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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2

Centrifugal contactor operations for UREX process flowsheet. An update

The uranium extraction (UREX) process separates uranium, technetium, and a fraction of the iodine from the other components of the irradiated fuel in nitric acid solution. In May 2012, the time, material, and footprint requirements for treatment of 260 L batches of a solution containing 130 g-U/L were evaluated for two commercial annular centrifugal contactors from CINC Industries. These calculated values were based on the expected volume and concentration of fuel arising from treatment of a single target solution vessel (TSV). The general conclusions of that report were that a CINC V-2 contactor would occupy a footprint of 3.2 m 2 (0.25 m x 15 m) if each stage required twice the nominal footprint of an individual stage, and approximately 1,131 minutes or nearly 19 hours is required to process all of the feed solution. A CINC V-5 would require approximately 9.9 m 2 (0.4 m x 25 m) of floor space but would require only 182 minutes or ~ 3 hours to process the spent target solution. Subsequent comparison with the Modular Caustic Side Solvent Extraction Unit (MCU) at Savannah River Site (SRS) in October 2013 suggested that a more compact arrangement is feasible, and the linear dimension for the CINC V-5 may be reduced to about 8 m; a comparable reduction for the CINC V-2 yields a length of 5 m. That report also described an intermediate-scale (10 cm) contactor design developed by Argonne in the early 1980s that would better align with the SHINE operations as they stood in May 2012. In this report, we revisit the previous evaluation of contactor operations after discussions with CINC Industries and analysis of the SHINE process flow diagrams for the cleanup of the TSV, which were not available at the time of the first assessment.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Evaluation of Zircaloy-4 Welding and Hydrogen Charging Effects for Use as the Structural Material for the Target Solution Vessel and Support Lines of SHINE

The subcritical hybrid intense neutron emitter (SHINE) is a proposed 99 Mo production facility to be constructed in the United States. It uses a deuterium (D) and tritium (T) fusion source to cause subcritical fission in an aqueous uranium solution, which is cycled to collect the 99 Mo products. The target solution vessel (TSV) is the container of the aqueous uranium solution, so it must remain structurally sound during operational exposure to water, fission products, neutrons, and hydrogen isotopes. The TSV will be large enough to require welding, so the exposure of joints to these same conditions must also be considered. The candidate material being investigated is Zircaloy-4. While Zircaloy-4 has a long history in the nuclear industry, it has primarily been used as fuel cladding at service temperatures of ~300°C. Zircaloy-4 must be evaluated for behavior under neutron irradiation at SHINE-relevant temperatures of <100°C. In this project, the effects of hydrogen, welding, and neutron irradiation at low temperatures are investigated.

36 MATERIALS SCIENCE↗

NASA 2009 Body of Knowledge (BoK) Through-Slicon Via Technology

Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devices in three dimensions (3D). Driven by the need for improved performance, methods to use short vertical interconnects to replace the long interconnects found in 2D structures have been developed. The industry is moving past the feasibility (research and development [R and D]) phase for TSV technology into the commercialization phase where economic realities will determine which technologies are adopted. Low-cost fine via hole formation and highly reliable via filling technologies have been demonstrated; process equipment and materials are available. Even though design, thermal, and test issues remain, much progress has been made.

3D packaging↗

Method of forming through substrate vias (TSVs) and singulating and releasing die having the TSVs from a mechanical support substrate

Accessing a workpiece object in semiconductor processing is disclosed. The workpiece object includes a mechanical support substrate, a release layer over the mechanical support substrate, and an integrated circuit substrate coupled over the release layer. The integrated circuit substrate includes a device layer having semiconductor devices. The method also includes etching through-substrate via (TSV) openings through the integrated circuit substrate that have buried ends at or within the release layer including using the release layer as an etch stop. TSVs are formed by introducing one or more conductive materials into the TSV openings. A die singulation trench is etched at least substantially through the integrated circuit substrate around a perimeter of an integrated circuit die. The integrated circuit die is at least substantially released from the mechanical support substrate.

36 MATERIALS SCIENCE↗

Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in [Phase 3 Memory,] 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices

Synchrotron x-ray microdiffraction (μXRD) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, μXRD is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the μXRD technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of μXRD in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. Here, the approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.

36 MATERIALS SCIENCE↗

Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs

A methanesulfonic acid (MSA) electrolyte with a single suppressor additive was used for potentiostatic bottom-up filling of copper in mesoscale through silicon vias (TSVs). Conversly, galvanostatic deposition is desirable for production level full wafer plating tools as they are typically not equipped with reference electrodes which are required for potentiostatic plating. Potentiostatic deposition was used to determine the over-potential required for bottom-up TSV filling and the resultant current was measured to establish a range of current densities to investigate for galvanostatic deposition. Galvanostatic plating conditions were then optimized to achieve void-free bottom-up filling in mesoscale TSVs for a range of sample sizes.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Scalable Detector Design for a High-Resolution Fast-Neutron Radiography Panel

Development of a scalable flat-panel neutron radiography device is needed to meet the nondestructive testing needs of a growing industrial market. Flood field images from a Cs-137 gamma source and a Cf-252 fission neutron source were generated using a detector composed of a 3-mm-thick sheet of EJ-200, and 3-mm-thick sheet of acrylic light spreader, an 8 $\times$ 8 array of SensL MICROFJ-60035-TSV SiPMs, and an IDEAS ROSSPAD readout module. The readout module can be tiled together with similar systems to create a panel of any size, and is only limited by the number of available Ethernet ports in a switching system. A collimated gamma line image demonstrated a 90% spatial resolution of approximately 0.47 line pairs per centimeter and a 10% spatial resolution of approximately 2.32 line pairs per centimeter. A neutron edge image demonstrated a 90% spatial resolution of approximately 0.70 line pairs per centimeter and a 10% spatial resolution of approximately 3.35 line pairs per centimeter. Both of these images show the ability to generate radiographs with sub-SiPM spatial resolution. Using these readout modules, a large-scale radiographic panel can be developed by tiling ROSSPAD modules together.

36 MATERIALS SCIENCE↗

A prototype cooling blanket for mitigating occupant overheating risk in a hot indoor environment: Modeling and assessments

Conventional ways of cooling a room or an entire house for occupant thermal comfort during summer consume a significant amount of energy and are vulnerable to overheating risk during power outages that lead to loss of cooling system operations. This study investigates a low-power cooling blanket, as a Personal Cooling System (PCS), that covers the upper human body for direct cooling during a five-day heat wave in a single-family house. A modeling framework is developed for evaluating the thermal and energy performance of the cooling blanket, which builds upon the co-simulation of three models: a house energy model, a personal thermal comfort model, and a cooling blanket model. Simulation results show that under the power outage scenario, the cooling blanket can greatly reduce the occupant heat stress with a reduction of daily hours of exceedance (discomfort hours defined as TSV>2) by up to 17.2 h (a 95.3 % improvement from the baseline power outage without the blanket). The cooling blanket, equipped with an innovative electrocaloric heat pump (COP as high as 10.1) consumes 6.31 W and can be operated by a portable battery for several days. The cooling blanket consumes only 0.28 % of the electricity of a central air-conditioning system running to provide cooling for the whole house during the five-day heatwave period. The findings justify further research of electrocaloric wearable PCS as low-power effective cooling to ensure thermal survivability of occupants during extreme indoor environments.

Electrocaloric heat pump↗

Metrology and Failure Analysis for 3D IC Integration

At the same time as research in 3D TSV technology is advancing quickly, the analytical techniques used in the evaluation of 3D stacks must also advance in capability. Microscopy techniques for which silicon is opaque such as scanning acoustic microscopy (SAM) and confocal infrared (IR) microscopy are capable of inspecting the interface between bonded wafer pairs, while high resolution X-ray computed tomography (XCT) is used to detect voids in TSVs. With nano-XCT, voids in copper TSVs with sub-100 nm size can be visualized. For more detailed failure characterization, a target Focused Ion Beam (FIB) cross-section through the localized region of interest (defect) and subsequent scanning electron microscopy (SEM) imaging is proposed. Currently, the most important requirement is to reduce the so-called time-to-data, e. g. for defect localization using nano-XCT and for cross-section characterization.

36 MATERIALS SCIENCE↗

Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias

A 3-D thermomechanical model of through-silicon vias (TSVs) has been analyzed and verified with in situ microscale strain measurements by synchrotron X-ray microdiffraction will be discussed in this paper. Thereafter, a comprehensive stress/strain analysis on copper pumping and back-end-of-line (BEOL) cracking issues has been carried out. In addition, a design-of-experiments-based approach has been used to understand the effect of various parameters on copper pumping and BEOL stress. The results show that the smaller TSV diameter and thinner silicon die help reduce the copper pumping and thus mitigate BEOL stress.

36 MATERIALS SCIENCE↗

3D-ReG: A 3D ReRAM-based Heterogeneous Architecture for Training Deep Neural Networks

Deep neural network (DNN) models are being expanded to a broader range of applications. The computational capability of traditional hardware platforms cannot accommodate the growth of model complexity. Among recent technologies to accelerate DNN, resistive memory (ReRAM)-based processing-in-memory (PIM) emerged as a promising solution for DNN inference due to its high efficiency for matrix-based computation. We face two major technical challenges in extending the use of ReRAM-based accelerators for training: (1) full-precision data is essential in back-propagation; (2) the need to support both feed-forward and back-propagation aggravates the data-movement burden. We propose a heterogeneous architecture named as 3D-ReG, which leverages full-precision GPU to ensure training accuracy and low-overhead 3D integration to provide low-cost data movements. Moreover, we introduce conservative and aggressive task-mapping schemes, which partition the computation phases in different ways to balance execution efficiency and training accuracy. We evaluate 3D-ReG implemented with two 3D integration technologies, through-silicon vias (TSVs) and monolithic inter-tier vias (MIVs), and compare them with GPU-only and PIM-only counterparts. Various GPU-only platforms using two main-memory technologies (DRAM, ReRAM) and three interconnect technologies (2D, TSV, MIV) are evaluated as well. Experimental results show that 3D-ReG can achieve on average 5.64× training speedup and 3.56× higher energy efficiency compared with the GPU with DRAM as main memory, at the cost of 0.05%–3.39% accuracy drop. We define a new metric, gain-loss ratio (GLR), which quantitatively evaluates the capability of a DNN training hardware in terms of the model accuracy and hardware efficiency. The results of our comparison show that the aggressive task-mapping scheme on MIV-based 3D-ReG outperforms the other methods.

Computer Science↗

Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection

High density interconnects are required for increased input/output for microelectronics applications, incentivizing the development of Cu electrochemical deposition (ECD) processes for high aspect ratio through-silicon vias (TSVs). This work outlines Cu ECD processes for 62.5 μ m diameter TSVs, etched into a 625 μ m thick silicon substrate, a 10:1 aspect ratio. Cu ECD in high aspect ratio features relies on a delicate balance of electrolyte composition, solution replenishment, and applied voltage. Implementing a CuSO 4 -H 2 SO 4 electrolyte, which contains suppressor and a low chloride concentration, allows for a tunable relationship between applied voltage and localized deposition in the vias. A stepped potential waveform was applied to move the Cu growth front from the bottom of the via to the top. Sample characterization was performed through mechanical cross-sections and X-ray computed tomography (CT) scans. The CT scans revealed small seam voids in the Cu electrodeposit, and process parameters were tuned accordingly to produce void-free Cu features. During the voltage-controlled experiments, measured current data showed a characteristic current minimum, which was identified as an endpoint detection method for Cu deposition in these vias. We believe this is the first report of this novel endpoint detection method for TSV filling.

42 ENGINEERING↗

db, Version 0.x

A set of programs and utilities for generating and manipulating data files in TSV (tab-separated value) or JSON format.

Hash, Curtis↗

Peptide Hit Results Processor

The Peptide Hit Results Processor (PHRP) can be used to convert an X!Tandem results file (XML format), MSGF+ .tsv search result file, Sequest Synopsis/First Hits file, or Inspect search result into a series of tab-delimited text files summarizing the results. It will insert modification symbols into the peptide sequences for modified peptides. Parallel files are created containing sequence information, modification details, and protein information. The user can optionally provide a modification definition file that specifies the symbol to use for each modification mass.

Gibbons, Bryson↗

Vendor 0

Software uses a Format-preserving Feistel based encryption library to encrypt and decrypt text fields in structured files such currently JSON, TSV.

Wellman, LawrenceR.↗

Motion Tracking Above and Below Water Dataset

This data set includes one trial of above and under water motion tracking measurements from a Qualysis motion tracking system. The Qualisys native .qtm file can be opened by the Qualisys Track Manager software. Data from this file has been exported to a tab separated value (.tsv) file which is a generic ASCII file format that can be read by a text editor, MATLAB, Excel, etc... Also exported is a native MATLAB formatted file (.mat) which can be loaded directly into MATLAB. The trial is from a three body wave energy converter device, using the underwater system for the central nacelle data, and above water system for the fore and aft floats.

16 TIDAL AND WAVE POWER↗

TEAMER: Twin Ocean Power Wave Energy Converter Comprehensive Overview

These files collectively provide a comprehensive overview of the testing process, data analysis, and validation for the Twin Ocean Power device tested at the O.H. Hinsdale Wave Research Laboratory, supported by TEAMER funding. This resource includes an overview of power results for a series of 7 trials. The files included in this comprehensive overview include a comprehensive log sheet for each trial, a summary of all trials, and processing scripts for the raw data. It includes all raw data in .tsv and MATLAB compatible formats, an average power chart, angular velocity charts for each trial, trial metrics, and power output files. This resource includes images of the Twin Ocean Power Wave Energy Converter device components and movement during testing and video recordings of each trial.

16 TIDAL AND WAVE POWER↗

Data and scripts associated with a manuscript investigating dissolved organic matter and microbial community linkages across seven globally distributed rivers

This data package is associated with the publication “Meta-metabolome ecology reveals that geochemistry and microbial functional potential are linked to organic matter development across seven rivers” submitted to Science of the Total Environment. This data package includes the data necessary to replicate the analyses presented within the manuscript to investigate dissolved organic matter (DOM) development across broad spatial distances and within divergent biomes. Specifically, we included the Fourier transform ion cyclotron mass spectrometry (FTICR-MS) data, geochemistry data, annotated metagenomic data, and results from ecological null modeling analyses in this data package. Additionally, we included the scripts necessary to generate the figures from the manuscript. Complete metagenomic data associated with this data package can be found at the National Center for Biotechnology (NCBI) under Bioproject PRJNA946291. This dataset consists of (1) four folders; (2) a file-level metadata (flmd) file; (3) a data dictionary (dd) file; (4) a factor sheet describing samples; and (5) a readme. The FTICR Data folder contains (1) the processed Fourier transform ion cyclotron mass spectrometry (FTICR-MS) data; (2) a transformation-weighted characteristics dendrogram generated from the FTICR-MS data; and (3) the script used to generate all FTICR-MS related figures. The Geochemical Data folder contains (1) the single geochemistry data file and (2) the R script responsible for generating associated figures. The Metagenomic Data folder contains (1) annotation information across different levels; (2) carbohydrate active enzyme (CAZyme) information from the dbCAN database (Yin et al., 2012); (3) phylogenetic tree data (FASTAs, alignments, and tree file); and (4) the scripts necessary to analyze all of these data and generate figures. The Null Modeling Data folder contains (1) data generated during null modeling for each river and all rivers combined and (2) the R scripts necessary to process the data. All files are .csv, .pdf, .tsv, .tre, .faa, .afa, .tree, or .R.

54 ENVIRONMENTAL SCIENCES↗