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Overflow sensor for cryogenic fluid vessels has been designed by winding electrical resistance element on porous tubular coil form. Form is positioned in overflow vent of cryogenic fluid vessel where it can differentiate vapor from liquid at same temperature.
A miniature, multi-channel, electronically scanned pressure measuring device uses electrostatically bonded silicon dies in a multielement array. These dies are bonded at specific sites on a glass, prepatterned substrate. Thermal data is multiplexed and recorded on each individual pressure measuring diaphragm. The device functions in a cryogenic environment without the need of heaters to keep the sensor at constant temperatures.
Normally, in order to characterize multilayer insulation installed onto a test tank, the boil-off of the tank is measured and then heat loads from structural and fluid penetrations are calculated from temperature measurements throughout the system. For the Structural Heat Intercept, Insulation, and Vibration Evaluation Rig testing, it was determined that this approach would have significant uncertainties (over 50%) and that another method was needed to characterize the heat load through the blanket. Heat flux sensors are widely used to measure heat loads and characterize insulation systems at room temperature, however, the heat fluxes measured are usually two orders of magnitude higher than high performance MLI. Three different heat flux sensors were initially checked out on a liquid hydrogen calorimeter. One was chosen for actual implementation and 20 sensors were ordered. Of those sensors, calibration was attempted on 7 of the sensors. The results from testing and calibration are discussed.
A miniature, multi-channel, electronically scanned pressure measuring device uses electrostatically bonded silicon dies in a multi-element array. These dies are bonded at specific sites on a glass, pre-patterned substrate. Thermal data is multiplexed and recorded on each individual pressure measuring diaphragm. The device functions in a cryogenic environment without the need of heaters to keep the sensor at constant temperatures.
Thermopiles measure ullage gas temperatures to within plus or minus 1.65 deg K between 20 and 300 deg K, and also serve as point liquid-level sensors. Thermopile technique measures smaller temperature differences by keeping the reference junctions inside the tank and near the temperature range of the measuring junction.
This invention teaches the fiber optic sensors temperature sensors for cryogenic temperature range with improved sensitivity and resolution, and method of making said sensors. In more detail, the present invention is related to enhancement of temperature sensitivity of fiber optic temperature sensors at cryogenic temperatures by utilizing nanomaterials with a thermal expansion coefficient that is smaller than the thermal expansion coefficient of the optical fiber but larger in absolute value than the thermal expansion coefficient of the optical fiber at least over a range of temperatures.
Liquid-level indicator, consisting of a diode heated by a resistor, allows simultaneous use of two or three of the liquids nitrogen, hydrogen, and helium. Operation depends on strong temperature-dependence of the forward resistance of a germanium diode and the difference between liquid and vapor in heat-transfer properties.
The Materials In Devices As Superconductors (MIDAS) spaceflight experiment is a NASA payload which launched in September 1996 on the Shuttle, and was transferred to the Mir Space Station for several months of operation. MIDAS was developed and built at NASA Langley Research Center (LaRC). The primary objective of the experiment was to determine the effects of microgravity and spaceflight on the electrical properties of high-temperature superconductive (HTS) materials. The thermal challenge on MIDAS was to maintain the superconductive specimens at or below 80 K for the entire operation of the experiment, including all ground testing and 90 days of spaceflight operation. Cooling was provided by a small tactical cryocooler. The superconductive specimens and the coldfinger of the cryocooler were mounted in a vacuum chamber, with vacuum levels maintained by an ion pump. The entire experiment was mounted for operation in a stowage locker inside Mir, with the only heat dissipation capability provided by a cooling fan exhausting to the habitable compartment. The thermal environment on Mir can potentially vary over the range 5 to 40 C; this was the range used in testing, and this wide range adds to the difficulty in managing the power dissipated from the experiment's active components. Many issues in the thermal design are discussed, including: thermal isolation methods for the cryogenic samples; design for cooling to cryogenic temperatures; cryogenic epoxy bonds; management of ambient temperature components self-heating; and fan cooling of the enclosed locker. Results of the design are also considered, including the thermal gradients across the HTS samples and cryogenic thermal strap, electronics and thermal sensor cryogenic performance, and differences between ground and flight performance. Modeling was performed in both SINDA-85 and MSC/PATRAN (with direct geometry import from the CAD design tool Pro/Engineer). Advantages of both types of models are discussed. Correlation of several models to ground testing and flight data (where available) is presented. Both SINDA and PATRAN models predicted the actual thermal performance of the experiment well, even without post-flight correlation adjustments of the models.
Our universe is most luminous at far-infrared and submillimeter wavelengths (100 GHz - 10 THz) after the Cosmic Microwave Background (CMB) radiation. This region of the electromagnetic spectrum provides critical tracers for the study of a wide range of astrophysical and planetary phenomena. This spectral range contains information on the origin of the planets, stars, galaxies, and clusters; the geometry and matter/energy content of the Universe, atmospheric constituents and dynamics of the planets and comets and tracers for global monitoring and the ultimate health of the Earth. Sensors at far-infrared and submillimeter wavelengths provide unprecedented sensitivity for astrophysical, planetary, and earth observing instruments. Very often, for a spaced based platform where the instruments are not limited by atmospheric losses and absorption, the overall instrument sensitivity is dictated by the sensitivity of the sensors themselves. Moreover, some of the cryogenic sensors at submillimeter wavelengths provide almost quantum-limited sensitivity. This paper provides an overview of the submillimeter-wave sensors and their performance and capabilities for space applications.
Cryogenic sensor errors in measuring transient temperature in cryogenic fluids
A pressure sensor is provided for cryogenic, high pressure applications. A highly doped silicon piezoresistive pressure sensor is bonded to a silicon substrate in an absolute pressure sensing configuration. The absolute pressure sensor is bonded to an aluminum nitride substrate. Aluminum nitride has appropriate coefficient of thermal expansion for use with highly doped silicon at cryogenic temperatures. A group of sensors, either two sensors on two substrates or four sensors on a single substrate are packaged in a pressure vessel.
Energy exchange mechanism of cryogenic sensor dynamic behavior, noting error sources
The design and validation of a dual polarization source for waveguide-coupled millimeter and sub-millimeter wave cryogenic sensors is presented. The thermal source is a waveguide mounted absorbing conical dielectric taper. The absorber is thermally isolated with a kinematic suspension that allows the guide to be heat sunk to the lowest bath temperature of the cryogenic system. This approach enables the thermal emission from the metallic waveguide walls to be subdominant to that from the source. The use of low thermal conductivity Kevlar threads for the kinematic mount effectively decouples the absorber from the sensor cold stage. Hence, the absorber can be heated to significantly higher temperatures than the sensor with negligible conductive loading. The kinematic suspension provides high mechanical repeatability and reliability with thermal cycling. A 33-50 GHz blackbody source demonstrates an emissivity of 0.999 over the full waveguide band where the dominant deviation from unity arises from the waveguide ohmic loss. The observed thermal time constant of the source is 40 s when the absorber temperature is 15 K. The specific heat of the lossy dielectric MF-117 is well approximated by Cv(T) = 0.12 T(exp 2.06) mJ/g/K between 3.5 K and 15 K.
The operation principles of sorption cryogenic refrigeration are discussed. Sorption refrigerators have virtually no wear-related moving parts, have negligible vibration, and offer extremely long life (at least ten years), making it possible to obtain efficient, long life and low vibration cooling to as low as 7 K for cryogenic sensors. The physisorption and chemisorption systems recommended for various cooling ranges down to 7 K are described in detail. For long-life cooling at 4-5 K temperatures, a hybrid chemisorption-mechanical refrigeration system is recommended.
This final report describes the R&D activities and projects conducted for NASA under the 6-year NASA Hydrogen Research at Florida Universities grant program. Contained within this report are summaries of the overall activities, one-page description of all the reports funded under this program and all of the individual reports from each of the 29 projects supported by the effort. The R&D activities cover hydrogen technologies related to production, cryogenics, sensors, storage, separation processes, fuel cells, resource assessments and education. In the span of 6 years, the NASA Hydrogen Research at Florida Universities program funded a total of 44 individual university projects, and employed more than 100 faculty and over 100 graduate research students in the six participating universities. Researchers involved in this program have filed more than 20 patents in all hydrogen technology areas and put out over 220 technical publications in the last 2 years alone. This 6 year hydrogen research program was conducted by a consortium of six Florida universities: Florida International University (FIU) in Miami, Florida State University (FSU) and Florida A&M University (FAMU) in Tallahassee, University of Central Florida (UCF) in Orlando, University of South Florida (USF) in Tampa, and University of Florida (UF) in Gainesville. The Florida Solar Energy Center (FSEC) of the University of Central Florida managed the research activities of all consortium member universities except those at the University of Florida. This report does not include any of the programs or activities conducted at the University of Florida, but can be found in NASA/CR-2008-215440-PART 1-3.
This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.
A cryogenic sensor maintains calibration at approximately equal to 4.2 K to better than 2 mK (< 0.5 percent resistance repeatability) after being heated to approximately equal 40 K with approximately equal 0.5 W power. The sensor withstands 4 W power dissipation when immersed in liquid nitrogen with verified resistance reproducibility of, at worst, 1 percent. The sensor maintains calibration to 0.1 percent after being heated with 1-W power at approximately equal 77 K for a period of 48 hours. When operated with a readout scheme that is capable of mitigating the self-heating calibration errors, this and similar sensors can be used for precision (mK stability) temperature control without the need of separate heaters and associated wiring/cabling.
A pressure sensor is provided for cryogenic, high pressure applications. A highly doped silicon piezoresistive pressure sensor is bonded to a silicon substrate in an absolute pressure sensing configuration. The absolute pressure sensor is bonded to an aluminum nitride substrate. Aluminum nitride has appropriate coefficient of thermal expansion for use with highly doped silicon at cryogenic temperatures. A group of sensors, either two sensors on two substrates or four sensors on a single substrate are packaged in a pressure vessel.