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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

PyCCE: A python package for custer correlation expansion simulations of spin qubit dynamics.

PyCCE, an open-source Python library for simulating the dynamics of spin qubits in a spin bath, is presented using the cluster-correlation expansion (CCE) method. PyCCE includes modules to generate realistic spin baths, employing coupling parameters computed from first principles with electronic structure codes, and enables the user to run simulations with either the conventional or generalized CCE method. Three use cases of the Python library are illustrated: the calculation of the Hahn-echo coherence time of the nitrogen-vacancy in diamond; the calculation of the coherence time of the basal divacancy in silicon carbide at avoided crossings; and the calculation for magnetic field orientation-dependent dynamics of a shallow donor in silicon. The complete documentation, downloadable tutorials, and installation instructions are available at https://pycce.readthedocs.io/en/latest/.

coherence↗
DOE OSTI2021

The LISE package: solvers for static and time-dependent superfluid local density approximation equations in three dimensions

Nuclear implementation of the density functional theory (DFT) is at present the only microscopic framework applicable to the whole nuclear landscape. The extension of DFT to superfluid systems in the spirit of the Kohn-Sham approach, the superfluid local density approximation (SLDA) and its extension to time-dependent situations, time-dependent superfluid local density ap- proximation (TDSLDA), have been extensively used to describe various static and dynamical problems in nuclear physics, neutron star crust, and cold atom systems. In this paper, we present the codes that solve the static and time-dependent SLDA equations in three-dimensional coordinate space without any symmetry restriction. These codes are fully parallelized with the message passing interface (MPI) library and take advantage of graphic processing units (GPU) for accelerating execution. The dynamic codes have checkpoint/restart capabilities and for initial conditions one can use any generalized Slater determinant type of wave function. The code can describe a large number of physical problems: nuclear fission, collisions of heavy ions, the interaction of quantized vor- tices with nuclei in the nuclear star crust, excitation of superfluid fermion systems by time dependent external fields, quantum shock waves, domain wall generation and propagation, the dynamics of the Anderson-Bogoliubov-Higgs mode, dynamics of fragmented condensates, vortex rings dynamics, generation and dynamics of quantized vortices, their crossing and recombinations and the incipient phases of quantum turbulence.

Jin, Shi↗
NASA NTRS1991

Analysis of ITT scan bearing package (bearing package S/N 7-1004)

A geostationary operational environments satellite (GOES) East-West scan-bearing assembly was examined after having completed two and one-half years of operation. The following results were found: (1) lubrication breakdown was found in both bearings; (2) patchy wear-bands running only approximately half-way around the races indicated a load distribution in the ball groups consistent with a very low preload; (3) contact angles of 31.2 deg (S/N 1004) and 28.7 deg (S/N 1004A) were found in bearings whose contact angles are supposed to be 20+/-2 deg; and (4) contamination was present in the bearings.

Gelotte, Erik↗
DOE OSTI2023

Packaged Combined Heat and Power Technology Overview and Market Profile

Combined heat and power (CHP), sometimes referred to as cogeneration, is an efficient and clean approach to generating electric power and useful thermal energy onsite from a single fuel source, offering reliable and affordable energy services to businesses and institutions. Furthermore, CHP provides a cost effective opportunity to improve the environmental footprint and resilience of industrial and commercial facilities across the United States. CHP equipment can be custom-engineered or installed as a predesigned and assembled package. A packaged CHP system is a standardized, pre-engineered system that includes all equipment, piping, wiring, and ancillary components to deliver electricity and thermal energy to a host facility with minimal onsite engineering and design time. Packaged CHP systems can be shipped as single or multiple modules with standard interconnections (e.g., fuel; electrical; thermal—hot water, steam, and/or chilled water), which simplifies installation and reduces the costs associated with the project. Most containerized or single packaged CHP system offerings range from 10 kW to 3 MW in capacity. Packaged CHP systems are extending the operating, efficiency, and emissions benefits of CHP to nontraditional markets in commercial, institutional, multifamily, light manufacturing, government, and military applications. These markets tend to be served by smaller systems (less than 5 MW) that are conducive to pre-engineered packaging and/or modularization. Many of these sectors have limited CHP experience and technical resources to adequately evaluate, install, and maintain onsite CHP systems. The introduction of packaged CHP offerings from experienced CHP Packagers and Solution Providers has accelerated CHP adoption, lowered energy costs, reduced emissions, and strengthened energy resilience in these sectors. In 2019, the US Department of Energy (DOE) launched the Packaged CHP eCatalog to promote increased acceptance of efficient, cost-effective CHP in these applications. The Packaged CHP eCatalog is a web-based, searchable platform that hosts DOE-recognized packaged CHP systems with features designed to reduce economic and performance risks for designers, developers, owners, and facility operators interested in installing CHP. DOE established the Packaged CHP Accelerator at the same time to help launch and publicize the eCatalog, and to validate project performance, cost, and installation time of CHP packages across a variety of applications. Accelerator efforts documented installed cost reductions and installation time reductions of more than 20% for packaged CHP systems over 100 kW compared with custom-engineered systems. The Packaged CHP Accelerator and eCatalog established a peer-to-peer network connecting public and private sector partners including utilities, state energy offices, and energy efficiency program administrators interested in promoting cost-effective, efficient CHP systems, Packagers, and Solution Providers. Feedback from these partners, along with input from DOE’s CHP Technical Assistance Partnerships (CHP TAPs), was critical in understanding the current market for packaged CHP technologies, stimulating investment in these technologies, and guiding future directions for packaged CHP systems and their applications. This report provides background on packaged CHP systems, an overview of their benefits, a profile of current packaged CHP installations, and a summary of future market trends; this report is intended for facility owners, project developers, engineers, policymakers, and other stakeholders looking to increase the adoption of efficient, flexible, and resilient packaged CHP systems.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
DOE OSTI2020

Transporting Non-Compliant TRU Wastes in the OPTIMUS{sup TM} Packages - 20493

The OPTIMUS{sup TM} product line of packages was developed with the purpose of providing a versatile and modular packaging option for shipping problematic wastes and fissile material contents. The product line includes a high-activity design in the OPTIMUS-H and a low activity design in the OPTIMUS-L. The two variants utilize a singular containment vessel design, that is enclosed in different protective components that offer different levels of shielding along with thermal and impact protection. The thick shielding provided by the OPTIMUS-H packaging allows for higher activity contents than the OPTIMUS-L to be transported. But the lightweight design of the OPTIMUS-L packaging allows for more packages to be transported in a single shipment. The containment vessel design shared between the two packages provides leak-tight containment of all radioactive contents along with the capabilities to easily leak test and the option to inert and backfill the contents, as necessary, prior to each shipment of the package. Together the OPTIMUS package designs offer significant flexibility and are capable of handling a wide variety of waste materials and other radioactive contents. One of the primary contents covered in the initial design effort for these packages is TRU waste contents beyond the standard waste materials that are compliant with the WIPP Waste Acceptance Criteria. More specifically, the initial content of interest is TRU Waste drums containing sealed containers with potentially flammable gases. While there are multiple other packaging options available for transporting standard WIPP compliant TRU wastes, the goal of the OPTIMUS packages is to offer a superior option for transporting both standard TRU wastes as well as the more problematic non-compliant wastes, among other contents. The non-compliant TRU waste contents explicitly included for the OPTIMUS packages are standard aerosol cans and DOT 3E lecture bottles. However, the methods applied for the package containment can be easily adjusted to cover other sealed container types with potentially flammable gases. The primary challenges with including these items are both the obvious issue of potential for flammable gases (e.g. aerosol propellants) in the package, but also the uncertainty in the exact state of the contents. Because these desired contents are waste materials, the characterization of the materials present in the waste may include some uncertainties. For example, though it may be known that there are one or more aerosol cans in a TRU waste drum, it may not be known if this can is full, spent, or anywhere in between. Also there may be equal uncertainty in the contents of the aerosol can, specifically in the potentially flammable propellant remaining in the can. To include these types of non-compliant items as acceptable contents for the package, the methods utilized in the safety analyses of the OPTIMUS packages must consider all of the uncertainties in the characterization of the waste. The methods utilized cover a range of concerns with transporting contents of this nature including pressure buildup, gas generation, and gaseous combustion for demonstrating the containment of the package. The ability to transport these problematic contents in the OPTIMUS packages gives TRU waste generating sites the option to relocate these drums to an offsite location where the non-compliant items can be properly managed through removal or destruction. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
DOE OSTI2025

3D printing of packaging inserts from biomass-fungi composites: Environmental sustainability analysis

In this study, a comprehensive Life cycle assessment (LCA) is conducted on molded packaging inserts from expanded polystyrene (EPS) foam, molded packaging inserts from biomass-fungi composite, and 3D-printed packaging inserts from biomass-fungi composite under the low mix / high volume (LMHV) scenario and molded and machined packaging inserts from EPS foam, molded and machined packaging inserts from biomass-fungi composite, and 3D-printed packaging inserts from biomass-fungi composite under the high mix / low volume (HMLV) scenario. Six environmental impact categories—climate change, acidification, eutrophication, fossil resource scarcity, land use, and water consumption—are analyzed to evaluate the environmental trade-offs associated with each type of packaging inserts. Under the LMHV scenario, molded packaging inserts from biomass-fungi composite emerge as the best option due to their lower impact on climate change, acidification and water consumption compared to other types of packaging inserts. Conversely, molded packaging inserts from biomass-fungi composite face challenges in land use and eutrophication, primarily due to raw material production. LCA also reveals that 3D-printed packaging inserts from biomass-fungi composite are the most environmentally favorable option under the HMLV scenario, due to significantly lower contributions to climate change, eutrophication, and water consumption compared to other types of packaging inserts. Conversely, 3D-printed packaging inserts from biomass-fungi composite face challenges in acidification and land use, primarily due to raw material production. As part of the LCA, sensitivity analyses show that sourcing energy from 100% renewable sources substantially lowers climate change impacts across all packaging types, while varying transportation distances results in only minor changes, indicating the dominant role of upstream material and manufacturing processes. Additional sensitivity analysis is conducted under the HMLV scenario to assess the impact of material removal during machining on the environment. The amount of material removal is varied from 10 to 70% for the sensitivity analysis and it highlights that the amount of material removed during machining has no significant impact on climate change for packaging inserts from EPS foam. However, molded and machined packaging inserts from biomass-fungi composite show an increasing trend in climate change with higher amount of material removal, while 3D-printed packaging inserts from biomass-fungi composite exhibit a decreasing trend, driven by reduced raw material usage and energy consumption.

09 BIOMASS FUELS↗
DOE OSTI2020

OPTIMUS{sup TM} Packaging for Intermediate Level Wastes and Spent Fuel - 20129

NAC's OPTIMUS{sup TM} packaging is a family of Type B(U)F transportation packages designed for maximum flexibility and cost-efficiency to support shipment of a wide range of challenging wastes and materials. They are small, modular packaging designs meeting DOT weight limits for road transport. OPTIMUS{sup TM} contents include low level waste, mixed low-level waste, irradiated fuel waste and intermediate level waste. Contents can also include aerosol cans with compressed gas and liquefied gas propellants and standard DOT 3E lecture bottles for shipment to treatment facilities. OPTIMUS{sup TM} packaging provides a cost-effective solution for challenging and unique waste contents combined with design simplicity and operational flexibility meeting the requirements of both SSR-6 and 10 CFR 71 for Type B(U)F packaging. The modular design of the packaging components combined with the flexibility to add modified internals for enhanced packaging performance makes OPTIMUS{sup TM} the preferred solution for many radioactive material transportation needs. The OPTIMUS{sup TM} product line currently includes two packaging designs; OPTIMUS{sup TM}-L and OPTIMUS{sup TM}-H. OPTIMUS{sup TM}-L is a lightweight transportation packaging intended for low-activity wastes, whereas OPTIMUS{sup TM}-H is a larger, heavier package intended for high-activities wastes. Due to its small size and weight, six (6) to ten (10) OPTIMUS{sup TM}-L packages can be accommodated on a single legal-weight truck shipment, depending on the weight of the contents. For typical payloads, two (2) OPTIMUS{sup TM}-H packages can be accommodated on a single legal-weight truck shipment. The OPTIMUS{sup TM} packaging share the same cask containment vessel (CCV) in the OPTIMUS{sup TM}-H and OPTIMUS{sup TM}-L. The large cavity size of the CCV, which can accommodate a 416-liter (110-gallon) drum, combined with the small size, low weight and modularity of the OPTIMUS{sup TM} packaging provides unmatched flexibility. In this paper, NAC provides a technical overview of the OPTIMUS{sup TM} packaging and identifies the design features and technology advancements making the OPTIMUS{sup TM} a readily adaptable and flexible solution for packaging processing facilities, reactor and decommissioning wastes. Optimized shielding performance through the addition of internal shielding components and alternative shipping configurations are discussed. In addition, an overview of the first major deployment of the OPTIMUS{sup TM} packaging for the Whiteshell Laboratories Closure Project (WLCP) is discussed. (authors)

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗
NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗