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Results for “POTTING COMPOUND”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1969

Development of improved potting and conformal coating compounds

Improved organic potting and conformal coating materials protect fragile electronic components and circuitry from mechanical shock and vibration, moisture, and corrosion. These materials meet specifications covering resistance to cycling, radiation, flammability, and sterilizing agents for certain space applications.

Webster, J. A.↗
NASA NTRS1968

Thermal resistances of solder-boss/potting compound combinations

Formulas, which can be used as a design tool, are derived to calculate the thermal resistance of solder-boss/potting compound combinations, for different depths of a solder boss, in electronic cordwood modules. Since the solder boss is the heat source, its shape and position will affect the thermal resistance of the surrounding potting compound.

Veilleux, E. D.↗
NASA NTRS2021

Improved Potting of Litz Wires for High Power Density Electric Motor

Specific details including selections of process materials, tooling/fixture setups, and a step-by-step procedure for scaling-up demonstrations of the newly developed potting process, namely vacuum-assisted axial injection potting (VaAIP) have been fully developed for the stator winding of high power density electric motors for the future electrified aircrafts. Various essential pre-trial subtasks identified for the full-scale demonstrations were carried out. To date, optimization of cure condition and thermal stability of the coating epoxy and determination of optimum application conditions and thermal stability of the high temperature encapsulant wax were completed successfully and other subtasks were under way. The efforts to enhance thermal conductivity of the selected potting compound by adding conductive nano fillers such as boron nitride nanosheets (BNNS) have also been advanced. Initially, selection of the best mixing method and procedures was attempted via extensive and systematic experimental design.

Litz wire↗
NASA NTRS1968

Astronaut space suit communication antenna

Astronaut space suit communication antenna consists of a spring steel monopole in a blade-type configuration. This antenna is mounted in a copper cup filled with a potting compound that is recessed in the center to facilitate bending the blade flat for stowing when not in use.

Lindsey, J. F., III↗
NASA NTRS1968

Nonstructural materials for aerospace.

Aerospace applications of nonstructural materials, discussing potting compounds, conformal coatings, wire insulation, electrical contact materials, lubricants, etc

Kingsbury, J. E.↗
NASA NTRS1970

Preparation of highly fluorinated diols containing ether linkages.

Hydroxy-terminated perfluoroethers and polyurethane resins derived from ethers have outstanding chemical resistance and good thermal properties. They can be used as potting compounds, coatings, and seals. The hydroxy-terminated ethers serve as intermediates in the synthesis of highly fluorinated elastomers and adhesives.

Rochow, S. E.↗
NASA NTRS1972

Devolatilization of polymer resins

Commercial silicon resin was devolatilized by vacuum distillation, cured at room temperature and tested favorably for outgassing criteria. Applications of the devolatilized resin are potting compounds and conformal coatings.

Seidenberg, B.↗
NASA NTRS1973

Chemical analysis of outgassing contaminants on spacecraft surfaces

Methods for analyzing and characterizing outgassing contaminants from such materials as RTV 501 potting compound and S 13 G paint are presented. Fractional distillation of a gross distillate from RTV 501 rubber was carried out and the distilled fractions examined as to their ultraviolet and infrared spectra by gas liquid chromatography. A sensitive technique for structural analysis and molecular identification was found to consist of a gas chromatography-mass spectroscopy system, which was determined to be economically unfeasible at present.

Mcnutt, R. C.↗
NASA NTRS1973

Integrated circuit package with lead structure and method of preparing the same

A beam-lead integrated circuit package assembly including a beam-lead integrated circuit chip, a lead frame array bonded to projecting fingers of the chip, a rubber potting compound disposed around the chip, and an encapsulating molded plastic is described. The lead frame array is prepared by photographically printing a lead pattern on a base metal sheet, selectively etching to remove metal between leads, and plating with gold. Joining of the chip to the lead frame array is carried out by thermocompression bonding of mating goldplated surfaces. A small amount of silicone rubber is then applied to cover the chip and bonded joints, and the package is encapsulated with epoxy resin, applied by molding.

Kennedy, B. W.↗