Striped tape arrays
The topics are presented in viewgraph form and include the following: introduction to striping; applications; tape technologies; robots; access times; striping options and issues; and reliability issues.
Drapeau, Ann L.↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Assessing risk from a stakeholder perspective
Planetary exploration missions are subject to a vast array of interpretations of 'success' based on the concerns of multiple stakeholder groups. While project risk management generally focuses on issues of cost/schedule constraints or reliability issues, a broader interpretation of 'risk' as it applies to stakeholders such as sponsors (e.g., NASA), the public at large, the scientific community, the home organization, and the project team itself can provide important insights into the full spectrum of risk that needs to be managed. This paper presents a stakeholder view of risk which is divided into failure, not-a-failure, success, and stunning-success zones. Using the Mars Pathfinder mission as an example, an alternative interpretation of the risks to that mission is presented from the view of key stakeholders. The implications of the stakeholder perspective to project risk management are addressed.
risk management success/failure graph↗
Evaluation of CS-type Metallized Polymer Film Capacitors
In 2023 Quantic Paktron announced production of Capstick high reliability multilayer metallized polymer film capacitors based on a new type of dielectric films and proprietary technology of manufacturing. These parts might be used in power conversion systems, snubbing, and high-frequency applications effectively replacing currently used hermetic polymer capacitors manufactured per MIL-PRF-83421. The purpose of this work is to evaluate design and performance of the parts, address potential reliability issues and get preliminary assessments of reliability and the possibility of use in space projects.
Alexander Teverovsky↗
System reliability and risk assessment task goals and status
The major focus for continued development of the Numerical Evaluation of Stochastic Structures Under Stress (NESSUS) codes is in support of system testing and certification of advanced propulsion systems. Propulsion system testing has evolved over the years from tests designed to show success, to tests designed to reveal reliability issues before service use. Such test conditions as performance envelope corners, high rotor imbalance, power dwells, and overspeed tests are designed to shake out problems that can be associated with low and high cycle fatigue, creep, and stress rupture, bearing durability, and the like. Subsystem testing supports system certification by standing as an early evaluation of the same durability and reliability concerns as for the entire system. The NESSUS software system is being further developed to support the definition of rigorous subsystem and system test definition and reliability certification. The principal technical issues are outlined which are related to system reliability, including key technology issues such as failure mode synergism, sequential failure mechanisms, and fault tree definition.
Cruse, T. A.↗
Issues in providing a reliable multicast facility
Issues involved in point-to-multipoint communication are presented and the literature for proposed solutions and approaches surveyed. Particular attention is focused on the ideas and implementations that align with the requirements of the environment of interest. The attributes of multicast receiver groups that might lead to useful classifications, what the functionality of a management scheme should be, and how the group management module can be implemented are examined. The services that multicasting facilities can offer are presented, followed by mechanisms within the communications protocol that implements these services. The metrics of interest when evaluating a reliable multicast facility are identified and applied to four transport layer protocols that incorporate reliable multicast.
Dempsey, Bert J.↗
Qualification of emerging point-of-load regulators for next generation power systems
As demand for high-speed, on-board, digital-processing integrated circuits (ICs) on spacecraft increases (FPGAs and DSPs in particular), the need for the next generation point-of-load (POL) regulator becomes a prominent design issue. Shrinking process nodes have resulted in core rails dropping to values close to 1.0 V, drastically reducing margin to standard switching converters or regulators that power digital ICs. The objectives of this study are to first identify reliability issues or additional space reliability requirements that might not be addressed for commercial application of POL converters; second, to study the performances of existing or emerging POL converters (including linear regulators) within a practical two-stage power distribution architecture; and, finally, to identify points of failure at extreme temperatures (low and high) beyond specifications.
Leon, Rosa↗
Scaled CMOS Reliability and Considerations for Spacecraft Systems: Bottom-Up and Top-Down Perspective
New space missions will increasingly rely on more advanced technologies because of system requirements for higher performance, particularly in instruments and high-speed processing. Component-level reliability challenges with scaled CMOS in spacecraft systems from a bottom-up perspective have been presented. Fundamental Front-end and Back-end processing reliability issues with more aggressively scaled parts have been discussed. Effective thermal management from system-level to the componentlevel (top-down) is a key element in overall design of reliable systems. Thermal management in space systems must consider a wide range of issues, including thermal loading of many different components, and frequent temperature cycling of some systems. Both perspectives (top-down and bottom-up) play a large role in robust, reliable spacecraft system design.
Scaled CMOS↗
Radiation Challenges for Electronics in the Vision for Space Exploration
The slides present a brief snapshot discussing electronics and exploration-related challenges. Radiation effects have been the prime target, however, electronic parts reliability issues must also be considered. Modern electronics are designed with a 3-5 year lifetime. Upscreening does not improve reliability, merely determines inherent levels. Testing costs are driven by device complexity; they increase tester complexity, beam requirements, and facility choices. Commercial devices may improve performance, but are not cost panaceas. There is need for a more cost-effective access to high energy heavy ion facilities such as NSCL and NSRL. Costs for capable test equipment can run more than $1M for full testing.
LaBel, Kenneth A.↗
Aeroflex Technology as Class-Y Demonstrator
Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.
Suh, Jong-ook↗
Probabilistic Assessment of National Wind Tunnel
A preliminary probabilistic structural assessment of the critical section of National Wind Tunnel (NWT) is performed using NESSUS (Numerical Evaluation of Stochastic Structures Under Stress) computer code. Thereby, the capabilities of NESSUS code have been demonstrated to address reliability issues of the NWT. Uncertainties in the geometry, material properties, loads and stiffener location on the NWT are considered to perform the reliability assessment. Probabilistic stress, frequency, buckling, fatigue and proof load analyses are performed. These analyses cover the major global and some local design requirements. Based on the assumed uncertainties, the results reveal the assurance of minimum 0.999 reliability for the NWT. Preliminary life prediction analysis results show that the life of the NWT is governed by the fatigue of welds. Also, reliability based proof test assessment is performed.
Shah, A. R.↗
Advanced Engine Cycles Analyzed for Turbofans With Variable-Area Fan Nozzles Actuated by a Shape Memory Alloy
Advanced, large commercial turbofan engines using low-fan-pressure-ratio, very high bypass ratio thermodynamic cycles can offer significant fuel savings over engines currently in operation. Several technological challenges must be addressed, however, before these engines can be designed. To name a few, the high-diameter fans associated with these engines pose a significant packaging and aircraft installation challenge, and a large, heavy gearbox is often necessary to address the differences in ideal operating speeds between the fan and the low-pressure turbine. Also, the large nacelles contribute aerodynamic drag penalties and require long, heavy landing gear when mounted on conventional, low wing aircraft. Nevertheless, the reduced fuel consumption rates of these engines are a compelling economic incentive, and fans designed with low pressure ratios and low tip speeds offer attractive noise-reduction benefits. Another complication associated with low-pressure-ratio fans is their need for variable flow-path geometry. As the design fan pressure ratio is reduced below about 1.4, an operational disparity is set up in the fan between high and low flight speeds. In other words, between takeoff and cruise there is too large a swing in several key fan parameters-- such as speed, flow, and pressure--for a fan to accommodate. One solution to this problem is to make use of a variable-area fan nozzle (VAFN). However, conventional, hydraulically actuated variable nozzles have weight, cost, maintenance, and reliability issues that discourage their use with low-fan-pressure-ratio engine cycles. United Technologies Research, in cooperation with NASA, is developing a revolutionary, lightweight, and reliable shape memory alloy actuator system that can change the on-demand nozzle exit area by up to 20 percent. This "smart material" actuation technology, being studied under NASA's Ultra-Efficient Engine Technology (UEET) Program and Revolutionary Concepts in Aeronautics (RevCon) Program, has the potential to enable the next generation of efficient, quiet, very high bypass ratio turbofans. NASA Glenn Research Center's Propulsion Systems Analysis Office, along with NASA Langley Research Center's Systems Analysis Branch, conducted an independent analytical assessment of this new technology to provide strategic guidance to UEET and RevCon. A 2010-technology-level high-spool engine core was designed for this evaluation. Two families of low-spool components, one with and one without VAFN's, were designed to operate with the core. This "constant core" approach was used to hold most design parameters constant so that any performance differences between the VAFN and fixed nozzle cycles could be attributed to the VAFN technology alone. In this manner, the cycle design regimes that offer a performance payoff when VAFN's are used could be identified. The NASA analytical model of a performance-optimized VAFN turbofan with a fan pressure ratio of 1.28 is shown. Mission analyses of the engines were conducted using the notional, long-haul, advanced commercial twinjet shown. A high wing design was used to accommodate the large high-bypassratio engines. The mission fuel reduction benefit of very high bypass shape-memory-alloy VAFN aircraft was calculated to be 8.3 percent lower than a moderate bypass cycle using a conventional fixed nozzle. Shape-memory-alloy VAFN technology is currently under development in NASA's UEET and RevCon Programs.
Berton, Jeffrey J.↗
PRTs and Their Bonding for Long-Duration, Extreme-Temperature Environments
Research was conducted on the qualification of Honeywell platinum resistance thermometer (PRT) bonding for use in the Mars Science Laboratory (MSL). This is the first time these sensors will be used for Mars-related projects. Different types of PRTs were employed for the Mars Exploration Rover (MER) project, and several reliability issues were experienced, even for a shortduration mission like MER compared to MSL. Therefore, the development of a qualification process for the Honeywell PRT bonding was needed for the MSL project. Reliability of the PRT sensors, and their bonding processes, is a key element to understand the health of the hardware during all stages of the project, and particularly during surface operations on Mars. Three extreme temperature summer season cycles and three winter season cycles (total: 1983 thermal cycles) were completed, and no Honeywell PRT failures associated with the bonding process were found. Seventy-eight PRTs were bonded onto six different substrate materials using four different adhesives during the thermal cycling, which included a planetary protection cycle to +125 C for two hours, three protoflight/qualification cycles (-135 to 70 C), 1,384 summer cycles (-105 to 40 C), and 599 winter cycles (-130 to 15 C). There were no observed changes in PRT resistances, bonding characteristics, or damage identified from the package evaluation as a result of the qualification tests.
Ramesham, Rajeshuni↗
Die Attachment for -120 C to +20 C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview
Active thermal control for electronics on Mars Rovers imposes a serious penalty in weight, volume, power consumption, and reliability. Thus, we propose that thermal control be eliminated for future Rovers. From a functional standpoint there is no reason that the electronics could not operate over the entire temperature range of the Martian environment, which can vary from a low of approximately equal -90 C to a high of approximately equal +20 C during the Martian night and day. The upper end of this range is well within that for conventional electronics. Although the lower end is considerably below that for which conventional--even high-reliability electronics is designed or tested, it is well established that electronic devices can operate to such low temperatures. The primary concern is reliability of the overall electronic system, especially in regard to the numerous daily temperature cycles that it would experience over the duration of a mission on Mars. Accordingly, key reliability issues have been identified for elimination of thermal control on future Mars Rovers. One of these is attachment of semiconductor die onto substrates and into packages. Die attachment is critical since it forms a mechanical, thermal and electrical interface between the electronic device and the substrate or package. This paper summarizes our initial investigation of existing information related to this issue, in order to form an opinion whether die attachment techniques exist, or could be developed with reasonable effort, to withstand the Mars thermal environment for a mission duration of approximately I year. Our conclusion, from a review of literature and personal contacts. is that die attachment can be made sufficiently reliable to satisfy the requirements of future Mars Rovers. Moreover, it appears that there are several possible techniques from which to choose and that the requirements could be met by judicious selection from existing methods using hard solders, soft solders, or organic adhesives. Thus from the standpoint of die attachment. it appears feasible to eliminate thermal control for Rover electronics. We recommend that this be further investigated and verified for the specific hardware and thermal conditions appropriate to Mars Rovers.
Kirschman, Randall K.↗
Mars Rover
The system integration issues associated with the design of Rovers for Mars ground surface operations are addressed in this paper. Requirements are established for both long distance traverse between geology sites and for geologic survey operations. To satisfy these mission requirements, a semi-autonomous vehicle design has been proposed and its performance capabilities are assessed. Furthermore, the mobility, power consumption, coordination and control (maneuverability), and reliability issues associated with the design of mobility systems to permit vehicle traverse over rugged terrain are examined and the direction of future work required to address these issues is outlined.
Klein, G.↗
Current status of mission/system design for a Mars rover
The system integration issues associated with the design of Rovers for Mars ground surface operations are addressed in this article. Requirements are established for both long distance traverse between geology sites and for geologic survey operations. To satisfy these mission requirements, a semi-autonomous vehicle design has been proposed and its performance capabilities are assessed. Furthermore, the mobility, power consumption, coordination and control (maneuverability), and reliability issues associated with the design of mobility systems to permit vehicle traverse over rugged terrain are examined and the direction of future work required to address these issues is outlined.
Klein, Gail↗
Evaluation of Thermo-Mechanical Stability of COTS Dual-Axis MEMS Accelerometers for Space Applications
Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.
Sharma, Ashok K.↗
Lessons Learned from OSIRIS-Rex Autonomous Navigation Using Natural Feature Tracking
The Origins, Spectral Interpretation, Resource Identification, Security-Regolith Explorer (Osiris-REx) spacecraft is scheduled to launch in September, 2016 to embark on an asteroid sample return mission. It is expected to rendezvous with the asteroid, Bennu, navigate to the surface, collect a sample (July 20), and return the sample to Earth (September 23). The original mission design called for using one of two Flash Lidar units to provide autonomous navigation to the surface. Following Preliminary design and initial development of the Lidars, reliability issues with the hardware and test program prompted the project to begin development of an alternative navigation technique to be used as a backup to the Lidar. At the critical design review, Natural Feature Tracking (NFT) was added to the mission. NFT is an onboard optical navigation system that compares observed images to a set of asteroid terrain models which are rendered in real-time from a catalog stored in memory on the flight computer. Onboard knowledge of the spacecraft state is then updated by a Kalman filter using the measured residuals between the rendered reference images and the actual observed images. The asteroid terrain models used by NFT are built from a shape model generated from observations collected during earlier phases of the mission and include both terrain shape and albedo information about the asteroid surface. As a result, the success of NFT is highly dependent on selecting a set of topographic features that can be both identified during descent as well as reliably rendered using the shape model data available. During development, the OSIRIS-REx team faced significant challenges in developing a process conducive to robust operation. This was especially true for terrain models to be used as the spacecraft gets close to the asteroid and higher fidelity models are required for reliable image correlation. This paper will present some of the challenges and lessons learned from the development of the NFT system which includes not just the flight hardware and software but the development of the terrain models used to generate the onboard rendered images.
Navigation↗
Environmental Effects on Data Retention in Flash Cells
Flash technology is being utilized in fuzed munition applications and, based on the development of digital logic devices in the commercial world, usage of flash technology will increase. Antifuse technology, prevalent in non-volatile field programmable gate arrays (FPGAs), will eventually be phased out as new devices have not been developed for approximately a decade. The reliance on flash technology presents a long-term reliability issue for both DoD and NASA safety- and mission-critical applications. A thorough understanding of the data retention failure modes and statistics associated with Flash data retention is of vital concern to the fuze safety community. A key retention parameter for a flash cell is the threshold voltage (VTH), which is an indirect indicator of the amount of charge stored on the cells floating gate. This paper will present the results of our on-going tests: long-term storage at 150 C for a small population of devices, neutron radiation exposure, electrostatic discharge (ESD) testing, and the trends of large populations (over 300 devices for each condition) exposed to three difference temperatures: 25 C, 125 C, and 150 C.
Flash↗