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At least 37 records · Page 2

Printed circuit primary heat exchanger for power conversion in heat pipe microreactor applications

Here, in the present study, a model was developed for a recuperated air Brayton cycle for heat pipe microreactors, and the effect of the primary heat exchanger type assessed. An annular flow heat exchanger and a printed circuit heat exchanger (PCHE) were evaluated. A sub-sized diffusion bonded, PCHE test specimen was manufactured and tested with nitrogen as the working fluid to validate and improve the PCHE model. A comparison of the thermal cycle efficiency for the Brayton cycle coupled to a heat pipe microreactor using each of the two primary heat exchangers showed competitive performance for both options, with achievable cycle efficiencies of 34 % and 35 % for the annular and printed circuit heat exchangers, respectively. The impact of heat pipe length and additional reheating stages on cycle efficiency was studied. Increasing the heat pipe condenser length from 0.8 to 2.0 m resulted in an increase in cycle efficiency of 3.5 % and 3.2 % for the annular and printed circuit heat exchangers, respectively. The use of additional reheating stages showed a reduction in cycle efficiency since the heat pipe surface area limits the primary heat exchanger size and effectiveness. These results highlight the importance of the primary heat exchanger on the performance of a heat pipe microreactor. Overall, the cycle model, testing, and heat exchanger model showed the potential for the PCHE to improve the economics of a heat pipe microreactor relative to the annular flow heat exchanger, which also opens the possibility to use different heat transfer fluids such as supercritical CO 2 .

PCHE

Printed-Circuit Cross-Slot Antenna

Coupling between perpendicular slots suppressed. Balanced feed configuration minimizes coupling between slots of printed-circuit cross-slot antenna unit. Unit and array have conventional cavity-backed-printed-circuit, crossed-slot antenna design. Strip-line feeders behind planar conductive antenna element deliver power to horizontal slot in opposite phase. As result, little or no power propagates into vertical slot. Similar considerations apply to strip lines that feed vertical slot. Units of this type elements of phased-array antennas for radar, mobile/satellite communications, and other applications requiring flush mounting and/or rapid steering of beams with circular polarization.

Foy, Wong

Physically separating printed circuit boards with a resilient, conductive contact

A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Baker, John D.

Probe Array for Testing Printed-Circuit Substrates

Array of tiny probes tests complex printed circuit boards prior to mounting of microcircuit chips and other active and passive components. Insertion and alignment of board, performance of entire computer-controlled test, and printing of results requires about a minute; performed manually same tests require as much as 30 hours.

Roison, A.

Designing High Speed Printed Circuit Boards Using DxDesigner and Expedition

Mentor's DxDesigner and Expedition schematic capture and printed circuit board tools were chosen to implement a custom high speed signal processing board containing many high pin count Field Programmable Gate Arrays and many high speed serial connections with data rates over 2 Gigasamples/sec. The methodology used to place the parts and route the board involved the interaction of both the DxDesigner and Expedition tools. The basic design philosophy was to specify as much as possible through design constraints at the schematic level. This paper will explore implementing that philosophy in both tools to facilitate part placement and trace routing.

printed circuit boards

Economical printed circuit front panel for computer use

Techniques for preparing printed circuit boards are used to provide an alternate method for producing panel symbology for ground computer test trap. After processing, the panel unit is either solder or gold plated.

Newman, J.

Investigation of Solder Cracking Problems on Printed Circuit Boards

A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

CIRCUIT BOARD