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Macrosegregation During Dendritic Arrayed Growth of Hypoeutectic Pb-Sn Alloys: Influence of Primary Arm Spacing and Mushy Zone Length

Thermosolutal convection in the dendritic mushy zone occurs during directional solidification of hypoeutectic lead tin alloys in a positive thermal gradient, with the melt on the top and the solid below. This results in macrosegregation along the length of the solidified samples. The extent of macrosegregation increases with increasing primary dendrite spacings for constant mushy zone length. For constant primary spacings, the macrosegregation increases with decreasing mushy zone length. Presence of convection reduces the primary dendrite spacings. However, convection in the interdendritic melt has significantly more influence on the spacings as compared with that in the overlying melt, which is caused by the solutal buildup at the dendrite tips.

Tewari, S. N.↗

The alloy undercooling experiment on the Columbia STA 61-C space shuttle mission

An Alloy Undercooling experiment was performed in an electromagnetic levitator during the Columbia STS 61-C mission in January 1986. One eutectic nickel-tin alloy specimen was partially processed before an equipment failure terminated the experiment. Examination of the specimen showed evidence of undercooling and some unusual microstructural features.

Harf, Fredric H.↗

The alloy undercooling experiment on the Columbia STS 61-C Space Shuttle mission

An Alloy Undercooling experiment was performed in an electromagnetic levitator during the Columbia STS 61-C mission in January 1986. One eutectic nickel-tin alloy specimen was partially processed before an equipment failure terminated the experiment. Examination of the specimen showed evidence of undercooling and some unusual microstructural features.

Harf, Fredric H.↗

The role of gravity on macrosegregation in alloys

During dendritic solidification liquid flow is induced both by buoyancy forces and solidification shrinkage. There is strong evidence that the major reason for the liquid flow is the former, i.e., thermosolutal convection. In the microgravity environment, it is thought that the thermosolutal convection will be greatly diminished so that convection will be confined mainly to the flow of interdendritic liquid required to satisfy the solidification shrinkage. An attempt is made to provide improved models of dendritic solidification with emphasis on convection and macrosegregation. Macrosegregation is an extremely important subject to the commercial casting community. The simulation of thermosolutal convection in directionally solidified (DS) alloys is described. A linear stability analysis was used to predict marginal stability curves for a system that comprises a mushy zone underlying an all-liquid zone. The supercritical thermosolutal convection in directionally solidified dendritic alloys was also modeled. The model assumes a nonconvective initial state with planar and horizontal isotherms and isoconcentration that move upward at a constant solidification velocity. Results are presented for systems involving lead-tin alloys and show significant differences with results of plane-front solidification.

Poirier, D. R.↗

Floating substrate process: Large-area silicon sheet task low-cost solar array project

Supercooling of silicon-tin alloy melts was studied. Values as high as 78 C at 1100 C and 39 C at 1200 C were observed, corresponding to supersaturation parameter values 0.025 and 0.053 at 1050 C and 1150 C, respectively. The interaction of tin with silane gas streams was investigated over the temperature range 1000 to 1200 C. Single-pass conversion efficiencies exceeding 30% were obtained. The growth habit of spontaneously-nucleated surface growth was determined to be consistent with dendritic and web growth from singly-twinned triangular nucleii. Surface growth of interlocking silicon crystals, thin enough to follow the surface of the liquid and with growth velocity as high as 5 mm/min, was obtained. Large area single-crystal growth along the melt surface was not achieved. Small single-crystal surface growth was obtained which did not propagate beyond a few millimeters.

Garfinkel, M.↗

Low-gravity processing of superconducting compounds

Low gravity conditions can be sustained on earth for several seconds in an evacuated drop tube. Because radiation cooling is most effective at high temperatures, the refractive metals and alloys are prime candidates for free fall solidification. The results of initial experiments on droplet formation, droplet release, critical size and evaporation losses are given. The time required for free fall solidification of different size droplets is calculated. The materials studied were copper, niobium and vanadium, and a niobium-tin alloys. Improvements in purity, composition, homogeneity and stoichiometry are expected during free fall solidification of niobium based alloys which should become evident in an increase in the superconducting transition temperature.

Otto, G. H.↗

A Numerical Study of Directional Solidification and Melting in Microgravity

A computational model is presented for the study of the solidification and melting of a pure substance and of a binary alloy. The enthalpy method has been used, and incorporated into a commercial CFD code. Three examples of the use of the model are described: the three-dimensional solidification of a pure substance (succinonitrile), the results of which are compared with experiment; an example of the solidification of a bismuth-tin alloy; and a simulation of a solidification and melting experiment done in space known as the MEPHISTO program.

Chen, P. Y. P.↗

Studies of liquid metal surfaces using Auger spectroscopy

The surface composition of liquid gallium-tin alloys is studied in an Auger electron spectrometer as a function of bulk composition and temperature. The sessile drop samples are cleaned by argon ion bombardment sputtering of the liquid. This technique produces surfaces that are entirely free of impurities within the sensitivity of the spectrometer and remain so for many days. Tin is found to be strongly adsorbed at the liquid-vacuum interface. Surface concentrations based on Auger measurements are found to be in reasonably good agreement with values calculated from surface tension measurements interpreted in terms of a monolayer depth distribution model for the adsorbed tin.

Hardy, S.↗

Thermosolutal convection during dendritic solidification

This paper presents a mathematical model for directional solidification of a binary alloy including a dendritic region underlying an all-liquid region. It is assumed initially that there exists a nonconvecting state with planar isotherms and isoconcentrates solidifying at a constant velocity. The stability of this system has been analyzed and nonlinear calculations are performed that show the effect of convection in the solidification process when the system is unstable. Results of calculations for various cases defined by the initial temperature gradient at the dendrite tips and varying strength of the gravitational field are presented for systems involving lead-tin alloys. The results show that the systems are stable for a gravitational constant of 0.0001 g(0) and that convection can be suppressed by appropriate choice of the container's size for higher values of the gravitational constant. It is also concluded that for the lead-tin systems considered, convection in the mushy zone is not significant below the upper 20 percent of the dendritic zone, if al all.

Heinrich, J. C.↗

Finite element simulations of thermosolutal convection in vertical solidification of binary alloys

Dendritic vertical solidification of a binary alloy is modeled using the finite element method to assess the effect of thermosolutal convection in macrosegregation. The mathematical model assumes steady-state solidification with a planar, undeformable surface defined by the dendrite tips and the eutectic isotherm. The dendritic region is assumed to advance at a constant solidification velocity v. The stability of the modeled system has been investigated and nonlinear calculations performed that show finger-like convection when the system is unstable. Results for lead-tin alloys show that when the system is unstable, convection is only significant in the uppermost part of the mush and is entirely driven by convection in the bulk fluid.

Heinrich, J. C.↗

Vertical solidification of dendritic binary alloys

Three numerical techniques are employed to analyze the influence of thermosolutal convection on defect formation in directionally solidified (DS) alloys. The finite-element models are based on the Boussinesq approximation and include the plane-front model and two plane-front models incorporating special dendritic regions. In the second model the dendritic region has a time-independent volume fraction of liquid, and in the last model the dendritic region evolves as local conditions dictate. The finite-element models permit the description of nonlinear thermosolutal convection by treating the dendritic regions as porous media with variable porosities. The models are applied to lead-tin alloys including DS alloys, and severe segregation phenomena such as freckles and channels are found to develop in the DS alloys. The present calculations and the permeability functions selected are shown to predict behavior in the dendritic regions that qualitatively matches that observed experimentally.

Heinrich, J. C.↗

Optimization of Aluminum-Tin Ink Composition and Sintering in Atmospheric Conditions

This study will focus on the basics of generating an aluminum-tin ink that can sinter in air and exhibits properties near that of a solid aluminum-tin alloy. Sintering temperatures will also be assessed in this study. Once the optimal aluminum ink composition is determined, the optimal ink thickness for homogeneous sintering must be determined by additional experimentation. Additive manufacturing is a rapidly developing and growing manufacturing process and has proven successful in many different ways. Processes, such as extrusion three-dimensional (3D) printing and selective laser melting (SLM), have proven to work but have limitations, such as material capabilities or density issues. SLM is a revolutionary process for additive manufacturing of metals but cannot be used in outer space due to the need for metallic powder which would diffuse into the atmosphere in a zero-gravity environment. For this reason, metallic ink additive manufacturing is a potential solution. Work is being done on metallic ink additive manufacturing in a vacuum for electrical applications. This project has focused on developing an aluminum-tin metallic ink that can sinter without the need of a vacuum or inert gas-purged atmosphere in order to prevent oxidation of the aluminum by adding flux. Once a potential ink composition has been determined through sintering of small disks and thin layers of ink, the ink may be studied with a multimaterial 3D printer at NASA Marshall Space Flight Center (MSFC) in future experiments. If successful, this aluminum-tin ink will be capable for use on the International Space Station to make replacement parts quickly. Along with its zero-gravity advantages, this ink may also have applications on Earth because it may be extruded on a substrate with precise ceramic tips in a 3D printing process. This would allow the fabrication of precise, complex shapes and may generate a much faster and more efficient printing process as compared with traditional powder bed additive manufacturing processes. The process would not be limited by a small building volume because the system would not require an enclosed chamber.

Courtright, Z. S.↗

Molybdenum-tin as a solar cell metallization system

The operations of solar cell manufacture are briefly examined. The formation of reliable, ohmic, low-loss, and low-cost metal contacts on solar cells is a critical process step in cell manufacturing. In a commonly used process, low-cost metallization is achieved by screen printing a metal powder-glass frit ink on the surface of the Si surface and the conductive metal powder. A technique utilizing a molybdenum-tin alloy for the metal contacts appears to lower the cost of materials and to reduce process complexity. The ink used in this system is formulated from MoO3 with Sn powder and a trace amount of titanium resonate. Resistive losses of the resulting contacts are low because the ink contains no frit. The MoO3 is finally melted and reduced in forming gas (N2+H2) to Mo metal. The resulting Mo is highly reactive which facilitates the Mo-Si bonding.

Boyd, D. W.↗

Double-diffusive convection and its effect under reduced gravity

This paper reviews recent results on three aspects of double-diffusive convection under reduced gravity: diffusive instability caused by sideways heating, diffusive instability caused by bottom heating, and the salt-finger convection case. Some of the processes that are likely to occur during solidification are highlighted. Using property values of lead-tin alloy, it is concluded that diffusive instabilities are unlikely to occur at steady reduced gravity levels of 0.01 and 0.0001 g(0). Salt finger convection is likely to be generated, however.

Chen, C. F.↗

High Temperature - Thin Film Strain Gages Based on Alloys of Indium Tin Oxide

A stable, high temperature strain gage based on reactively sputtered indium tin oxide (ITO) was demonstrated at temperatures up to 1050 C. These strain sensors exhibited relatively large, negative gage factors at room temperature and their piezoresistive response was both linear and reproducible when strained up to 700 micro-in/in. When cycled between compression and tension, these sensors also showed very little hysteresis, indicating excellent mechanical stability. Thin film strain gages based on selected ITO alloys withstood more than 50,000 strain cycles of +/- 500 micro-in/in during 180 hours of testing in air at 1000 C, with minimal drift at temperature. Drift rates as low as 0.0009%/hr at 1000 C were observed for ITO films that were annealed in nitrogen at 700 C prior to strain testing. These results compare favorably with state of the art 10 micro-m thick PdCr films deposited by NASA, where drift rates of 0.047%/hr at 1050 C were observed. Nitrogen annealing not only produced the lowest drift rates to date, but also produce the largest dynamic gage factors (G = 23.5). These wide bandgap, semiconductor strain sensors also exhibited moderately low temperature coefficients of resistance (TCR) at temperatures up to 1100 C, when tested in a nitrogen ambient. A TCR of +230 ppm/C over the temperature range 200 C < T < 500 C and a TCR of -469 ppm/C over the temperature range 600 C < T < 1100 C was observed for the films tested in nitrogen. However, the resistivity behavior changed considerably when the same films were tested in oxygen ambients. A TCR of -1560 ppm/C was obtained over the temperature range of 200 C < T < 1100 C. When similar films were protected with an overcoat or when ITO films were prepared with higher oxygen contents in the plasma, two distinct TCR's were observed. At T < 800 C, a linear TCR of -210 ppm/C was observed and at T > 800 C, a linear TCR of -2170 DDm/C was observed. The combination of a moderately low TCR and a relatively large gage factor make these semiconducting oxide films promising candidates for the active strain elements in high temperature thin film strain gages, particularly in applications where static strain measurement is desired.

Gregory, Otto J.↗