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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

Contact Whiskers for Millimeter Wave Diodes

Several techniques are investigated for making short conical tips on wires (whiskers) used for contacting millimeter-wave Schottky diodes. One procedure, using a phosphoric and chromic acid etching solution (PCE), is found to give good results on 12 microns phosphor-bronze wires. Full cone angles of 60 degrees-80 degrees are consistently obtained, compared with the 15 degrees-20 degrees angles obtained with the widely used sodium hydroxide etch. Methods are also described for cleaning, increasing the tip diameter (i.e. blunting), gold plating, and testing the contact resistance of the whiskers. The effects of the whisker tip shape on the electrical resistance, inductance, and capacitance of the whiskers are studied, and examples given for typical sets of parameters.

Kerr, A. R.↗
NASA NTRS2000

NASA GSFC Tin Whisker Homepage http://nepp.nasa.gov/whisker

The NASA GSFC Tin Whisker Homepage provides general information and GSFC Code 562 experimentation results regarding the well known phenomenon of tin whisker formation from pure tin plated substrates. The objective of this www site is to provide a central repository for information pertaining to this phenomenon and to provide status of the GSFC experiments to understand the behavior of tin whiskers in space environments. The Tin Whisker www site is produced by Code 562. This www site does not provide information pertaining to patented or proprietary information. All of the information contained in this www site is at the level of that produced by industry and university researchers and is published at international conferences.

Shaw, Harry↗
NASA NTRS2007

Metal Whiskers: Failure Modes and Mitigation Strategies

Metal coatings especially tin, zinc and cadmium are unpredictably susceptible to the formation of electrically conductive, crystalline filaments referred to as metal whiskers. The use of such coatings in and around electrical systems presents a risk of electrical shorting. Examples of metal whisker formation are shown with emphasis on optical inspection techniques to improve probability of detection. The failure modes (i.e., electrical shorting behavior) associated with metal whiskers are described. Based on an almost 9- year long study, the benefits of polyurethane conformal coat (namely, Arathane 5750) to protect electrical conductors from whisker-induced short circuit anomalies is discussed.

Brusse, Jay A.↗
NASA NTRS2010

Sensing device with whisker elements

A sensing device includes an elongated whisker element having a flexible cantilever region and a base region where a change in moment or curvature is generated by bending of the cantilever region when it contacts an object. One or more sensor elements cooperatively associated with the whisker element provide one or more output signals that is/are representative of two orthogonal components of change in moment or curvature at the whisker base region to permit determination of object distance, fluid velocity profile, or object contour (shape) with accounting for lateral slip of the whisker element and frictional characteristics of the object. Multiple sensing devices can be arranged in arrays in a manner to sense object contour without or with adjustment for lateral slip.

Hartmann, Mitra J.↗
NASA NTRS2010

Estimating the Probability of Electrical Short Circuits from Tin Whiskers

To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish .

Courey, Karim J.↗
NASA NTRS2009

Estimating the Probability of Electrical Short Circuits from Tin Whiskers

To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage.

Courey, Karim J.↗
NASA NTRS2009

Developing an Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers

To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish.

Courey, Karim J.↗
NASA NTRS2013

Sensing Device with Whisker Elements

A sensing device includes an elongated whisker element having a flexible cantilever region and a base region where a change in moment or curvature is generated by bending of the cantilever region when it contacts an object. One or more sensor elements cooperatively associated with the whisker element provide one or more output signals that is/are representative of two orthogonal components of change in moment or curvature at the whisker base region to permit determination of object distance, fluid velocity profile, or object contour (shape) with accounting for lateral slip of the whisker element and frictional characteristics of the object. Multiple sensing devices can be arranged in arrays in a manner to sense object contour without or with adjustment for lateral slip.

Hartmann, Mitra J.↗
DOE OSTI2021

In Situ Visualization of Li-Whisker with Grating-Interferometry-Based Tricontrast X-ray Microtomography

The lithium-ion battery has demonstrated tremendous economic and social impacts. Upon battery operation under different conditions, lithium changes its chemical state and physical formation, leading to undesired side reactions, e.g., lithium dendrite growth that degrades the cell performance and causes safety concerns. In situ detection and visualization of lithium metal in functional batteries could offer insights with both scientific and industrial significance but remain a frontier challenge. In this work, we demonstrate in situ three-dimensional imaging of lithium whisker using a grating-interferometry-based tricontrast X-ray microtomography method. Our approach explicitly reveals the micromorphology of the electrochemically developed porous lithium whisker with micrometer-level spatial resolution while offering sensitivity to the nanoporosity that is smaller than the nominal resolution limit. Our result reveals valuable structural information on the lithium whisker that is otherwise inaccessible. This method is also readily applicable to a broad range of battery research, including all-solid-state batteries.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS1986

Beta Silicon Nitride Whiskers

Process for growing fibrous beta silicon nitride helps meet potentially great demand for silicon nitride ceramics. Ceramics have high tensile strength and resistance to thermal shock, which make them attractive choice for high-temperature engine parts. Process forms whiskers of strong, stable, heatresistant material. Whiskers expected to find application as reinforcement in composite silicon nitride ceramic parts. Corklike material useful in present form for thermal barrier tiles. Process forms whiskers of strong, stable, heat-resistant material.

Holliday, R. J.↗
NASA NTRS1989

Fracture of silicon carbide whisker reinforced aluminum

An attempt is made to apply standard fracture toughness testing procedures, developed for metals, to whisker reinforced metal matrix composites. Test were carried out on compact-tension, center-notched, and edge-notched specimens of silicon carbide whisker reinforced extruded 2124 aluminum plate (10 and twenty volume percent of whiskers), with the loading direction either parallel or perpendicular to the extrusion direction. None of the tests is found to give a valid fracture toughness according to the criteria of the ASTM Standard E-399.

Albritton, J. R.↗
NASA NTRS1991

Comparison of dynamic fatigue behavior between SiC whisker-reinforced composite and monolithic silicon nitrides

The dynamic fatigue behavior of 30 vol percent silicon nitride whisker-reinforced composite and monolithic silicon nitrides were determined as a function of temperature from 1100 to 1300 C in ambient air. The fatigue susceptibility parameter, n, decreased from 88.1 to 20.1 for the composite material, and from 50.8 to 40.4 for the monolithic, with increasing temperature from 1100 to 1300 C. A transition in the dynamic fatigue curve occurred for the composite material at a low stressing rate of 2 MPa/min at 1300 C, resulting in a very low value of n equals 5.8. Fractographic analysis showed that glassy phases in the slow crack growth region were more pronounced in the composite compared to the monolithic material, implying that SiC whisker addition promotes the formation of glass rich phases at the grain boundaries, thereby enhancing fatigue. These results indicate that SiC whisker addition to Si3 N4 matrix substantially deteriorates fatigue resistance inherent to the matrix base material for this selected material system.

Choi, Sung R.↗
NASA NTRS1991

Tribological characteristics of silicon carbide whisker-reinforced alumina at elevated temperatures

The enhanced fracture toughness of whisker reinforced ceramics makes them attractive candidates for sliding components of advanced hear engines. Examples include piston rings and valve stems for Stirling engines and other low heat rejection devices. However, the tribological behavior of whisker reinforced ceramics is largely unknown. This is especially true for the applications described where use temperatures can vary from below ambient to well over 1000 C. An experimental research program to identify the dominant wear mechanism(s) for a silicon carbide whisker reinforced alumina composite, SiCw-Al2O3 is described. In addition, a wear mechanism model is developed to explain and corroborate the experimental results and to provide insight for material improvement.

Dellacorte, Christopher↗
NASA NTRS1991

Elevated temperature mechanical behavior of monolithic and SiC whisker-reinforced silicon nitrides

The mechanical behavior of a 30 volume percent SiC whisker reinforced silicon nitride and a similar monolithic silicon nitride were measured at several temperatures. Measurements included strength, fracture toughness, crack growth resistance, dynamic fatigue susceptibility, post oxidation strength, and creep rate. Strength controlling defects were determined with fractographic analysis. The addition of SiC whiskers to silicon nitride did not substantially improve the strength, fracture toughness, or crack growth resistance. However, the fatigue resistance, post oxidation strength, and creep resistance were diminished by the whisker addition.

Salem, Jonathan A.↗
NASA NTRS2003

Could Zinc Whiskers Be Impacting Your Electronic Systems? Raise Your Awareness

During the past several decades electrical short circuits induced by "Zinc Whiskers" have been cited as the root cause of failure for various electronic systems (e.g., apnea monitors, telecom switches). These tiny filaments of zinc that may grow from some zinc-coated items (especially those coated by electroplating processes) have the potential to induce electrical shorts in exposed circuitry. Through this article, the authors describe a particular failure scenario attributed to zinc whiskers that has affected many facilities (including some NASA facilities) that utilized zinc-coated raised "access" floor tiles and support structures. Zinc whiskers that may be growing beneath your raised floor have the potential to wreak havoc on electronic systems operating above the floor.

Sampson, Michael↗
NASA NTRS2010

The Formation of Graphite Whiskers in the Primitive Solar Nebula

It has been suggested that carbonaceous grains are efficiently destroyed in the interstellar medium and must either reform in situ at very low pressures and temperatures or in an alternative environment more conducive to grain growth. Graphite whiskers have been discovered associated with high-temperature phases in meteorites such as calcium aluminum inclusions and chondrules, and it has been suggested that the expulsion of such material from proto stellar nebulae could significantly affect the optical properties of the average interstellar grain population. We have experimentally studied the potential for Fischer-Tropsch and Haber-Bosch type reactions to produce organic materials in protostellar systems from the abundant H2, CO, and N2 reacting on the surfaces of available silicate grains. When graphite grains are repeatedly exposed to H2, CO, and N2 at 875 K abundant graphite whiskers are observed to form on or from the surfaces of the graphite grains. In a dense, turbulent nebula, such extended whiskers are very likely to be broken off, and fragments could be ejected either in polar jets or by photon pressure after transport to the outer reaches of the nebula.

Nuth, Joseph A., III↗
NASA NTRS2008

An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.

Courey, Karim J.↗
NASA NTRS2008

An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers

In this experiment, an empirical model to quantify the probability of occurrence of an electrical short circuit from tin whiskers as a function of voltage was developed. This model can be used to improve existing risk simulation models FIB and TEM images of a tin whisker confirm the rare polycrystalline structure on one of the three whiskers studied. FIB cross-section of the card guides verified that the tin finish was bright tin.

Courey, Karim J.↗