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Additively Printed Flexible Temperature Sensor for Wearable Applications
The flexible sensor has the capability to be mounted on any curved surfaces of applications and be used for portable devices. Additively printed sensors have received attention owing to their compact design and ability of application to non-planar surfaces. Wearable applications require capability of integration into a variety of surfaces with ability to flex, fold, twist and stretch under the stresses of daily motion. There is scarcity of data on the interaction of the process parameters with the realized performance. In addition, there is need for data focused on sensor accuracy, repeatability, and reliability. In this study, experimental analysis on function of the fabricated sensing board is conducted. The temperature sensors are made by direct write printing method with nScrypt printer. A calibration of the sensors has been conducted to confirm that resistance is well related to actual temperature and find TCR (temperature coefficient to resistance). The evolution of resistance has been correlated with the environmental temperature. The sensor hysteresis has been quantified using upswing and downswing of the environmental temperature. In addition, the effect of humidity on the temperature sensor accuracy and performance has been quantified. The effect of a polymide coat on the sensor to prevent humidity effects has also been quantified.
Aerosol jet printed 3 omega sensors for thermal conductivity measurement
The 3 omega (3ω) method is a trusted technique for measuring thermal conductivity—a fundamental material property of critical importance in a broad range of applications. However, traditional 3ω sensor processing requires some form of physical vapor deposition, such as metal evaporation or sputtering. These 3ω sensor deposition techniques limit the materials and sample sizes applicable to the 3ω method. This work demonstrates an aerosol jet printing method to directly print silver 3ω sensors that yield accurate temperature-dependent measurement up to 300 °C on materials with thermal conductivity ranging from 1 to 150 W/m K. The interrelationship between printed sensor geometry, sensor thermal stability, and applicability to the 3ω method is examined. Thermal conductivity measurement with 3ω sensors conventionally sintered at 300 °C agrees to independent laser flash measurement within 4% from room temperature to 150 °C. An unconventional rapid high-temperature sintering method is shown to produce sensors that agree within 3% of the laser flash measurements from room temperature to 300 °C. The rapid sintering profiles also reduced the sensor–substrate thermal boundary resistance of the printed sensors by as much as 88%. The direct printing of 3ω sensors creates opportunities for measurement of thermal transport properties in applications previously inapplicable to the 3ω method.
Performance of Embedded Sensors in 3D Printed SiC
This report summarizes recent advances in embedding sensors in 3D printed silicon carbide (SiC) ceramic components under the Transformational Challenge Reactor (TCR) program. The additive manufacturing technologies developed under this program will enable fabrication of complex structures with embedded fuels and sensors. The sensors will be capable of characterizing fuel performance using spatially distributed measurements at the most strategic locations that would be otherwise inaccessible using conventional manufacturing techniques. While previous programmatic updates describe initial concepts for embedding sensors, materials selection, and initial characterization of the embedded sensors, the technology requires further demonstration, and quality-significant procedures must be established before the embedding technology is ready for adoption by industry. To this end, this report describes the most effective techniques that have been used to embed functional sensors in 3D printed components using a combination of binder-jet additive manufacturing and chemical vapor infiltration (CVI). A detailed procedure describes each step in the process and is available upon request. Molybdenum (Mo)-sheathed thermocouples have been successfully embedded in complex SiC components, and temperatures were monitored in situ during the embedding process. Post-embedding measurements showed no significant hysteresis, and characterization of the interface revealed qualitatively strong bonding around the entire perimeter of the sensor sheath. Distributed fiber-optic temperature sensors were able to briefly measure temperature profiles during CVI, but they ultimately failed prior to completion of the CVI run. The failure appears to be related to the fiber coating at temperatures close to 1,000°C. Future work will focus on irradiation testing of embedded thermocouples and other sheathed electrical sensors, as well as the identification of fiber-optic sensor coatings that can survive CVI.
Printed Potentiometric Nitrate Sensors for Use in Soil
Plant-available nitrogen, often in the form of nitrate, is an essential nutrient for plant growth. However, excessive nitrate in the environment and watershed has harmful impacts on natural ecosystems and consequently human health. A distributed network of nitrate sensors could help to quantify and monitor nitrogen in agriculture and the environment. Here, we have developed fully printed potentiometric nitrate sensors and characterized their sensitivity and selectivity to nitrate. Each sensor comprises an ion-selective electrode and a reference electrode that are functionalized with polymeric membranes. The sensitivity of the printed ion-selective electrodes was characterized by measuring their potential with respect to a commercial silver/silver chloride reference electrode in varying concentrations of nitrate solutions. The sensitivity of the printed reference electrodes to nitrate was minimized with a membrane containing polyvinyl butyral (PVB), sodium chloride, and sodium nitrate. Selectivity studies with sulphate, chloride, phosphate, nitrite, ammonium, calcium, potassium, and magnesium showed that high concentrations of calcium can influence sensor behavior. The printed ion-selective and reference electrodes were combined to form a fully printed sensor with sensitivity of −48.0 ± 3.3 mV/dec between 0.62 and 6200 ppm nitrate in solution and −47 ± 4.1 mV/dec in peat soil.
Surface Acoustic Wave Devices Printed at the Aerosol-Jet Resolution Limit
Not Available
Carbon Fiber and Polymer Composites
Tooling is an integral part of composites manufacturing. Composite tools, also called ‘soft’ tools, are more easily constructed than ‘hard’ metal tools and, because they are made from materials similar to the manufactured composite part, they can be made in-house and have a good co-efficient of thermal expansion match. However, as the ‘soft’ designation suggests, they are more vulnerable to wear and typically find application in relatively low-volume production. Additive manufacturing of thermoplastics has proven to be a lucrative option that can help improve the tooling functionalities, as it offers more design flexibility. Owing to the inherent nature of additive manufacturing, the possibility of printing sensors within the tool material and at proximity to otherwise inaccessible areas of the tool become a reality. Continuous carbon fiber (CCF)-reinforced three-dimensional (3D) printing of engineering thermoplastics has proven to be a viable option to strengthen a part well beyond the ideal moduli of unmodified thermoplastic. Furthermore, adding nanotubes or graphene to the thermoplastic matrix will also improve both the thermal conductivity and interlaminar shear strength within the tool. Carbon nanotubes (CNTs) and carbon fibers (CFs) are microwave susceptors; exploiting the physics of Joule heating to increase the energy efficiency of tool hardening and cure rates is a core goal of this project. Because of the rapid volumetric heating enabled by the absorption of microwave or radio frequency energy and electromagnetic (EM) annealing presents an attractive opportunity to significantly reduce manufacturing cycle times while improving part performance.
Non-visual analysis of miniaturized melt wire arrays for in-pile measurement of peak irradiation temperature
As a part of the in-pile instrumentation program, the Idaho National Laboratory (INL) has established in-house capabilities to fabricate and test new advanced manufactured printed sensors for measurement of peak temperature inside the harsh environment of a nuclear test reactor. Although nuclear test reactors may use standard methods that can provide real-time temperature information, such as thermocouples, the need for feedthroughs for real-time measurements greatly increases the cost of the experiment. Some experiments also present the problem of limited space available for instrumentation. To address this need, INL is working to improve temperature detection options for such applications. The lab is developing advanced manufactured melt wire arrays to determine peak temperatures in experiments with limited space. Furthermore, capabilities to print multiple melt wires with different melting properties on a single miniaturized unit is being established. Recent results and knowledge from this ongoing work have made it possible to develop unique temperature sensors that can accomplish user specific temperature ranges inside the harsh environments experienced during radiation testing.
Printed Potentiometric Ammonium Sensors for Agriculture Applications
Ammonium (NH 4 + ) concentration is critical to both nutrient availability and nitrogen (N) loss in soil ecosystems but can be highly variable across spatial and temporal scales. For this reason, effectively informing agricultural practices such as fertilizer management and understanding of mechanisms of soil N loss require sensor technologies to monitor ammonium concentrations in real time. Our work investigates the performance of fully printed ammonium ion-selective sensors used in diverse soil environments. Ammonium sensors consisting of a printed ammonium ion-selective electrode and a printed Ag/AgCl reference were fabricated and characterized in aqueous solutions and three different soil types (sand, peat, and clay) under the range of ion concentrations likely to be present in soil (0.01–100 mM). The response of ammonium sensors was further evaluated under variable gravimetric moisture content in the soil to reflect their reliability under field conditions. Ammonium sensors demonstrated a sensitivity of 53.6 ± 5.1 mV/decade when tested in aqueous solution, and a sensitivity of 55.7 ± 11 mV/dec, 57.5 ± 4.1 mV/dec, and 43.7 ± 4 mV/dec was measured in sand, clay, and peat soils, respectively.
On-Demand Manufacturing of Electronics
The On-Demand Manufacturing of Electronics (ODME) project develops materials, processes, and device designs to enable electronics, sensors, and semiconductors to be produced in microgravity environments. The demonstration of these technologies provides a pathway for space-based manufacturing of circuits, wearables, energy storage devices, and other electronics. This has facilitated the terrestrial production of devices including a wide range of sensors, printed batteries, and circuits that are additively manufactured using techniques available on the Advanced Toolplate System (ATS). Recent parabolic flight campaigns conducted with the ATS suggest that direct ink write (DIW) technology is suitable for depositing functional material inks in reduced gravity environments. The development of the Advanced Toolplate system also includes several other new tools, including miniaturized versions of the direct write head, fused filament fabrication head, micro-mill, component pick & place head, and two newly developed deposition technologies, the Electrohydrodynamic (EHD) inkjet head (for semiconductors), and the Electrodeposition head (for high performance circuits). These experiments are designed to compare processing and material behavior in zero gravity versus ground-based data for validation of microgravity advantages and de-risking of future orbital demonstrations of these technologies. The ability to conduct experiments in microgravity is a pivotal step in enabling electronic manufacturing technology in space for both terrestrial and deep space applications.
Embedding Sensors in 3D Printed Metal Structures
The Transformational Challenge Reactor (TCR) program is leveraging recent advances in modeling and simulation, materials, and additive manufacturing (AM) technologies to design a modern nuclear reactor. Some of the main TCR technologies include in situ monitoring and the integration of sensors during the manufacturing of quality-significant nuclear reactor components. This report describes the general procedure and process optimization for embedding sensors within generic stainless steel 316 (SS316) components using laser powder bed fusion (LPBF). A more detailed, quality-significant test plan and supporting procedures are available upon request (ORNL/TM-2021/2127). LPBF involves the use of a scanning laser to selectively melt regions of a powder bed, additively building a part layer by layer. This report describes the LPBF processing technique and discusses the effects of LPBF processing parameters on the success of the sensor embedding process. Experiments used machined cavities in the form of channels in an SS316 base for the sensors to lay in while material is additively built over the top, thereby embedding them in an SS316 matrix. A preliminary investigation involved using empty SS316 sheaths as surrogates to explore the effects of various LPBF processing parameters and the dimensional requirements of the machined channels. Microstructural investigations showed that a smaller channel width/depth combination closer to the sensor’s diameter was best for the embedding process. After the desired parameters were selected, Type-K thermocouples were embedded and evaluated post-embedding using nondestructive thermal testing, as well as destructive sectioning and microscopy. Post-build characterization showed that the thermocouples were well-bonded to the SS316 matrix and were fully functional after embedding. During thermal testing to temperatures up to 500 °C, the embedded thermocouples read consistently with one another and deviated only slightly from the readings of a nonembedded thermocouple located within the furnace. This slight discrepancy was most likely due to differences in the thermal time constants for a nonembedded thermocouple vs. a thermocouple embedded in a solid SS316 block. The results presented in this report will serve as the foundation for future work that will focus on embedding sensors in relevant TCR reactor components and eventually testing those components under neutron irradiation.
Embedding sensors in 3D-printed silicon carbide
An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000° C.
Development of low cost screen-printed piezoresistive strain sensor for facial expressions recognition systems
Not Available
Development and evaluation of a fast fabrication process-based 3D printed strain gauge sensors
Not provided.
Effect of printing parameters on the sensing performance of a 3D printed elastomeric pressure sensor
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Design and implementation of a multi-sensor robot system for printed circuit board insertion
The design and implementation of a robot system equipped with multiple sensors are described. The robotic assembly system couples the task sequence of the robot with information from different sensors, enabling the system to handle uncertainties encountered during task execution. The target task involves the insertion of a printed circuit board into a card cage. The sensors used are an overhead three-dimensional vision system, a fingertip cross-fire sensor, and a 6-DOF force/torque sensor. The vision system is used to locate the printed circuit boards and the insertion slots. Information provided by the cross-fire sensor is used to complement the information from the vision system in order to obtain a proper grasping location on the printed circuit board. A fuzzy-logic-based system is used to interpret the forces and torques generated by the force/torque sensor during the insertion process. The repeated success of this assembly task over many experimental trials verifies the modeling and controller assumptions.
Glass 3D Printing of Microfluidic Pressure Sensor Interrogated by Fiber-Optic Refractometry
This letter reports a novel fused silica microfluidic device with pressure sensing capability that is fabricated by integrated additive and subtractive manufacturing (IASM) method. The sensor consists of a capillary and a 3D printed glass reservoir, where the reservoir volume change under pressure manifests liquid level deviation inside the capillary, thus realizing the conversion between small pressure change into large liquid level variation. Thanks to the design flexibility of this unique IASM method, the proposed microfluidic device is fabricated with liquid-in-glass thermometer configuration, where the reservoir is sealed following a novel 3D printing assisted glass bonding process. And liquid level is interrogated by a fiber-optic sensor based on multimode interference (MMI) effect. This proposed microfluidic device is attractive for chemical and biomedical sensing because it is flexible in design, and maintains good chemical and mechanical stability, and adjustable sensitivity and range.
Ultra-Low SWaP CO 2 Sensing for Demand Control Ventilation (Final Report)
In this project PARC and Energy ETC aimed to develop an ultra-low cost, size, weight, and power (SWaP) printed CO 2 sensor system for occupancy detection to enable Demand Control Ventilation (DCV) on a per-room basis. The CO 2 sensor technology is based on the temperature variation when CO 2 reversibly physisorbs to a highly conductive and high surface area sorbent surface, and is compatible with integration with PARC innovations in printed sensors and flexible electronics, for which PARC is a globally leading research center. The printed CO 2 sensor itself is designed to be compatible with PARC’s “peel-and-stick” platform of ultra-low power, low-cost, distributed sensors, and to facilitate real-time DCV based on overall indoor air quality (IAQ). Previously, PARC has developed flexible hybrid electronics (FHE) compatible materials to measure humidity, temperature, light, strain, and gases such as carbon monoxide, methane, ammonia, and hydrogen sulfide. Through this project, PARC developed FHE-compatible materials to measure CO 2 . Thus, with one <$15 FHE “peel-and-stick” based sensor node, a building management system (BMS) will be able to capture a complete picture of the indoor environment. This includes IAQ, light, temperature, and other comfort factors that impact building operations. Combined with optimized DCV, this low-cost sensor capability can be a key enabler of annual primary energy savings of ~ 0.3-0.4 Quad in commercial buildings while ensuring healthy IAQ. Energy ETC is a leader in supplier-agnostic BMS deployments and will design the commissioning and deployment procedures to maximize system interoperability.