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At least 37 records · Page 2

Perovskite Catalysts for Pure-Water-Fed Anion-Exchange-Membrane Electrolyzer Anodes: Co-design of Electrically Conductive Nanoparticle Cores and Active Surfaces

Anion-exchange-membrane water electrolyzers (AEMWEs) are a possible low-capital-expense, efficient, and scalable hydrogen-production technology with inexpensive hardware, earth-abundant catalysts, and pure water. However, pure-water-fed AEMWEs remain at an early stage of development and suffer from inferior performance compared with proton-exchange-membrane water electrolyzers (PEMWEs). One challenge is to develop effective non-platinum-group-metal (non-PGM) anode catalysts and electrodes in pure-water-fed AEMWEs. We show how LaNiO3-based perovskite oxides can be tuned by cosubstitution on both A- and B-sites to simultaneously maintain high metallic electrical conductivity along with a degree of surface reconstruction to expose a stable Co-based active catalyst. The optimized perovskite, Sr0.1La0.9Co0.5Ni0.5O3, yielded pure-water AEMWEs operating at 1.97 V at 2.0 A cm-2 at 70 °C with a pure-water feed, thus illustrating the utility of the catalyst design principles.

Zhai, Tingting

Additively-manufactured Al-0.3Zr-0.2Ce-0.2Cu alloy with high creep resistance and electrical conductivity

Here, a new, solute-lean Al-0.3Zr-0.2Ce-0.2Cu (wt.%) alloy is developed for additive manufacturing that overcomes the classical tradeoff between conductivity and creep resistance. The rapid-cooling-enabled supersaturation of Zr, and its uniform distribution in α-Al matrix, along with formation of submicron (Ce,Cu)-rich intermetallic particles on solidification lead to unusually high creep resistance at 200 °C. Near-zero secondary creep rates are achieved up to the alloy yield stress (YS) of 65 MPa at 200 °C in as-fabricated state. The Zr-solute-induced dislocation-climb suppression mechanism underlying this improvement also restricts dynamic recovery above YS, as noted from appreciable primary creep and its transitioning to near-zero secondary creep rates. A combination of relatively coarse, epitaxially-grown α-Al grains, low Zr concentration in α-Al, and the impurity-scavenging effect of Ce to purify α-Al matrix produces high electrical conductivity of ∼48 %IACS. Aging precipitation of L1 2 -Al 3 Zr nanoprecipitates doubles the YS (to ∼150 MPa) at room temperature and increases alloy conductivity to ∼58 %IACS, but loss of solid-solution Zr out of α-Al matrix leads to activation of dislocation climb, degrading the creep properties as compared to the supersaturated Al-Zr solid solution in the as-fabricated state. Compared to L1 2 -Al 3 Zr nanoprecipitates, submicron (Ce,Cu)-rich particles formed on solidification are more effective at impeding dislocation climb, producing a threshold stress for dislocation creep of ∼ 50 MPa at 200 °C. The new alloy design concepts, especially solute-induced dislocation-climb suppression for creep resistance, explored here may pave way for the design of new metallic alloys for thermal/electrical conductors and other high-temperature applications.

Additive Manufacturing

Guided combinatorial synthesis and automated characterization expedites the discovery of hard, electrically conductive Pt x Au 1-x films

Sputter-deposited Pt-Au thin films have been reported to develop a hard, stable, nanocrystalline structure, yet little is known about how these characteristics vary with Pt x Au 1-x composition and process conditions. Toward this end, this document describes an extensive, combinatorial Pt-Au thin film library including characterized film compositions, structure, and properties. Complemented by kinematic Monte Carlo simulations of codeposition, a broad range of Pt x Au 1-x compositions (from x ~ 0.02 to 0.93) was first established by sputtering with varied magnetron powers and gun tilt angles. Further, the produced films were subsequently interrogated using automated nanoindentation, x-ray reflectivity, x-ray diffraction, atomic force microscopy, surface profilometry, four-point probe sheet resistance techniques, and wavelength dispersive spectroscopy in order to determine how hardness, modulus, density, surface roughness, structure, and resistivity vary with film stoichiometry and process parameters. Combinatorial films displayed an assortment of properties with the hardness of some films exceeding values reported previously for this material system. High hardness, high modulus, and low resistivity were generally attained when using increased deposition energy and reduced angle-of-incidence processes. Overall, the research identified promising, new Pt x Au 1-x compositions for future study and pinpointed strategies for improved deposition.

36 MATERIALS SCIENCE

Molecular dynamics simulation of hydrodynamic transport coefficients in plasmas

Molecular dynamics simulations are used to calculate transport coefficients in a two-component plasma interacting through a repulsive Coulomb potential. The thermal conductivity, electrical conductivity, electrothermal coefficient, thermoelectric coefficient, and shear viscosity are computed using the Green–Kubo formalism over a broad range of Coulomb coupling strength, 0.01 ≤ Γ ≤ 140. Emphasis is placed on testing standard results of the Chapman–Enskog solution in the weakly coupled regime (Γ ≪ 1) using these first-principles simulations. As expected, the results show good agreement for Γ ≲ 0.1. However, this agreement is only possible if careful attention is paid to the definitions of linear constitutive relations in each of the theoretical models, a point that is often overlooked. For example, the standard Green–Kubo expression for thermal conductivity is a linear combination of thermal conductivity, electrothermal, and thermoelectric coefficients computed in the Chapman–Enskog formalism. Meaningful results for electrical conductivity are obtained over the full range of coupling strengths explored, but it is shown that potential and virial components of the other transport coefficients diverge in the strongly coupled regime (Γ ≫ 1). In this regime, only the kinetic components of the transport coefficients are meaningful for a classical plasma.

Electrical conductivity

Enhancing the cooling performance of thermocouples: a power-constrained topology optimization procedure

Abstract Heat pumping through thermoelectric devices has many advantages over traditional cooling. However, their current efficiency is a limiting factor in their implementation. In this paper, we approach the non-convex topology optimization of thermoelectrical elements for cooling applications through the method of moving asymptotes (MMA) to improve their cooling capabilities per watt usage. The optimization problem is defined for a given power budget, aiming for the minimum temperature with a known heat pumping need. The introduction of power as a constraint justifies the introduction of the voltage gradient across the thermocouple as a design variable to maintain the thermoelectrical device in its optimum power-to-heat extraction ratio. To better understand the convergence of this non-convex problem, we present a two-variable analytical thermoelectric optimization model. This example provides information on how to select the penalty parameters used to scale the three material coefficients involved in the problem to obtain lower objective values and better convergence using MMA. The analytical model shows the non-convexity of the problem and provides the recommendation to use penalization coefficients of the form $$p_k=p_{\sigma }>p_{\alpha }=1$$ p k = p σ > p α = 1 for the thermal conductivity, electrical conductivity, and Seebeck coefficients. We tested these penalization coefficients through optimizations of a model based on the 1MC10-031 commercial thermoelectric-cooler (TEC) using the finite element method (FEM). These penalization coefficients provided local minima without the need for volume constraints. With this procedure, we found designs that provided temperatures close to 10 degrees lower using 60% less semiconductor material volume compared to the initial design.

Gutiérrez, G. Reales

Charged particle transport coefficient challenges in high energy density plasmas

High energy density physics (HEDP) and inertial confinement fusion (ICF) research typically relies on computational modeling using radiation-hydrodynamics codes in order to design experiments and understand their results. These tools, in turn, rely on numerous charged particle transport and relaxation coefficients to account for laser energy absorption, viscous dissipation, mass transport, thermal conduction, electrical conduction, non-local ion (including charged fusion product) transport, non-local electron transport, magnetohydrodynamics, multi-ion-species thermalization, and electron-ion equilibration. In many situations, these coefficients couple to other physics, such as imposed or self-generated magnetic fields. Furthermore, how these coefficients combine are sensitive to plasma conditions as well as how materials are distributed within a computational cell. Uncertainties in these coefficients and how they couple to other physics could explain many of the discrepancies between simulation predictions and experimental results that persist in even the most detailed calculations. This paper reviews the challenges faced by radiation-hydrodynamics in predicting the results of HEDP and ICF experiments with regard to these and other physics models typically included in simulation codes.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY

Utah FORGE 5-2419: Temperature Testing of Proppants for EGS and Stimulation of Electromagnetic Fracture Mapping Using Electrically-Conducive Proppants - 2024 Annual Workshop Presentation

This is a presentation on the Temperature Testing of Proppants for EGS and Stimulation of Electromagnetic Fracture Mapping Using Electrically-Conducive Proppants by Stevens Institute of Technology, presented by Cheng Chen. This video slide presentation discusses well controlled laboratory experiments testing the high-temperature performance of electrically-conductive and non-electrically-conductive proppants in maintaining fractures hydraulic and electrical conductivities to understand and quantify the thermal-hydrologic-mechanical-chemical mechanisms that regulate the observed behaviors. This will be tested using proppant/fracture imaging via borehole electromagnetic measurements. This presentation was featured in the Utah FORGE R&D Annual Workshop on August 15, 2024.

15 GEOTHERMAL ENERGY

A computational study of the effects of graphene additions on electrical properties of polycrystalline copper

The addition of graphene has recently shown promise as a route for the significant improvement of the bulk electrical properties of metallic materials. Here, we explore the effects these additions have on the net electrical conductivity of fabricated copper-graphene (Cu-Gr) nanocomposites as a function of grain structure and grain boundary properties. Synthetic 3D microstructures were generated to represent polycrystalline copper with different average grain diameters and twinned grain boundary fractions. Then, the Poisson equation of electrical transport was solved using a finite difference method in order to predict the net electrical conductivity of each microstructure. In this context, the potential effect of graphene on the conductivity of the composite was evaluated as a function of the number of affected grain boundaries. The results of these calculations indicate that 1.) as supported by literature, net electrical conductivity decreases with decreasing grain size, 2.) the presence of twinned grain boundaries results in smaller loss of conductivity than would otherwise be expected, and 3.) the presence of graphene on the grain boundaries can be expected to lead to improvements in net electrical conductivity. However, we also find that 4.) when the Cu grain structure becomes sufficiently refined, the addition of graphene could conceivably result in significant improvements in electrical conductivity over and above coarse-grained Cu. It is estimated from our calculations that, assuming microstructures with average grain sizes between 100 nm and 100 μm and graphene conductivity 1000 to 10,000 that of a typical Cu grain boundary, an improvement in electrical conductivity of approximately 17% over that of bulk Cu may be attainable. Therefore, by performing this study we suggest a possible route for the improvement of Cu electrical properties through the addition of graphene.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH

Andrew Dieringer Poster for review

Silicon carbide has been identified as a useful material for nuclear application due to its heat resistance, low neutron absorbing cross-section, chemical inertness, and its rigidity as a structural material. These properties make it very favorable for high temperature environments such as in TRISO fuel and advanced reactor designs. Treatments such as n-doping, where carrier atoms are added to increase the number of free electrons, are expected to further improve properties such as thermal conductivity and electrical resistivity. Due to the high amount of neutron interactions in a nuclear reactor, it is expected that silicon carbide used in a reactor will be passively n-doped via transmutation. Studying the effects of n-doping in silicon carbide can help us better understand how the material will operate under real world conditions. We have found that n-doping the SiC increases both thermal and electrical conductivity, providing positive feedback under reactor usage. Previously it had been thought that under reactor conditions material properties of SiC could only degrade due to defects caused by neutron interactions. This study shows that transmutation doping can help to counteract and slow this process. This research shows that SiC can be used in nuclear reactor components contrasting with more costly and complicated alternative materials.

36 - MATERIALS SCIENCE

Vertical z-axis discontinuous carbon fibers for improved lightning strike performance of continuous fiber-reinforced polymer composites

Effective lightning strike protection for critical aerospace and wind applications requires high electrical conductivity to dissipate current efficiently. However, polymer matrix composites face a challenge due to their inherently insulating nature. While conventional carbon fiber-reinforced composites (CFRP) exhibit electrical conductivity in the planar direction, achieving through-thickness conductivity remains an ongoing challenge. In this work, we have undertaken the fabrication of CFRP interleaved with vertically oriented carbon fibers (Z-fiber) to impart higher electrical conductivity along the thickness direction. Two Z-fiber composite variations are prepared: Z-1 with a single layer of Z-fiber and Z-5 with five interleaved layers and compared with no Z-fiber layer (Z-0) composite. The composite panels were subjected to lab-scale lightning strike tests with a current magnitude of 100 kA. To emulate real-world service conditions, an aerospace-grade paint coating was applied to the composite laminates. Comparative analysis shows Z-1 reduces damage diameter to ∼22 mm compared to Z-0 (∼26 mm), while Z-5 exhibits the least damage (∼16.7 mm), confirmed by optical microscopy. Z-5 demonstrates nine times higher through-thickness electrical conductivity than Z-0, reducing electrical anisotropy substantially. Thermal-electric finite element damage modeling predicts surface damage within 6% of experimental values for both Z-0 and Z-5 composites. Flexural tests post-lightning reveal Z-5 retains 66% flexural strength and 86% modulus, significantly better than Z-0, which retains less than 40% for both properties. This study highlights the efficacy of Z-fiber composites in lightning strike protection, offering improved through-thickness conductivity and mechanical property retention.

36 MATERIALS SCIENCE

A high strength Al-2Ni-0.5Zr conductor alloy fabricated via laser powder bed fusion

There is a current need for new aluminum alloy design strategies to target applications requiring high strength and conductivity with reductions in mass. A new lightweight Al-2Ni-0.5Zr (wt. %) conductor alloy was fabricated using laser powder bed fusion. A design of experiments probed the alloy's solidification cracking susceptibility. It was observed that solidification cracking was generally reduced with fast scan speeds, above 1500 mm/s, and smaller hatch spacings. The different cooling rates throughout the melt pool produced a heterogeneous distribution of cellular and equiaxed Al 3 Ni precipitates in the as-printed alloy. Additionally, the rapid solidification characteristic of laser powder bed fusion created a super-saturated Zr solid solution. An aging heat treatment at 375 °C for 24 h imparted strengthening through the precipitation of L1 2 -Al 3 Zr nanoprecipitates, which counteracted the softening caused by the fragmentation and coarsening of Al 3 Ni precipitates. The yield strength increased from 138 MPa in the as-printed condition to 168 MPa after aging, while the ductility remained constant at ∼21%. The aging treatment simultaneously increased the electrical conductivity from 40.8% IACS (International Annealed Copper Standard) to 53.5% IACS. Modeling of the strengthening mechanisms and electrical conductivity contributions rationalized the simultaneous increase in strength and conductivity upon aging. Furthermore, the strengthening efficacy of the Al 3 Ni and L1 2 -Al 3 Zr precipitates, combined with the low Ni and Zr solubility in the FCC Al matrix, facilitated both high strength and electrical conductivity. Overall, the combination of strength and electrical conductivity positions this alloy as a suitable choice for additively manufactured lightweight conductors.

Additive manufacturing