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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

High Energy ERLs for Electron Cooling

Future electron-ion colliders such as the recently approved eRHIC collide high-intensity ion beams with high current electron beams. The electron beams take advantage of synchrotron radiation to damp emittances but the ion beams must be cooled via some beam-cooling mechanism, including electron cooling. The ion energies are typically a few hundreds of GeV per nucleon. At this energy, a DC cooler powered by an electrostatic accelerator, the preferred cooling approach on existing machines, is not feasible. An ERL, in principle, can provide the high current and brightness to cool these high-brightness ion beams. The beam quality requirements are much different from previous ERLs designs used for FELs. The cooling bunch must be very long to match the ion beam and the relative energy spread must be very small. Incoherent cooling can be enhanced with magnetized beams, but the magnetization must be maintained throughout the ERL. An alternate cooling mechanism, the so-called Coherent Electron Cooling, is, in principle, stronger and can be done with non-magnetized beams. We will present two applications of an ERL to high energy electron cooling and describe some of the technical challenges that must be overcome to operate such an ERL

Benson, Stephen↗
DOE OSTI2018

Dispersive Electron Cooling for JLEIC

JLEIC is the electron ion collider under design at Jefferson Lab, which will provide a luminosity up to 1034 cm-2s-1. To reach the high luminosity, short ion and electron bunches with high charge density colliding in high frequency are proposed in JLEIC design. The high charge density of the ion beam leads to strong intrabeam scattering effect, which enlarges the ion beam emittance and ruins the luminosity if not mitigated. Magnetized electron cooling is implemented to overcome the intrabeam scattering effect and to reduce or maintain the ion beam emittance. In this paper, we discuss the redistribution of the cooling effects in the longitudinal and the transverse directions by introducing the dispersion of the ion beam in the cooling section. When the charge density of the cooling electron beam varies, the dispersion of the ion beam leads to an increase of the transverse cooling rate and a reduction of the longitudinal cooling rate, while the total decrement of the Courant-Snyder invariant of the ion beam increases. Both theoretical analysis and numerical calculation are presented.

Zhang, He↗
DOE OSTI2016

Modular jet impingement assemblies with passive and active flow control for electronics cooling

Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

42 ENGINEERING↗
DOE OSTI2021

Cooling and diffusion rates in coherent electron cooling concepts

We present analytic cooling and diffusion rates for a simplified model of coherent electron cooling (CEC), based on a proton energy kick at each turn. This model also allows to estimate analytically the rms value of electron beam density fluctuations in the "kicker" section. Having such analytic expressions should allow for better understanding of the CEC mechanism, and for a quicker analysis and optimization of main system parameters. Our analysis is applicable to any CEC amplification mechanism, as long as the wake (kick) function is available.

43 PARTICLE ACCELERATORS↗
DOE OSTI2016

Development of the electron cooling simulation program for JLEIC

In the JLab Electron Ion Collider (JLEIC) project the traditional electron cooling technique is used to reduce the ion beam emittance at the booster ring, and to compensate the intrabeam scattering effect and maintain the ion beam emittance during collision at the collider ring. A new electron cooling process simulation program has been developed to fulfill the requirements of the JLEIC electron cooler design. The new program allows the users to calculate the electron cooling rate and simulate the cooling process with either DC or bunched electron beam to cool either coasting or bunched ion beam. It has been benchmarked with BETACOOL in aspect of accuracy and efficiency. In typical electron cooling process of JLEIC, the two programs agree very well and we have seen a significant improvement of computational speed using the new one. Being adaptive to the modern multicore hardware makes it possible to further enhance the efficiency for computationally intensive problems. The new program is being actively used in the electron cooling study and cooler design for JLEIC. We will present our models and some simulation results in this paper.

Zhang, He↗
DOE OSTI2017

Simulation Study on JLEIC High Energy Bunched Electron Cooling

In the Jefferson Lab (JLab) Electron Ion Collider (JLEIC) project the traditional electron cooling technique is used to reduce the ion beam emittance at the booster ring, and to compensate the intrabeam scattering effect and maintain the ion beam emittance during the collision at the collider ring. Different with other electron coolers using DC electron beam, the proposed electron cooler at the JLEIC ion collider ring uses high energy bunched electron beam, provided by an ERL. In this paper, we report the new electron cooling simulation program developed at JLab to fulfil specific simulation requirements of JLEIC and some recent simulation study on how the electron cooling rate will be affected by the bunched electron beam properties, such as the correlation between the longitudinal position and momentum, the bunch size, and the Larmor emittance.

Zhang, He↗
DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

36 MATERIALS SCIENCE↗
DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2018

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2024

Collisional simulations of the modulator section in coherent electron cooling

The first section of any coherent electron cooling (CeC) system is the modulator, where the density of the electron beam is modulated by the copropagating ion beam. This density modulation is a result of Coulomb collisions between the individual particles of the two beams. The pairwise, stochastic part of the interactions impacts the overall performance of the CeC process. We present the first simulations of the density modulations of the electron beams from a collisional picture of the dynamics, considering the proof-of-principle CeC experiments at Brookhaven National Laboratory. These simulations were performed using PHAD, which is the first efficient, large-scale collisional numerical method in beam physics that we have previously developed and benchmarked. Realistic beam distributions and external fields have been optimized to provide strong modulation signals necessary for variations of coherent electron cooling systems. Cooling performance limits and potential collisionless simulation pitfalls are pointed out. Published by the American Physical Society 2024

43 PARTICLE ACCELERATORS↗
DOE OSTI2025

Machine protection system for coherent electron cooling experiment

The coherent electron cooling (CeC) experiment employs a 15 MeV electron beam with up to a few milliamperes current which is capable of destroying the vacuum equipment or intercepting beam diagnostics. The high-current beam can be delivered to two different dumps. RF systems include normal conducting and superconducting cavities which also require protection from abnormal conditions. In this paper, we describe in detail the design and operation of the machine protection system for the CeC accelerator.

43 PARTICLE ACCELERATORS↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

42 ENGINEERING↗
DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗
DOE OSTI2021

Demonstration of Electron Cooling using a Pulsed Beam from an Electrostatic Electron Cooler

Electron cooling continues to be an invaluable technique to reduce and maintain the emittance in hadron storage rings in cases where stochastic cooling is inefficient and radiative cooling is negligible. Extending the energy range of electron coolers beyond what is feasible with the conventional, electrostatic approach necessitates the use of RF fields for acceleration and, thus, a bunched electron beam. To experimentally investigate how the relative time structure of the two beams affects the cooling properties, we have set up a pulsed-beam cooling device by adding a synchronized pulsing circuit to the conventional electron source of the CSRm cooler at Institute of Modern Physics *. We show the effect of the electron bunch length and longitudinal ion focusing strength on the temporal evolution of the longitudinal and transverse ion beam profile and demonstrate the detrimental effect of timing jitter as predicted by theory and simulations. Compared to actual RF-based coolers, the simplicity and flexibility of our setup will facilitate further investigations of specific aspects of bunched cooling such as synchro-betatron coupling and phase dithering.

Bruker, M. W.↗
DOE OSTI2021

Demonstration of Electron Cooling using a Pulsed Beam from an Electrostatic Electron Cooler

Electron cooling continues to be an invaluable technique to reduce and maintain the emittance in hadron storage rings in cases where stochastic cooling is inefficient and radiative cooling is negligible. Extending the energy range of electron coolers beyond what is feasible with the conventional, electrostatic approach necessitates the use of RF fields for acceleration and, thus, a bunched electron beam. To experimentally investigate how the relative time structure of the two beams affects the cooling properties, we have set up a pulsed-beam cooling device by adding a synchronized pulsing circuit to the conventional electron source of the CSRm cooler at Institute of Modern Physics *. We show the effect of the electron bunch length and longitudinal ion focusing strength on the temporal evolution of the longitudinal and transverse ion beam profile and demonstrate the detrimental effect of timing jitter as predicted by theory and simulations. Compared to actual RF-based coolers, the simplicity and flexibility of our setup will facilitate further investigations of specific aspects of bunched cooling such as synchro-betatron coupling and phase dithering.

Bruker, M. W.↗