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27 records · Page 2

High Performance Space Computing with System-on-Chip Instrument Avionics for Space-based Next Generation Imaging Spectrometers (NGIS).

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Dolinar, Sam↗

High performance space computing with system-on-chip instrument avionics for space-based Next Generation Imaging Spectrometers (NGIS)

The emergent technology of system-on-chip (SoC) devices promises lighter, smaller, cheaper, and more capable and reliable space electronic systems that could help to unveil some of the most treasured secrets in our universe. This technology is an improvement over the technology that is currently used in space applications, which lags behind state-of-the-art commercial-off-the-shelf (COTS) equipment by several generations. SoC technology integrates all computational power required by next-generation space exploration science instruments onto a single chip. This presentation will describe a Xilinx Zynq-based data acquisition, cloud-screening and compression computing system that has been developed at the Jet Propulsion Laboratory (JPL) for JPL’s Next Generation Imaging Spectrometers (NGIS). The Xilinx Zynq-based Alpha Data hardware assembly fits into a 120mm by 190m by 40mm assembly and uses 9 watts at peak performance. The computing element is a Xilinx Zynq Z7045Q which includes a Kintex-7 FPGA (equivalent to 3 RAD Virtex5 FPGAs in terms of logic cell resources) and dual-core ARM Cortex-A9 Processors (equivalent to 10 RAD750 Power PCs in term of processing capability).

Dolinar, Sam↗

Benchmarking and Testing of Qualcomm Snapdragon System-on-Chip for JPL Space Applications and Missions

As some space missions become more challenging due to new environments, greater distances, or more limited size, weight, and power (SWaP) constraints, spacecraft avionics must adapt to allow the spacecraft to be more autonomous and agile---eliminating the Spacecraft-Earth-Spacecraft feedback loop whenever possible. Prime examples of such missions include Aerobots (such as Ingenuity with extremely low SWaP constraints and demanding signal/image processing during flight) and landers in possibly hostile environments (such as a Europa lander mission, with limited communication capacity, high latency, and constrained power budget). To address these challenges, JPL worked with Qualcomm to demonstrate the use of their Snapdragon 801 system-on-chip (SoC) onboard the Ingenuity Helicopter on Mars. The Qualcomm Snapdragon SoC contains various subsystems, including an ARM cluster, a Graphics processing unit, a Digital Signal Processing subsystem, a Neural Processing Engine, Image Signal Processing subsystem, among others. Since the success of Ingenuity, JPL is continuing to work with Qualcomm to address other applications of the Snapdragon SoC technology. This includes the deployment of two 855 Snapdragon development boards onboard the International Space Station (ISS) for successful in-situ benchmarking of applications in space (beyond those tested on Ingenuity). In this paper, we will examine the performance of various applications that have been identified to benefit from greater onboard computational capability. These applications include (among others): machine vision algorithms that are expected to be critical in autonomous entry-descent-and-landing scenarios and real-time Aerobot flight navigation; Hyperspectral compression algorithms; Synthetic Aperture Radar Processing along with various instrument processing algorithms. We discuss how the infusion of Qualcomm's Snapdragon SoC is capable of enabling missions that may not have been able to achieve their goals with traditional flight computing. In addition, we also show that for some algorithms, the software implementation on the Snapdragon SoC outperforms traditional FPGA implementations.

Cretu, Vlad↗

Passband Signal Detection at the Edge

Algorithms for radio frequency (RF) spectrum awareness need to be compatible with edge hardware to be practical for many applications. We developed a signal detection and classification model for the ZCU111 RF System-on-a-Chip (RFSoC) that operates on the fast Fourier transform of passband RF data. The system can detect and classify multiple signals of interest and display the predictions in real-time. The model consists of a modified ConvNeXt backbone and YOLOv3 head to operate on the Deep Learning Processing Unit on the RFSoC. We gathered datasets for training and testing by using a software defined radio to transmit example signals of Wi-Fi 802.11 b/g, Wi-Fi 802.11 n, FM Radio, LTE and LTE-M. By leveraging multiple inputs on the RFSoC frontend, the datasets span up to 4 GHz of bandwidth. The models showed high performance in classification accuracy, center frequency error, bandwidth error, and detection accuracy for both single and multi-signal datasets.

42 ENGINEERING↗

Software-Defined Ultrasonic Communication System Based on Time-reversal Signal Processing

Ultrasonic communication through solid channels suffers from channel dispersion, attenuation, and multipath effect. For example, in elbow shape pipes or complex structures, the elastic waves are reflected and reverberated in multipath resulting in a major dispersion of the signals. In solid channels such as flat bar, multipath propagation is the main reason for bit-wavelet spreading and intersymbol interference (ISI). The conventional modulation method like OOK (on-off-keying) or PSK (phase-shift-keying) fails to provide a useful Signal-to-Noise Ratio (SNR). Time-reversal (TR) signal processing method is a promising technique that can compress the spreading of the bit-wavelet and strengthen the peak signal energy on the receiver. In this study, Finite Element Analysis (FEA) using ABAQUS software tools is used to characterize the bit-wavelet spreading effect caused by dispersive communication channels. Also, this study presents the impact of TR ultrasonic communication as a function of excitation pulse width, channel length, and carrier frequency through a flat-bar channel. A Software-Defined System-on-Chip (SD-SoC) platform is examined as a viable solution for the low-complexity and energy-efficient ultrasonic communication system. The proposed TR based SD-SoC ultrasonic communication system can make full use of signal dispersion for peak performance by minimizing the ISI within a dispersive and reverberant metal channel.

FEM simulation↗

System-on-chip integrated circuit technology applications on the DIII-D tokamak for multi-field measurements

Several mm-wave diagnostics on the DIII-D tokamak provide multi-scale and multi-dimensional measurements of plasma profile evolution and turbulence fluctuations. Mm-wave fusion plasma diagnostics that adopt system-on-chip integrated circuit technology can provide better space utilization, flexible installation, and improved sensitivity. In order to further extend this technology for additional fusion facilities with a higher toroidal magnetic field, V-band (55–75 GHz) and F-band (90–140 GHz) chips for Microwave Imaging Reflectometer (MIR) and Electron Cyclotron Emission Imaging (ECEI) instruments are developed and tested in the Davis Millimeter Wave Research Center (DMRC). Current measurement data show that correlation between these SoC-based diagnostic instruments with other state-of-the-art diagnostics enables co-located multi-field turbulence fluctuation measurement.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

DIRECT RF SAMPLING BASED LLRF CONTROL SYSTEM FOR C-BAND LINEAR ACCELERATOR

Low Level RF (LLRF) control systems of linear accel- erators (LINACs) are typically implemented with hetero- dyne based architectures, which have complex analog RF mixers for up and down conversion. The Gen 3 Radio Fre- quency System-on-Chip (RFSoC) device from AMD Xilinx integrates data converters with maximum RF frequency of 6 GHz. This enables direct RF sampling of C-band LLRF signal typically operated at 5.712 GHz without any analogue mixers, which can significantly simplify the system architec- ture. The data converters sample RF signals in higher order Nyquist zones and then up or down convert digitally by the integrated data path in RFSoC. The closed-loop feedback control firmware implemented in FPGA integrated in RF- SoC can process the base-band signal from the ADC data path and calculate the updated phase and amplitude to be up- mixed by the DAC data path. We have developed a C-band LLRF control RFSoC platform with direct RF sampling, which targets Cool Copper Collider (𝐶3) and other C or S band LINAC research and development projects. In this paper, the architecture of the platform will be described. We have optimized the configuration of the data converter and characterized performance of them with RF pulses. The test results for some of the key performance parameters for the LLRF platform with our custom solid-state amplifier, such as phase and amplitude stability, will be discussed in this paper.

Liu, C↗