotopes of carbon and nitrogen, and a suite of trace metals and organic contaminants. The trace metals included silver (Ag), arsenic (As), cadmium (Cd), copper (Cu), mercury (Hg), lead (Pb), and zinc (Zn). The organic contaminants included the list of NOAA Status and Trends 20 polychlorinated biphenyls (PCB) congeners and suite of parent and methylated polycyclic aromatic hydrocarbons (PAHs). The average lengths between the 2010 and 2012 data were generally less than 30% relative percent difference (RPD). Generally, the metals concentrations were lower in 2012 than 2010 with some notable exceptions in Sinclair Inlet and Rich Passage where increases in Ag, Hg, Pb, Cu, and Zn exceeded an RPD of 50% between years. However, they did not exceed the bioaccumulation critical values or the critical body residues corresponding to the no observed effect dose (NOED) and the lowest observed effect dose (LOED) with one exception. The Cd concentrations exceeded the NOED and LOED for the Manchester Lab Pier and the Pike Place Market samples. For the PAHs and PCB, the 2012 data were generally lower than 2010 and some cases significantly lower for PAHs and none of the available invertebrate benchmarks were exceeded.

Brandenberger, Jill M.↗