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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Defect Detection Model Development for Large Scale Thermoplastic Printing

Large-format additive manufacturing (LFAM) offers several advantages, including high throughput, cost-effective pellet-fed extrusion, and the capability to produce large-scale structures. The main pain points of LFAM include start and stops during the printing process, warpage, long layer times that lead to bead freezing, and bead separation due to shrinkage. These issues can lead to overfill, underfill and buildup of material in different sections of a print. This can lead to hidden defects embedded within the printed layers, or even ultimate failure of the printed structure. This ensures these defects can only be identified through nondestructive testing (NDT) inspection methods after printing, which can be timely and costly. Aligned Vision work specializes in 2D projectors with visual inspection systems and machine learning. Traditionally system is used for composite layup and layup inspections. In this work we used the LFAM system at Oak Ridge National Laboratory to create defect rich samples. The Aligned Vision inspection system then performed in-situ monitoring of the print process after each part was printed. This in-situ vision inspection system was used to develop a layer-by-layer inspection model that looks for overfill, underfill, and the buildup of defects using only a camera-based vision system. This leads to the assurance of high-quality production components.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Thermal Analysis of Large Area Additive Manufacturing Resistance Heating Composites for Out of Oven/Autoclave Applications

Additive Manufacturing (AM) of carbon fiber (CF) reinforced composite has received growing attention because of the design flexibility, superior mechanical properties, improved thermal properties, and weight reduction. Autoclave tooling was proven to be a successful application for large scale AM technology. The capital cost, and cost associated with heating, and cycle time in a conventional autoclave process is relatively high. Thus, an innovative design of AM mold with an efficient heating scheme is essential. This study represents an innovative method of the resistive heating of composite molds which does not require a room size oven for heating during the curing processing. Therefore, it has the potential to reduce the operating cost drastically. For the design validation and feasibility study, we performed a numerical analysis of the wire embedded and AM mold parts. The goal of this study is to determine and optimize the thermal behavior of the printed mold with embedded wire technology. It is anticipated that the larger distance between the embedded wires along the printing direction (z-direction) increase the cold spot, on the other hand, a close distance of the wire can create the unwanted localize heating, thus melting. Constant thermal properties of the 20 wt.% short CF reinforced acrylonitrile butadiene styrene (ABS) was used for the simulation purpose. Thermal characterization was set to 100°C to avoid the thermal deformation or bulging on the part surface.

billah, Kazi↗
DOE OSTI2020

Thermal Analysis of Large Area Additive Manufacturing Resistance Heating Composites for Out of Oven/Autoclave Applications

Additive Manufacturing (AM) of carbon fiber (CF) reinforced composite has received growing attention because of the design flexibility, superior mechanical properties, improved thermal properties, and weight reduction. Autoclave tooling was proven to be a successful application for large scale AM technology. The capital cost, and cost associated with heating, and cycle time in a conventional autoclave process is relatively high. Thus, an innovative design of AM mold with an efficient heating scheme is essential. This study represents an innovative method of the resistive heating of composite molds which does not require a room size oven for heating during the curing processing. Therefore, it has the potential to reduce the operating cost drastically. For the design validation and feasibility study, we performed a numerical analysis of the wire embedded and AM mold parts. The goal of this study is to determine and optimize the thermal behavior of the printed mold with embedded wire technology. It is anticipated that the larger distance between the embedded wires along the printing direction (z-direction) increase the cold spot, on the other hand, a close distance of the wire can create the unwanted localize heating, thus melting. Constant thermal properties of the 20 wt.% short CF reinforced acrylonitrile butadiene styrene (ABS) was used for the simulation purpose. Thermal characterization was set to 100°C to avoid the thermal deformation or bulging on the part surface.

billah, Kazi↗
DOE OSTI2020

Thermal Analysis of Large Area Additive Manufacturing Resistance Heating Composites for Out of Oven/Autoclave Applications

Additive Manufacturing (AM) of carbon fiber (CF) reinforced composite has received growing attention because of the design flexibility, superior mechanical properties, improved thermal properties, and weight reduction. Autoclave tooling was proven to be a successful application for large scale AM technology. The capital cost, and cost associated with heating, and cycle time in a conventional autoclave process is relatively high. Thus, an innovative design of AM mold with an efficient heating scheme is essential. This study represents an innovative method of the resistive heating of composite molds which does not require a room size oven for heating during the curing processing. Therefore, it has the potential to reduce the operating cost drastically. For the design validation and feasibility study, we performed a numerical analysis of the wire embedded and AM mold parts. The goal of this study is to determine and optimize the thermal behavior of the printed mold with embedded wire technology. It is anticipated that the larger distance between the embedded wires along the printing direction (z-direction) increase the cold spot, on the other hand, a close distance of the wire can create the unwanted localize heating, thus melting. Constant thermal properties of the 20 wt.% short CF reinforced acrylonitrile butadiene styrene (ABS) was used for the simulation purpose. Thermal characterization was set to 100°C to avoid the thermal deformation or bulging on the part surface.

billah, Kazi↗
NASA NTRS2022

Fabrication and Testing of a Novel Ceramic-Based Additively Manufactured Humidity Sensor

A material capable of detecting minute changes in ambient humidity via a change in its electrical properties is critical to enabling the success of vapor-sensitive components on Earth and abroad. Manufacturing of these hydrophilic materials currently follows an extensive process of heat treating focused on removing the solvent and organic vehicle. This research aims to reduce the complexity of manufacturing these novel sensors by eliminating the high-temperature (>850 °C) processing stages. A method based on printing a polymer embedded with hydrophilic nanoparticles is accomplished through selected additively manufactured methods. This research branches into the elimination of physical spare parts with the ability to print highly sensitive in-situ sensors, reducing the environmental footprint in space-critical environments like the International Space Station (ISS).

sensor↗
DOE OSTI2024

Spot pattern welding scanning strategy for sensor embedding and residual stress reduction in laser-foil-printing additive manufacturing

Here, this paper aims to present spot pattern welding (SPW) as a scanning strategy for laser-foil-printing (LFP) additive manufacturing (AM) in place of the previously used continuous pattern welding (CPW) (line-raster scanning). The SPW strategy involves generating a sequence of overlapping spot welds on the metal foil, allowing the laser to form dense and uniform weld beads. This in turn reduces thermal gradients, promotes material consolidation and helps mitigate process-related risks such as thermal cracking, porosity, keyholing and Marangoni effects. 304L stainless steel (SS) feedstock is used to fabricate test specimens using the LFP system. Imaging techniques are used to examine the melt pool dimensions and layer bonding. In addition, the parts are evaluated for residual stresses, mechanical strength and grain size. Compared to CPW, SPW provides a more reliable heating/cooling relationship that is less dependent on part geometry. The overlapping spot welds distribute heat more evenly, minimizing the risk of elevated temperatures during the AM process. In addition, the resulting dense and uniform weld beads contribute to lower residual stresses in the printed part. To the best of the authors’ knowledge, this is the first study to thoroughly investigate SPW as a scanning strategy using the LFP process. In general, SPW presents a promising strategy for securing embedded sensors into LFP parts while minimizing residual stresses.

36 MATERIALS SCIENCE↗
DOE OSTI2022

A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter

This article presents the design and analysis of a double-side-cooled printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge package with low loop inductances and an integrated gate driver. The 1.2 kV SiC MOSFET dies used in the half-bridge package are embedded in the PCB using AT&S's patented technique. The dies are cooled and electrically connected to traces in the PCB through copper-filled microvias. The design methodology accounts for both electrical and thermal performance, limiting the power-loop inductance to 2.3 nH and the maximum package temperature to less than the 175 °C limit. The integration of the gate drive circuitry allows for a high power density and 2.2 nH gate-loop inductances. At 0.12 K/W, the measured junction-to-case thermal resistance with double-sided cooling is 57% lower than that of a TO-247 package. Under similar operating conditions, the PCB-embedded half-bridge package also achieves a 5.6 times lower voltage overshoot and a 0.5% higher peak efficiency than a TO-247-based half-bridge. This article reports the first demonstration of PCB-embedded 1.2 kV SiC MOSFET packages in buck, boost, and ac–dc converters. Furthermore, the prototype three-phase ac–dc converter for an electric vehicle on-board charger is composed of six PCB-embedded half-bridge packages and achieves an efficiency of 98.2% and a power density of 182 W/in 3 .

42 ENGINEERING↗
NASA NTRS2009

Embedded passives emulator FY2003 interim report

The National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program has been evaluating state-of-the-art Embedded Passive Technology for the printed circuit board (PCB) industry for the past several years and has conducted its own testing on embedded passive coupons (resistors and capacitors). This document is a progress report of the work performed through fiscal year 2008 by NASA and the Navy to convert an existing PWB (printed wiring board) design to a design that incorporates embedded passive components. The work is being performed through a memorandum of understanding (MOU) between the NEPP Program (NASA) and the Naval Surface Warfare Center (NSWC) Crane Emerging Critical Interconnect Technology (ECIT) Program. NSWC Crane’s ECIT Program has funding to convert two PCB designs from the military and aerospace industry to a PCB design with embedded passives. ECIT will provide a design team that will take a well characterized design and convert it to an embedded design. They will also provide electrical modeling and layout expertise as well as build the PWB in their facility in Indiana. NEPP, through the Jet Propulsion Laboratory (JPL), will assemble any passives deemed not suitable for embedding and the active components and electrically test the new design to the existing (non-embedded) design

Gerke, David↗
DOE OSTI2022

Development of self-sensing materials for extreme environments based on metamaterial concept and additive manufacturing

Structural health monitoring of an engineered component in a harsh environment is critical for multiple DOE missions including nuclear fuel cycle, subsurface energy production/storage, and energy conversion. Supported by a seeding Laboratory Directed Research & Development (LDRD) project, we have explored a new concept for structural health monitoring by introducing a self-sensing capability into structural components. The concept is based on two recent technological advances: metamaterials and additive manufacturing. A self-sensing capability can be engineered by embedding a metastructure, for example, a sheet of electromagnetic resonators, either metallic or dielectric, into a material component. This embedment can now be realized using 3-D printing. The precise geometry of the embedded metastructure determines how the material interacts with an incident electromagnetic wave. Any change in the structure of the material (e.g., straining, degradation, etc.) would inevitably perturbate the embedded metastructures or metasurface array and therefore alter the electromagnetic response of the material, thus resulting in a frequency shift of a reflection spectrum that can be detected passively and remotely. This new sensing approach eliminates complicated environmental shielding, in-situ power supply, and wire routing that are generally required by the existing active-circuit-based sensors. The work documented in this report has preliminarily demonstrated the feasibility of the proposed concept. The work has established the needed simulation tools and experimental capabilities for future studies.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Methods and apparatus for embedding heating circuits into articles made by additive manufacturing and articles made therefrom

Methods of embedding a heating circuit in an article fabricated by additive manufacturing. The methods describe techniques such as co-extruding a wire, capable of being heated, along with print material in additive manufacturing of the article, and placing a pre-shaped wire capable of being heated between adjacent layers of the article. A third method includes dispensing a wire, capable of being heated, during the additive manufacturing of the article, and compacting the wire into the printed material. An apparatus for embedding a heating circuit in an article fabricated by additive manufacturing. The apparatus contains a wire dispenser, a cutter to control the length of the wire dispensed, and a compactor capable of embedding the wire capable of being heated into the printed material. An article made by additive manufacturing is disclosed. The article contains at least one heating element embedded in the article during the additive manufacturing process.

Barocio, Eduardo↗
DOE OSTI2024

Methods and apparatus for embedding heating circuits into articles made by additive manufacturing and articles made therefrom

Methods of embedding a heating circuit in an article fabricated by additive manufacturing. The methods describe techniques such as co-extruding a wire, capable of being heated, along with print material in additive manufacturing of the article, and placing a pre-shaped wire capable of being heated between adjacent layers of the article. A third method includes dispensing a wire, capable of being heated, during the additive manufacturing of the article, and compacting the wire into the printed material. An apparatus for embedding a heating circuit in an article fabricated by additive manufacturing. The apparatus contains a wire dispenser, a cutter to control the length of the wire dispensed, and a compactor capable of embedding the wire capable of being heated into the printed material. An article made by additive manufacturing is disclosed. The article contains at least one heating element embedded in the article during the additive manufacturing process.

Barocio, Eduardo↗
DOE OSTI2020

Information integrated glass module fabricated by integrated additive and subtractive manufacturing

In this Letter, we report a novel integrated additive and subtractive manufacturing (IASM) method to fabricate an information integrated glass module. After a certain number of glass layers are 3D printed and sintered by direct C O 2 laser irradiation, a microchannel will be fabricated on top of the printed glass by integrated picosecond laser, for intrinsic Fabry–Perot interferometer (IFPI) optical fiber sensor embedment. Then, the glass 3D printing process continues for the realization of bonding between optical fiber and printed glass. Temperature sensing up to 1000°C was demonstrated using the fabricated information integrated module. In addition, the long-term stability of the glass module at 1000°C was conducted. Enhanced sensor structure robustness and harsh temperature sensing capability make this glass module attractive for harsh environment structural health monitoring.

Zhang, Qi (ORCID:0000000268655981)↗
DOE OSTI2021

Carbon aerogels with integrated engineered macroporous architectures for improved mass transport

Carbon aerogels (CAs) combine unique properties including ultra-high surface area, high electrical conductivity, corrosion resistance, and robust mechanical properties making them ideal materials for electrochemical applications. Traditional CA synthesis results in isotropic, random nanoporous networks that work well for applications relying on diffusional mass transport. However, many applications would benefit from integration of engineered macroporous network structures that enable directed pressure-gradient-driven mass transport. In this study, we report on using 3D-printed sacrificial polymeric templates to generate templated CAs (t-CAs) with integrated engineered nonrandom macroporous network structures. Specifically, we used projection micro-stereo-lithography (PμSL) and two-photon polymerization direct laser writing (2PP-DLW) to fabricate millimeter-to-centimeter-sized 3D sacrificial polymeric templates with features ranging from tens of microns (PμSL) to 100s of nanometers (2PP-DLW). T-CAs were fabricated by infiltrating the templates with resorcinol-formaldehyde (RF) precursor solution, followed by carbonization at 1050 °C to simultaneously convert the RF gel to a CA and decompose the 3D-printed template, leaving an embedded templated macroporous network structure behind. X-ray computer tomography confirms integration of the macroporous architecture defined by the template. The templated macroporous architecture improves mass transport in t-CAs compared to traditional bulk CA as demonstrated by more uniform activation and their response in electrochemical cyclic voltammetry and galvanostatic charge-discharge tests.

36 MATERIALS SCIENCE↗
NASA NTRSDate not supplied

Redesign of Carbon Dioxide Removal System for Multifunctional Sorbent Bed Testing

Carbon dioxide removal is a key function of Environmental Control and Life Support System (ECLSS) on the International Space System (ISS). Currently, this system uses pellet beds however they have known issues such as flow channeling and uneven heating. The Multifunction Sorbent (MultiSorb) project is developing 3D-printed zeolite beds with embedded heaters to address these issues. This poster lays out the steps in modifying the Carbon Dioxide Removal and Compression System (CRCS) to test the MultiSorb beds.

MultiSORB↗
NASA NTRS2010

Ethernet-Enabled Power and Communication Module for Embedded Processors

The power and communications module is a printed circuit board (PCB) that has the capability of providing power to an embedded processor and converting Ethernet packets into serial data to transfer to the processor. The purpose of the new design is to address the shortcomings of previous designs, including limited bandwidth and program memory, lack of control over packet processing, and lack of support for timing synchronization. The new design of the module creates a robust serial-to-Ethernet conversion that is powered using the existing Ethernet cable. This innovation has a small form factor that allows it to power processors and transducers with minimal space requirements.

Perotti, Jose↗
DOE OSTI2023

Ballistic characterization of additively manufactured extrusion deposited thermoplastic composite plates

Additive manufacturing (AM) is rapidly emerging in high performance applications such as army ground vehicles, automotive and transportation. However, the response of AM parts/components to extreme loading such as high velocity impacts is less studied. In this work, the performance under ballistic impact of AM panels is evaluated using a medium velocity gas gun, generating projectile velocities up to 400 m/s. The preferential print orientation properties are considered in order to evaluate whether the panels exhibit isotropic or anisotropic behavior under impact. Surface morphology is investigated by milling the beads smooth on samples and comparing the impact on as-printed samples to those that are smoothed. The effect of nickel chromium micron (nichrome) wire embedded in the AM panels (during print) of polycarbonate-carbon fiber (PC-CF) and polycarbonate-glass fiber (PC-GF) are explored. Thermoplastic polyurethane-acrylonitrile butadiene styrene/carbon fiber (TPU-ABS/CF), Acrylonitrile butadiene styrene-carbon-fiber (ABS-CF) AM samples absorbed >50% of the impact energy. The ballistic performance was noted to be in the following order – ABS-CF > TPU-ABS/CF > PC. Scanning electron microscopy (SEM) was conducted to study the interface between the nichrome wire and the polymer-fiber matrix. This work is the first of its kind exploring into the capabilities of AM panels as ballistic materials. This study leads the way for developing AM panels that are easily manufactured and exhibit superior ballistic resistance.

Landrie, Dakota M.↗
NASA NTRS2017

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗