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Science Enabling ASICs and FEEs for the JUICE and JEO Missions

A family of science enabling radiation hard Application Specific Integrated Circuits (ASICs), Front End Electronics (FEEs) and Event Processing Systems, with flight heritage on many NASA missions, is presented. These technologies play an important role in the miniaturization of instruments -and spacecraft systems- at the same time increasing performance and reducing power. The technologies target time of flight, position sensing, and energy measurements as well as standard housekeeping and telemetry functions for particle and fields instruments, but find applications in other instrument categories too. More specifically the technologies include: the TOF chip, 1D and 2D Delay Lines with MCP detectors, for high precision fast and low power time of flight and position sensing; the Energy chip for multichannel SSD readout with time over threshold and standard voltage read out for TDC and ADC digitization; Fast multi channel read out chip with commandable thresholds; the TRIO chip for multiplexed ADC and housekeeping etc. It should be mentioned that the ASICs include basic trigger capabilities to enable random event processing in a heavy background of penetrators and UV foreground. Typical instruments include time of flight versus energy and look angle particle analyzers such as: plasma composition, energetic particle, neutral atom imaging as well as fast plasma and deltaE/E ion/electron telescopes. Flight missions include: Cassini/LEMMS, IMAGE/HENA, MESSENGER/EPPS/MLA/X-ray/MLA, STEREO, PLUTO-NH/PEPSSI/LORI, IBEX-Lo, JUNO/JEDI, RBSP/RBSPICE, MMS/HPCA/EPD, SO/SIS. Given the proven capability on heavy radiation missions such as JUNO, MMS and RBSB, as well diverse long duration missions such as MESSENGER, PLUTO and Cassini, it is expected that these technologies will play an important role in the particle and fields (at least) instruments on the upcoming JUICE and JEO missions.

Paschalidis, Nicholas

A Radiation Hardened by Design CMOS ASIC for Thermopile Readouts

A radiation hardened by design (RHBD) mixed-signal application specific integrated circuit (ASIC) has been designed for a thermopile readout for operation in the harsh Jovian orbital environment. The multi-channel digitizer (MCD) ASIC includes 18 low noise amplifier channels which have tunable gain/filtering coefficients, a 16-bit sigma-delta analog-digital converter (SDADC) and an on-chip controller. The 18 channels, SDADC and controller were designed to operate with immunity to single event latchup (SEL) and to at least 10 Mrad total ionizing dose (TID). The ASIC also contains a radiation tolerant 16-bit 20 MHz Nyquist ADC for general purpose instrumentation digitizer needs. The ASIC is currently undergoing fabrication in a commercial 180 nm CMOS process. Although this ASIC was designed specifically for the harsh radiation environment of the NASA led JEO mission it is suitable for integration into instrumentation payloads 011 the ESA JUICE mission where the radiation hardness requirements are slightly less stringent.

Quilligan, G.

Power Actuation and Switching Module Test Results

The X2000 Power System Electronics (PSE) is a Jet Propulsion Laboratory (JPL) task to develop a new generation of power system building blocks for use on future deep-space missions. The effort includes the development of electronic components and modules that can be used as building blocks in the design of generic spacecraft power systems. All X2000 avionics components and modules are designed for use in centralized or distributed spacecraft architectures. The Power Actuation and Switching Module (PASM) has been developed under the X2000 program. This component enables a modular and scalable design approach for power switching applications, which can result in a wide variety of power switching architectures using this simple building block. The PASM is designed to provide most of the necessary power switching functions of spacecraft for various Deep Space missions including future missions to Mars, comets, Jupiter and its moons. It is fabricated using an ASIC process that is tolerant of high radiation. The development included two application specific integrated circuits (ASICs) and support circuitry all packaged using High Density Interconnect (HDI) technology. It can be operated in series or parallel with other PASMs. It can be used as a high-side or low-side switch and it can drive thruster valves, pyrotechnic devices such as NASA standard initiators, bus shunt resistors, and regular spacecraft component loads. Each PASM contains two independent switches with internal current limiting and over-current trip-off functions to protect the power subsystem from load faults. During turnon and turnoff each switch can limit the rate of current change (di/dt) to a value determined by the user. Three-way majority-voted On/Off commandability and full switch status telemetry (both analog and digital) are built into the module. This paper is a follow up to the one presented at he IECEC 2004 conference that will include the lessons learned and test results from the development.

X2000

A Sub-electron-noise Skipper-CCD Readout ASIC with Improved Channel-to-channel Isolation and an Integrated Cryogenic Voltage Reference

The MIDNA application specific integrated circuits (ASICs) are a series of skipper-CCD readout chips fabricated in a 65 nm low-power CMOS process that implement a correlated double sampling signal processing chain based on dual-slope integrators. They are capable of working from room to cryogenic temperatures, down to 84 K. The present iteration of the ASIC has been fabricated including several design updates and the addition of an on-chip voltage reference, resulting in improved performance. This work presents the main vulnerabilities solved, the changes carried out, and the resulting performance benefits. Measurements with a skipper-CCD and the ASIC at 140 K showed that the single-electron resolution can be reached by averaging the measured charge in the analog domain using the analog pile-up technique with a readout noise as low as 0.11 erms of equivalent charge for 1200 samples. The channel-to-channel crosstalk was also characterized showing values better than -62 dB.

Alcalde Bessia, Fabricio

A Sub-electron-noise Skipper-CCD Readout ASIC with Improved Channel-to-channel Isolation and an Integrated Cryogenic Voltage Reference

The MIDNA application specific integrated circuits (ASICs) are a series of skipper-CCD readout chips fabricated in a 65 nm low-power CMOS process that implement a correlated double sampling signal processing chain based on dual-slope integrators. They are capable of working from room to cryogenic temperatures, down to 84 K. The present iteration of the ASIC has been fabricated including several design updates and the addition of an on-chip voltage reference, resulting in improved performance. This work presents the main vulnerabilities solved, the changes carried out, and the resulting performance benefits. Measurements with a skipper-CCD and the ASIC at 140 K showed that the single-electron resolution can be reached by averaging the measured charge in the analog domain using the analog pile-up technique with a readout noise as low as 0.11 erms of equivalent charge for 1200 samples. The channel-to-channel crosstalk was also characterized showing values better than -62 dB.

Alcalde Bessia, Fabricio

A Low-Power Correlator ASIC for Arrays with Many Antennas

We report the design of a new application-specific integrated circuit (ASIC) for use in radio telescope correlators. It supports the construction of correlators for an arbitrarily large number of signals. The ASIC uses an intrinsically low-power architecture along with design techniques and a process that together result in unprecedentedly low power consumption. The design is flexible in that it can support telescopes with almost any number of antennas N. It is intended for use in an "FX" correlator, where a uniform filter bank breaks each signal into separate frequency channels prior to correlation.

radio telescopes

Test chips and ASIC qualification

A test chip set being developed to aid in the qualification of spaceborne Application Specific Integrated Circuits (ASICs) is described. The chip set consists of a process monitor for process parameter verification, a fault chip for yield analysis, a reliability chip for ASIC failure rate analysis, and total ionizing dose and single event upset chips for radiation effect analysis. The test structures contained in these chips are discussed along with representative test results.

Buehler, M. G.

Digital Radar-Signal Processors Implemented in FPGAs

High-performance digital electronic circuits for onboard processing of return signals in an airborne precipitation- measuring radar system have been implemented in commercially available field-programmable gate arrays (FPGAs). Previously, it was standard practice to downlink the radar-return data to a ground station for postprocessing a costly practice that prevents the nearly-real-time use of the data for automated targeting. In principle, the onboard processing could be performed by a system of about 20 personal- computer-type microprocessors; relative to such a system, the present FPGA-based processor is much smaller and consumes much less power. Alternatively, the onboard processing could be performed by an application-specific integrated circuit (ASIC), but in comparison with an ASIC implementation, the present FPGA implementation offers the advantages of (1) greater flexibility for research applications like the present one and (2) lower cost in the small production volumes typical of research applications. The generation and processing of signals in the airborne precipitation measuring radar system in question involves the following especially notable steps: The system utilizes a total of four channels two carrier frequencies and two polarizations at each frequency. The system uses pulse compression: that is, the transmitted pulse is spread out in time and the received echo of the pulse is processed with a matched filter to despread it. The return signal is band-limited and digitally demodulated to a complex baseband signal that, for each pulse, comprises a large number of samples. Each complex pair of samples (denoted a range gate in radar terminology) is associated with a numerical index that corresponds to a specific time offset from the beginning of the radar pulse, so that each such pair represents the energy reflected from a specific range. This energy and the average echo power are computed. The phase of each range bin is compared to the previous echo by complex conjugate multiplication to obtain the mean Doppler shift (and hence the mean and variance of the velocity of precipitation) of the echo at that range.

Berkun, Andrew

Cryogenic Front-End ASICs for Low-Noise Readout of Charge Signals

This paper presents design details and measurement results of LArASIC, a front-end application specific integrated circuit (ASIC) designed for low-noise readout of charge signals generated in neutrino study experiments within liquid argon time projection chambers. LArASIC comprises of 16-channels of programmable charge amplification and pulse shaping stages that provide a voltage readout proportional to the input charge and was optimized for operation at liquid argon temperature, i.e., 89 K. The chip was fabricated in a 180 nm CMOS process. Measurements at liquid nitrogen temperature, i.e., 77 K, indicate that the channel outputs have high linearity (INL < 0.1%) within the operating range, an equivalent noise charge of 534 electrons for a peaking time of 1 µs and a detector capacitance of 150 pF, and a worst-case inter-channel cross-talk of 0.35%. The paper also presents design choices made in the process of migrating LArASIC to CHARMS, an ASIC to be fabricated in a 65 nm process that includes all features provided by LArASIC, along with additional digital programmability for improved robustness and flexibility. CHARMS is intended for use in future high-energy physics experiments that require high-resolution charge or light readout with shorter pulse peaking times.

47 OTHER INSTRUMENTATION

Evaluation of an event-driven 3FI ASIC for spectroscopic X-ray detection with synchrotron radiation

The novel design and evaluation on the NSLS-II beamline of the 3FI application-specific integrated circuit (ASIC) bump-bonded to a simple, planar, 2D segmented silicon sensor are presented. The ASIC was developed for full-field fluorescence spectral X-ray imaging (3FI). It is a small-scale prototype that features a square array of 32 × 32 pixels, and the size of the pixels is 100 µm × 100 µm. The ASIC was implemented in a 65 nm CMOS integrated circuit fabrication process. Each pixel incorporates a charge-sensitive amplifier, a shaping filter, a discriminator, a peak detector and a sample-and-hold circuit, allowing detection of events and storage of signal amplitudes. The system operates in a frameless event-driven readout mode, outputting analog values for threshold-triggered events, allowing high-speed multi-element X-ray fluorescence data acquisition. The 3FI ASIC achieves per-channel spectrometric performance at a power consumption of only 200 µW per pixel, with nearly all dissipation confined to the analog front-end. An energy resolution is measured at the level of 308 eV full width at half-maximum (FWHM) at 8.04 keV (Cu Kα), and 138 eV FWHM at 3.69 keV (Ca Kα). This per-pixel capability makes the prototype suitable for in situ trace element microanalysis in biological and environmental studies. Moreover, the frameless architecture of the detector is designed to address limitations of conventional X-ray fluorescence microscopy, which typically requires mechanical scanning, by enabling continuous high-throughput data acquisition in future full-field implementations.

47 OTHER INSTRUMENTATION

Small Microprocessor for ASIC or FPGA Implementation

A small microprocessor, suitable for use in applications in which high reliability is required, was designed to be implemented in either an application-specific integrated circuit (ASIC) or a field-programmable gate array (FPGA). The design is based on commercial microprocessor architecture, making it possible to use available software development tools and thereby to implement the microprocessor at relatively low cost. The design features enhancements, including trapping during execution of illegal instructions. The internal structure of the design yields relatively high performance, with a significant decrease, relative to other microprocessors that perform the same functions, in the number of microcycles needed to execute macroinstructions. The problem meant to be solved in designing this microprocessor was to provide a modest level of computational capability in a general-purpose processor while adding as little as possible to the power demand, size, and weight of a system into which the microprocessor would be incorporated. As designed, this microprocessor consumes very little power and occupies only a small portion of a typical modern ASIC or FPGA. The microprocessor operates at a rate of about 4 million instructions per second with clock frequency of 20 MHz.

Kleyner, Igor

VLSI technology for smaller, cheaper, faster return link systems

Very Large Scale Integration (VLSI) Application-specific Integrated Circuit (ASIC) technology has enabled substantially smaller, cheaper, and more capable telemetry data systems. However, the rapid growth in available ASIC fabrication densities has far outpaced the application of this technology to telemetry systems. Available densities have grown by well over an order magnitude since NASA's Goddard Space Flight Center (GSFC) first began developing ASIC's for ground telemetry systems in 1985. To take advantage of these higher integration levels, a new generation of ASIC's for return link telemetry processing is under development. These new submicron devices are designed to further reduce the cost and size of NASA return link processing systems while improving performance. This paper describes these highly integrated processing components.

Nanzetta, Kathy

Replication of Space-Shuttle Computers in FPGAs and ASICs

A document discusses the replication of the functionality of the onboard space-shuttle general-purpose computers (GPCs) in field-programmable gate arrays (FPGAs) and application-specific integrated circuits (ASICs). The purpose of the replication effort is to enable utilization of proven space-shuttle flight software and software-development facilities to the extent possible during development of software for flight computers for a new generation of launch vehicles derived from the space shuttles. The replication involves specifying the instruction set of the central processing unit and the input/output processor (IOP) of the space-shuttle GPC in a hardware description language (HDL). The HDL is synthesized to form a "core" processor in an FPGA or, less preferably, in an ASIC. The core processor can be used to create a flight-control card to be inserted into a new avionics computer. The IOP of the GPC as implemented in the core processor could be designed to support data-bus protocols other than that of a multiplexer interface adapter (MIA) used in the space shuttle. Hence, a computer containing the core processor could be tailored to communicate via the space-shuttle GPC bus and/or one or more other buses.

Ferguson, Roscoe C.

Predicting Lifetimes Of CMOS ASIC's From Test Data

Concise report discusses recent developments in use of semiempirical mathematical models to predict rates of failure and operating lifetimes of complementary metal oxide/semiconductor (CMOS) application-specific integrated circuits (ASIC's). Each model represents specific mechanism of failure. Once failure mechanisms and models relevant to given ASIC chosen, adjustable parameters in models fitted to life-test data acquired from representative integrated-circuit structures on test coupons fabricated along with ASIC's. Then design parameters of ASIC's incorporated into models, and models yield lifetimes.

Buehler, Martin G.

A forward error correction technique using a high-speed, high-rate single chip codec

The authors describe an error-correction coding approach that allows operation in either burst or continuous modes at data rates of multiple hundreds of megabits per second. Bandspreading is low since the code rate is 7/8 or greater, which is consistent with high-rate link operation. The encoder, along with a hard-decision decoder, fits on a single application-specific integrated circuit (ASIC) chip. Soft-decision decoding is possible utilizing applique hardware in conjunction with the hard-decision decoder. Expected coding gain is a function of the application and is approximately 2.5 dB for hard-decision decoding at 10-5 bit-error rate with phase-shift-keying modulation and additive Gaussian white noise interference. The principal use envisioned for this technique is to achieve a modest amount of coding gain on high-data-rate, bandwidth-constrained channels. Data rates of up to 300 Mb/s can be accommodated by the codec chip. The major objective is burst-mode communications, where code words are composed of 32 n data bits followed by 32 overhead bits.

Boyd, R. W.

Improved On-Chip Measurement of Delay in an FPGA or ASIC

An improved design has been devised for on-chip-circuitry for measuring the delay through a chain of combinational logic elements in a field-programmable gate array (FPGA) or application-specific integrated circuit (ASIC). In the improved design, the delay chain does not include input and output buffers and is not configured as an oscillator. Instead, the delay chain is made part of the signal chain of an on-chip pulse generator. The duration of the pulse is measured on-chip and taken to equal the delay.

Chen, Yuan

An Offload NIC for NASA, NLR, and Grid Computing

This work addresses distributed data management and access dynamically configurable high-speed access to data distributed and shared over wide-area high-speed network environments. An offload engine NIC (network interface card) is proposed that scales at nX10-Gbps increments through 100-Gbps full duplex. The Globus de facto standard was used in projects requiring secure, robust, high-speed bulk data transport. Novel extension mechanisms were derived that will combine these technologies for use by GridFTP, bandwidth management resources, and host CPU (central processing unit) acceleration. The result will be wire-rate encrypted Globus grid data transactions through offload for splintering, encryption, and compression. As the need for greater network bandwidth increases, there is an inherent need for faster CPUs. The best way to accelerate CPUs is through a network acceleration engine. Grid computing data transfers for the Globus tool set did not have wire-rate encryption or compression. Existing technology cannot keep pace with the greater bandwidths of backplane and network connections. Present offload engines with ports to Ethernet are 32 to 40 Gbps f-d at best. The best of ultra-high-speed offload engines use expensive ASICs (application specific integrated circuits) or NPUs (network processing units). The present state of the art also includes bonding and the use of multiple NICs that are also in the planning stages for future portability to ASICs and software to accommodate data rates at 100 Gbps. The remaining industry solutions are for carrier-grade equipment manufacturers, with costly line cards having multiples of 10-Gbps ports, or 100-Gbps ports such as CFP modules that interface to costly ASICs and related circuitry. All of the existing solutions vary in configuration based on requirements of the host, motherboard, or carriergrade equipment. The purpose of the innovation is to eliminate data bottlenecks within cluster, grid, and cloud computing systems, and to add several more capabilities while reducing space consumption and cost. Provisions were designed for interoperability with systems used in the NASA HEC (High-End Computing) program. The new acceleration engine consists of state-ofthe- art FPGA (field-programmable gate array) core IP, C, and Verilog code; novel communication protocol; and extensions to the Globus structure. The engine provides the functions of network acceleration, encryption, compression, packet-ordering, and security added to Globus grid or for cloud data transfer. This system is scalable in nX10-Gbps increments through 100-Gbps f-d. It can be interfaced to industry-standard system-side or network-side devices or core IP in increments of 10 GigE, scaling to provide IEEE 40/100 GigE compliance.

Awrach, James