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Results for “Superconducting interconnects”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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23 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

Flux compression measurements in sintered bulk Ba2YCu3O7

Trapping of magnetic fields and subsequent flux compression have been realized in sintered bulk Ba2YCu3O7 superconductors at 77 K. The field is trapped in two interconnected holes of 0.95-cm and 0.52-cm diameter, respectively. By inserting a superconducting plunger with a diameter of 0.93 cm into the larger hole, the trapped flux is compressed into the smaller hole, where the flux density is measured with a Hall probe. The ratio of the areas available for the magnetic flux before and after compression is 3.7. Deviations from this compression ratio are observed to increase as the trapped field is increased, demonstrating penetration of magnetic flux into the interior of the superconductor. Using a simple extension of the critical state model, the authors demonstrate how the flux compression technique can be used to test the validity of the model and also to calculate the critical current density of the superconductor directly from the measurements.

Israelsson, U. E.↗
NASA NTRS1995

Semiconductor/High-Tc-Superconductor Hybrid ICs

Hybrid integrated circuits (ICs) containing both Si-based semiconducting and YBa(2)Cu(3)O(7-x) superconducting circuit elements on sapphire substrates developed. Help to prevent diffusion of Cu from superconductors into semiconductors. These hybrid ICs combine superconducting and semiconducting features unavailable in superconducting or semiconducting circuitry alone. For example, complementary metal oxide/semiconductor (CMOS) readout and memory devices integrated with fast-switching Josephson-junction super-conducting logic devices and zero-resistance interconnections.

Burns, Michael J.↗
NASA NTRS1989

Conference on Real-Time Computer Applications in Nuclear, Particle and Plasma Physics, 6th, Williamsburg, VA, May 15-19, 1989, Proceedings

Papers on real-time computer applications in nuclear, particle, and plasma physics are presented, covering topics such as expert systems tactics in testing FASTBUS segment interconnect modules, trigger control in a high energy physcis experiment, the FASTBUS read-out system for the Aleph time projection chamber, a multiprocessor data acquisition systems, DAQ software architecture for Aleph, a VME multiprocessor system for plasma control at the JT-60 upgrade, and a multiasking, multisinked, multiprocessor data acquisition front end. Other topics include real-time data reduction using a microVAX processor, a transputer based coprocessor for VEDAS, simulation of a macropipelined multi-CPU event processor for use in FASTBUS, a distributed VME control system for the LISA superconducting Linac, a distributed system for laboratory process automation, and a distributed system for laboratory process automation. Additional topics include a structure macro assembler for the event handler, a data acquisition and control system for Thomson scattering on ATF, remote procedure execution software for distributed systems, and a PC-based graphic display real-time particle beam uniformity.

Pordes, Ruth↗
NASA NTRS2007

Materials Development for Auxiliary Components for Large Compact Mo/Au TES Arrays

We describe our current fabrication process for arrays of superconducting transition edge sensor microcalorimeters, which incorporates superconducting Mo/Au bilayers and micromachined silicon structures. We focus on materials and integration methods for array heatsinking with our bilayer and micromachining processes. The thin superconducting molybdenum bottom layer strongly influences the superconducting behavior and overall film characteristics of our molybdenum/gold transition-edge sensors (TES). Concurrent with our successful TES microcalorimeter array development, we have started to investigate the thin film properties of molybdenum monolayers within a given phase space of several important process parameters. The monolayers are sputtered or electron-beam deposited exclusively on LPCVD silicon nitride coated silicon wafers. In our current bilayer process, molybdenum is electron-beam deposited at high wafer temperatures in excess of 500 degrees C. Identifying process parameters that yield high quality bilayers at a significantly lower temperature will increase options for incorporating process-sensitive auxiliary array components (AAC) such as array heat sinking and electrical interconnects into our overall device process. We are currently developing two competing technical approaches for heat sinking large compact TES microcalorimeter arrays. Our efforts to improve array heat sinking and mitigate thermal cross-talk between pixels include copper backside deposition on completed device chips and copper-filled micro-trenches surface-machined into wafers. In addition, we fabricated prototypes of copper through-wafer microvias as a potential way to read out the arrays. We present an overview on the results of our molybdenum monolayer study and its implications concerning our device fabrication. We discuss the design, fabrication process, and recent test results of our AAC development.

Finkbeiner, F. m.↗
NASA NTRS1992

Superconductivity devices: Commercial use of space

High T sub C superconducting thick film were prepared by a screen printing process. Y-based (YBa2Cu3O(7-x) superconducting thick film were printed on 211/Al2O3, SNT/Al2O3, and YSZ substrates. Because of poor adhesion of the superconductor thick films to 211/Al2O3 and SNT/Al2O3 substrates, relatively low T sub C and J sub C values were obtained from the films printed on these substrates. Critical temperatures (T sub C) of YBa2Cu3O(7-x) thick films deposited on 211/Al2O3 and SNT/Al2O3 substrates were about 80 K. The critical current densities (J sub C) of these films were less than 2 A/sq cm. Higher T sub C and J sub C YBa2Cu3O(7-x) thick films were printed on YSZ substrates. A YBa2Cu3O(7-x) thick film with T sub C=86.4 and J sub C= 50.4 A/sq cm was prepared by printing the film on YSZ substrate and firing at 990 C for 10 minutes. Multiple-lead samples were also prepared on the YSZ substrates. The multiple-lead samples showed lower T sub C and/or J sub C values than those of the plain samples. The electrical properties of YBa2Cu3O(7-x) thick films were determined by the microstructures of the films. The YBa2Cu3O(7-x) thick films printed on the YSZ substrates, which had the best properties among the films printed on the three different kinds of substrates, had the highest density and the best particle interconnection. The YBa2Cu3O(7-x) thick films with preferred orientation in (001) direction were obtained on the YSZ substrates. Cracks, which retard the properties of the films, were found from the films deposited on the YSZ substrates. Currently, a MSZ (Magnesium Stabilized Zirconia) substrate, which had higher thermal expansion coefficient than the YSZ substrate, is used as substrate for the YBa2Cu3O(7-x) thick film in order to eliminate the cracks on the film. Bi-based superconductor thick films were printed on polycrystalline MgO and YSZ substrates. Interactions between BSCCO thick films and the YSZ substrates were observed. Various buffer layer materials were applied onto the substrates in order to avoid the interactions between the BSCCO thick films and the ZrO2-based substrates. So far, a BSCCO printed on MgO substrate with T Sub C=89K was obtained. The J sub C of the film was lower than 0.1 A/sq cm by reason of poor interconnectivity of the BSCCO particles.

Haertling, Gene↗